A plasma chamber (11) for coating a substrate with a polymer layer, the plasma chamber includes a first electrode set (14) and a second electrode set (14), the first and second electrode sets are arranged either side of a sample chamber for receiving a substrate, wherein the first and second electrode sets include plural electrode layers (141, 142) and wherein each electrode set includes plural radiofrequency electrode layers or plural ground electrode layers for coating polymer to each surface of a substrate.

A pretreatment assembly includes a product support assembly and a pretreatment device. The product support assembly includes a primary support assembly, a primary drive assembly, a number of secondary support assemblies, and a secondary drive assembly. The primary drive assembly is operatively coupled to the primary support assembly. The primary drive assembly imparts a generally constant motion to the primary support assembly. Each secondary support assembly is structured to support a number of work pieces. Each secondary support assembly is movably coupled to the primary support assembly. The secondary drive assembly is operatively coupled to each secondary support assembly. The secondary drive assembly selectively imparts a motion to each secondary support assembly. The pretreatment device is disposed adjacent the product support assembly.

A treatment device for treating a lens included in an operational device, is disclosed. The Device may include a first segmented electrode, comprising at least two segments electrically isolated from one another, located in proximity to a first surface of the lens, wherein the first surface is to be treated by the treatment device; at least one second electrode; a distributor electrically associated with the first segmented electrode and with the at least one second electrode, and configured to distribute RF energy from a single RF generator to each of the segments of the segmented electrode separately; an RF generator for separately providing RF energy to the segments of the at least one first electrode and the at least one second electrode in an amount sufficient to generate plasma on at least a portion of the first surface of the lens, and a controller functionally associated with the distributor.

A method and a device are provided for homogeneously coating surfaces of 3D substrates in a vacuum chamber which has a sputtering source, such as a planar source or a tube or double-tube source, wherein individual substrates, with a curved substrate surface directed toward the sputtering source, are able to be moved past said source in a translational manner. The sputtering source is fastened to a chamber wall within a vacuum chamber so as to have two degrees of freedom such that the sputtering source is able to be set both in terms of its spacing to a surface to be coated of a substrate, which is moved past in front of said sputtering source in a translational manner, and with respect to the surface normal of the surface to be coated proceeding from a fixed point such that the surface normal deviation is 0 at all times.

Apparatus for treating the surface of objects with plasma, having: an enclosure; a means for placing this enclosure under vacuum; a zone for storing objects to be treated, which is called the upstream storing zone; a zone for storing treated objects, which is called the downstream storing zone; at least two plasma treatment chambers having a means for injecting an active gas mixture, a means for creating an electrical discharge and a means for confining the plasma to the volume inside the chamber; and a means for transferring between the storing zones and the chambers, characterized in that the transferring means are conveying means defining a conveying direction, and in that the various chambers are placed one behind the other, in the conveying direction, and in that the atmospheres of the various plasma treatment chambers are not hermetically sealed off from one another.

An apparatus includes a deposition chamber housing that accommodates a growth substrate, a supply nozzle to supply a deposition gas for forming a target large-size substrate on the growth substrate into the deposition chamber housing, a susceptor to support the growth substrate and expose a rear surface of the growth substrate to an etch gas, and an inner liner connected to the susceptor. The inner liner is to isolate the etch gas from the deposition gas and guide the etch gas toward the rear surface of the growth substrate. The susceptor includes a center hole that exposes the rear surface of the growth substrate and a support protrusion supporting the growth substrate, the support protrusion protruding toward the center of the center hole from an inner sidewall of the susceptor defining the center hole.

A method for pre-treating a catheter prior to using the catheter in a medical procedure, and a related apparatus, are provided. The method comprises exposing, in a plasma chamber positioned in a medical care center, and under sterile conditions, intraluminal surfaces and extraluminal surfaces of the catheter to plasma. The plasma is electromagnetically-generated adjacently to the intraluminal surfaces and extraluminal surfaces, thereby rendering, at least temporarily, the intraluminal surfaces and extraluminal surfaces of the catheter hydrophilic.

An article has a cavity defined by an inner surface, the cavity having a size such that a largest sphere placeable in the cavity has a diameter of less than 7 cm and a smallest sphere placeable in the cavity has a diameter of 0.5 mm; and a hard coating on the inner surface, the hard coating having a hardness between 18 to 100 GPa, the hard coating distributed on the inner surface such that a ratio of a coating thickness at a first region of the hard coating to that at a second region of the hard coating ranges from 0.75 to 1.33.

A manufacturing process of an element chip comprises steps of preparing a substrate including dicing regions and element regions, attaching a holding sheet held on a frame with a die attach film in between, forming a protective film covering the substrate, forming a plurality of grooves in the protective film along the dicing regions, plasma-etching the substrate to expose the die attach film and then die attach film along the dicing regions, and picking up each of the element chips along with the separated die attach film away from the holding sheet, wherein the die attach film has an area greater than that of the substrate, and wherein the protective film includes a first covering portion covering the substrate and a second covering portion covering at least a portion of the die attach film that extends beyond an outer edge of the substrate.

Disclosed are apparatus and methods for plasma processing on optical surfaces for anti-reflection (AR) treatments. The present disclosure enables efficient AR treatments and high performance of optical characters of materials having such AR coating. Narrow Gap Plasma Etching and Hollow Cathode Plasma Etching processes are disclosed according to some embodiment of the present invention. In some embodiments, the apparatus and methods are in combination of DC Bias Control to control physical (ion) bombardment and environment of the chamber (pressure and electric power) more closely, thus to control the processing more effectively.