To provide a charged particle beam device including a booster electrode and an object lens that generates a magnetic field in a vicinity of a sample, and capable of preventing ion discharge, an insulator is disposed between a magnetic field lens and the booster electrode. A tip of the insulator protrudes to a tip side of an upper magnetic path from a tip of a lower magnetic path of the magnetic field lens. The tip on a lower side of the insulator is above the lower magnetic path, and a non-magnetic metal electrode is embedded between the upper magnetic path and the lower magnetic path.

Embodiments of the present disclosure include systems, methods, algorithms, and non-transitory media storing computer-readable instructions for charged particle imaging and microanalysis. A charged particle beam system can include an objective lens assembly, defining an aperture collocated with a first axis. The system can include a bifurcated acceleration tube. The acceleration tube can include a primary segment, a secondary segment, intersecting the primary segment, the secondary segment being oriented at an angle, a, relative to the first axis, and a common segment, disposed at least partially in the aperture. The system can include a separator. The separator can include one or more charged-particle optical elements disposed in the common segment and configured to apply a deflection force to electrons having a negative velocity in a first direction. The deflection force can redirect the electrons toward a second direction substantially aligned with a second axis.

A plasma processing apparatus comprising: a plasma processing chamber; a substrate support; and a baffle structure to surround the substrate support. The baffle structure includes an upper baffle plate having a plurality of first openings, each of the plurality of first openings having a first width, and a lower baffle plate having a plurality of second openings, each of the plurality of second openings having an upper opening portion and a lower opening portion. A liner structure surrounds a plasma processing space disposed above the substrate support, and includes an inner cylindrical liner and an outer cylindrical liner. The inner cylindrical liner has a plurality of third openings, each of the plurality of third openings having a fourth width. The outer cylindrical liner has a plurality of fourth openings, each of the plurality of fourth openings having an inner opening portion and an outer opening portion.