H01J43/12

Electron tube module and optical device

An electron tube module includes an electron tube and a casing. The electron tube includes a vacuum container with a light transmitting substrate, a photocathode provided in an inner surface of the light transmitting substrate, an anode, and a prism. The prism includes a first surface bonded to an outer surface of the light transmitting substrate, a second surface inclined with respect to the first surface, and a third surface which further reflects light incident to the photocathode through the prism and the light transmitting substrate and reflected at an interface between the photocathode and a vacuum space so that the light is incident to the photocathode again. The casing includes a ceiling wall provided with an opening. The second surface is parallel to the ceiling wall. At least a part of the second surface is exposed to outside through the opening.

Electron tube module and optical device

An electron tube module includes an electron tube and a casing. The electron tube includes a vacuum container with a light transmitting substrate, a photocathode provided in an inner surface of the light transmitting substrate, an anode, and a prism. The prism includes a first surface bonded to an outer surface of the light transmitting substrate, a second surface inclined with respect to the first surface, and a third surface which further reflects light incident to the photocathode through the prism and the light transmitting substrate and reflected at an interface between the photocathode and a vacuum space so that the light is incident to the photocathode again. The casing includes a ceiling wall provided with an opening. The second surface is parallel to the ceiling wall. At least a part of the second surface is exposed to outside through the opening.

CEM assembly and electron multiplier device

According to an embodiment, in a CEM assembly and the like, it is possible to reduce a size of a voltage supply circuit configured to stabilize a voltage to be applied to a channel electron multiplier. The CEM assembly includes a CEM and a voltage supply circuit. The CEM includes an input electrode, a multiplication channel, and an output electrode. The voltage supply circuit includes a power source unit and a constant voltage generation unit. A potential of an input electrode A is set by an electromotive force generated by the power source unit. The constant voltage generation unit includes a constant voltage supply unit configured to cause voltage drop. A target potential set at an output-side reference node is maintained by the voltage drop of the constant voltage supply unit.

CEM assembly and electron multiplier device

According to an embodiment, in a CEM assembly and the like, it is possible to reduce a size of a voltage supply circuit configured to stabilize a voltage to be applied to a channel electron multiplier. The CEM assembly includes a CEM and a voltage supply circuit. The CEM includes an input electrode, a multiplication channel, and an output electrode. The voltage supply circuit includes a power source unit and a constant voltage generation unit. A potential of an input electrode A is set by an electromotive force generated by the power source unit. The constant voltage generation unit includes a constant voltage supply unit configured to cause voltage drop. A target potential set at an output-side reference node is maintained by the voltage drop of the constant voltage supply unit.

CEM ASSEMBLY AND ELECTRON MULTIPLIER DEVICE
20200135439 · 2020-04-30 · ·

According to an embodiment, in a CEM assembly and the like, it is possible to reduce a size of a voltage supply circuit configured to stabilize a voltage to be applied to a channel electron multiplier. The CEM assembly includes a CEM and a voltage supply circuit. The CEM includes an input electrode, a multiplication channel, and an output electrode. The voltage supply circuit includes a power source unit and a constant voltage generation unit. A potential of an input electrode A is set by an electromotive force generated by the power source unit. The constant voltage generation unit includes a constant voltage supply unit configured to cause voltage drop. A target potential set at an output-side reference node is maintained by the voltage drop of the constant voltage supply unit.

CEM ASSEMBLY AND ELECTRON MULTIPLIER DEVICE
20200135439 · 2020-04-30 · ·

According to an embodiment, in a CEM assembly and the like, it is possible to reduce a size of a voltage supply circuit configured to stabilize a voltage to be applied to a channel electron multiplier. The CEM assembly includes a CEM and a voltage supply circuit. The CEM includes an input electrode, a multiplication channel, and an output electrode. The voltage supply circuit includes a power source unit and a constant voltage generation unit. A potential of an input electrode A is set by an electromotive force generated by the power source unit. The constant voltage generation unit includes a constant voltage supply unit configured to cause voltage drop. A target potential set at an output-side reference node is maintained by the voltage drop of the constant voltage supply unit.

Electron multipliers having improved gain stability

The present invention relates to electron multiplier apparatus of the type used in ion detectors. In one form, the invention is an electron multiplier having two or more electron emissive surfaces, each having a different composition so as to together limit or overcome an acute gain effect on the electron multiplier due to the exposure of the two or more electron emissive surfaces to water molecules. Alternatively, the multiplier may have a single electron emissive surface of mixed composition comprising a first composition component and a second composition component so as to together limit or overcome an acute gain effect on the electron multiplier due to the exposure of the electron emissive surface to water molecules.

Electron multipliers having improved gain stability

The present invention relates to electron multiplier apparatus of the type used in ion detectors. In one form, the invention is an electron multiplier having two or more electron emissive surfaces, each having a different composition so as to together limit or overcome an acute gain effect on the electron multiplier due to the exposure of the two or more electron emissive surfaces to water molecules. Alternatively, the multiplier may have a single electron emissive surface of mixed composition comprising a first composition component and a second composition component so as to together limit or overcome an acute gain effect on the electron multiplier due to the exposure of the electron emissive surface to water molecules.

Microchannel plate and method of making the microchannel plate with metal contacts selectively formed on one side of channel openings

A night vision system, a microchannel plate (MCP), and a planetary deposition system and methodology are provided for selectively depositing an electrode contact metal on one side of MCP channel openings. One or more MCPs can be releasably secured to a face of a platter that rotates about its central platter axis. The rotating platter can be tilted on a rotating ring fixture surrounding an evaporative source of contact metal. Therefore, the rotating platter further rotates so that it orbits around the evaporative source of contact metal. A mask with a variable size mask opening is arranged between the rotating platter and the evaporative source. While the mask orbits around the evaporative source with the rotating platter, the mask does not rotate along its own axis as does the rotating platter.

Microchannel plate and method of making the microchannel plate with metal contacts selectively formed on one side of channel openings

A night vision system, a microchannel plate (MCP), and a planetary deposition system and methodology are provided for selectively depositing an electrode contact metal on one side of MCP channel openings. One or more MCPs can be releasably secured to a face of a platter that rotates about its central platter axis. The rotating platter can be tilted on a rotating ring fixture surrounding an evaporative source of contact metal. Therefore, the rotating platter further rotates so that it orbits around the evaporative source of contact metal. A mask with a variable size mask opening is arranged between the rotating platter and the evaporative source. While the mask orbits around the evaporative source with the rotating platter, the mask does not rotate along its own axis as does the rotating platter.