A scanning transmission electron microscope is adapted to acquire high quality precession electron diffraction (PED) patterns by means of separated scanning deflectors and precession deflectors. Magnetic or electrostatic deflectors may be used for scanning and for precession. This enables independent optimization of parameters for each deflection system to achieve a broad operating range simultaneously for both deflection systems.

A method of determining a local electric field and/or a local magnetic field in a sample and/or the dielectric constant of a material and/or the angle between the input and output surfaces of the sample, comprising illumination of the sample by an electron beam in precession mode using an illumination device, generation of a diffraction pattern, determination of the offset of the disk corresponding to the transmitted beam due to the electric field and/or the magnetic field, by comparison of the diffraction pattern and a reference diffraction pattern, determination of a deflection angle of the transmitted beam, and determination of the value of the local electric field and/or the local magnetic field of the sample and/or determination of the dielectric constant of materials and/or determination of the angle between the input and output surfaces of the sample.

There is provided a tilting parameters calculating device for use in a charged particle beam device for making a charged particle beam irradiated to a surface of a sample mounted on a sample stage, the tilting parameters calculating device being configured to calculate tilting parameters, the tilting parameters being input parameters to control a tilting direction and a tilting value of the sample and/or the charged particle beam, the input parameters being necessary to change an incident direction of the charged particle beam with respect to the sample, the tilting parameters calculating device including a tilting parameters calculating unit for calculating the tilting parameters based on information that indicates the incident direction of the charged particle beam with respect to a crystal lying at a selected position on the surface in a state where the incident direction of the charged particle beam with respect to the sample is in a predetermined incident direction, the information being designated on a crystal orientation figure, which is a diagram illustrating the incident direction of the charged particle beam with respect to a crystal coordinate system of the crystal.

There is provided a crystal orientation figure creating device for use in a charged particle beam device for making a charged particle beam irradiated to a surface of a sample, the crystal orientation figure creating device being configured to create a crystal orientation figure, which is a figure representing a crystal coordinate system of a crystal at a position selected on the surface with respect to an incident direction of the charged particle beam, the crystal orientation figure creating device including: an orientation information acquiring unit configured to acquire crystal orientation information with respect to the incident direction at the selected position; an incident direction information acquiring unit configured to acquire information relating to an incident direction of the charged particle beam with respect to the sample; and a crystal orientation figure creating unit configured to create a crystal orientation figure in a changed incident direction at the selected position, based on the crystal orientation information acquired by the orientation information acquiring unit, and the information relating to the incident direction at the time when the crystal orientation information is acquired and the information relating to the changed incident direction, acquired by the incident direction information acquiring unit.

Techniques for high throughput electron channeling contrast imaging (ECCI) by varying electron beam energy are provided. In one aspect, a method for ECCI of a crystalline wafer includes: placing the crystalline wafer under an electron microscope having an angle of less than 90 relative to a surface of the crystalline wafer; generating an electron beam, by the electron microscope, incident on the crystalline wafer; varying an accelerating voltage of the electron microscope to access a channeling condition of the crystalline wafer; and obtaining an image of the crystalline wafer. A system for ECCI is also provided.

The invention relates to a method 3D defect characterization of crystalline samples in a scanning type electron microscope. The method comprises Irradiating a sample provided on a stage, selecting one set of crystal lattice planes of the sample and orienting said set to a first Bragg condition with respect to a primary electron beam impinging on said sample, and obtaining Electron Channeling Contrast Image for an area of interest on the sample. The method is characterized by performing, at least once, the steps of orienting said selected set of crystal lattice planes to a further Bragg condition by at least tilting the sample stage with the sample by a user-selected angle about a first tilt axis, and obtaining by Electron Channeling Contrast Image for a further area of interest.

A method for automatically aligning a scanning tunneling electron microscope (STEM) for acquiring precession electron diffraction (PED) mapping data includes the generation of an incident electron beam aligned with a STEM optic axis and focused on a sample region. A non-inclined signal is acquired of the spatial distribution from the sample region, by scanning the aligned incident beam across multiple discrete locations and acquiring a signal associated with each location. The method can further include the inclination of the incident electron beam to a fixed inclination angle relative to the optic axis and then acquiring an inclined signal spatial distribution from the sample region by scanning the inclined incident beam across the multiple discrete locations while applying a cyclic azimuthal scanning protocol to the inclined beam and acquiring a signal associated with each location. An azimuthal spatial alignment correction is determined by comparing the non-inclined and inclined signal spatial distributions.

Apparatus include a reflector positioned adjacent to a sample location that is situated to receive a charged particle beam (CPB) along a CPB axis from a CPB focusing assembly so that the reflector is situated to receive light emitted from a sample at the sample location based on a CPB-sample interaction or a photon-sample interaction and to direct the light to a photodetector, and a steering electrode situated adjacent to the reflector so as to direct secondary charged particles emitted from the sample based on the CPB-sample interaction away from the reflector and CPB axis. Methods and systems are also disclosed.

Continuous and automatic acquisition of electron beam holograms is made possible by using a sample holding mechanism that includes a sample end region that has a linear shape that is suited for electron beam holography, separates a thin-film rectangular window with an extreme-thin support film that supports a sample being disposed and a rectangular hole that has a linear-shaped edge and through which a reference wave is transmitted from each other, and configures a part of a layer that is thicker than the support film.

A scanning transmission electron microscope is adapted to acquire high quality precession electron diffraction (PED) patterns by means of separated scanning deflectors and precession deflectors. Magnetic or electrostatic deflectors may be used for scanning and for precession. This enables independent optimization of parameters for each deflection system to achieve a broad operating range simultaneously for both deflection systems.