An immersion objective lens is configured below a stage such that multiple detectors can be configured above sample for large beam current application, particularly for defect inspection. Central pole piece of the immersion objective lens thus can be provided that a magnetic monopole-like field can be provided for electron beam. Auger electron detector thus can be configured to analyze materials of sample in the defect inspection.

A scanning electron microscope with a composite detection system and a specimen detection method. The scanning electron microscope includes a composite objective lens system including an immersion magnetic lens and an electro lens, configured to focus an initial electron beam to a specimen to form a convergent beam spot; a composite detection system located in the composite objective lens system; and a detection signal amplification and analysis system. A magnetic field of the immersion magnetic lens is immersed in the specimen; the electro lens is configured to decelerate the initial electron beam and focus the initial electron beam onto the specimen, and separate BSEs from a transmission path of an X-ray; the composite detection system is located below an inner pole piece of the immersion magnetic lens, is located above the control electrode, and includes an annular BSE detector and an annular X-ray detector that have a same axis center.

A multiple-electron-beam irradiation apparatus includes a first electrostatic lens, configured using the substrate used as a bias electrode by being applied with a negative potential, a control electrode to which a control potential is applied and a ground electrode to which a ground potential is applied, configured to provide dynamic focusing of the multiple electron beams onto the substrate, in accordance with change of the height position of the surface of the substrate, by generating an electrostatic field, wherein the control electrode is disposed on an upstream side of a maximum magnetic field of the lens magnetic field of the first electromagnetic lens with respect to a direction of a trajectory central axis of the multiple electron beams, and a ground electrode is disposed on an upstream side of the control electrode with respect to the direction of the trajectory central axis.

Variable multi-beam charged particle devices for inspection of a sample include a multi-beam source that produces a plurality of charged particle beamlets, an objective lens, a sample holder for holding the sample between the objective lens and the multi-beam source, and a focusing column that directs the plurality of charged particle beamlets so that they are incident upon the sample. The focusing column directs the plurality of charged beams such that there are one or more crossovers of the plurality of charged particle beamlets, where each crossover corresponds to a point where the plurality of charged particle beamlets pass through a common location. The variable multi-beam charged particle devices also include a variable aperture that is configured to vary the current of the plurality of charged particle beamlets, and which is located at a final crossover of the one or more crossovers that is most proximate to the sample.

The present invention provides a charged particle beam apparatus capable of efficiently reducing the effect of a residual magnetic field when SEM observation is performed. The charged particle beam apparatus according to the present invention includes a first mode for passing a direct current to a second coil after turning off a first coil, and a second mode for passing an alternating current to the second coil after turning off the first coil.

An immersion objective lens is configured below a stage such that multiple detectors can be configured above sample for large beam current application, particularly for defect inspection. Central pole piece of the immersion objective lens thus can be provided that a magnetic monopole-like field can be provided for electron beam. Auger electron detector thus can be configured to analyze materials of sample in the defect inspection.

Disclosed are a charged particle beam apparatus wherein the charged particle beam apparatus can efficiently performs finish processing of a sample and acquisition of a high-precision SEM image of a processing surface of the sample in a short time, and a sample processing observation method using the same. The charged particle beam apparatus includes: a gallium ion beam column radiating a gallium ion beam toward a sample to form a cross-section of the sample; an electron beam column having a semi-in-lens type objective lens and radiating an electron beam toward the sample; a gas ion beam column radiating a gas ion beam toward the sample to perform finish processing of the cross-section of the sample, wherein the gas ion beam has a beam diameter larger than a maximum diameter of the cross-section of the sample.

A multiple-electron-beam irradiation apparatus includes a first electrostatic lens, configured using the substrate used as a bias electrode by being applied with a negative potential, a control electrode to which a control potential is applied and a ground electrode to which a ground potential is applied, configured to provide dynamic focusing of the multiple electron beams onto the substrate, in accordance with change of the height position of the surface of the substrate, by generating an electrostatic field, wherein the control electrode is disposed on an upstream side of a maximum magnetic field of the lens magnetic field of the first electromagnetic lens with respect to a direction of a trajectory central axis of the multiple electron beams, and a ground electrode is disposed on an upstream side of the control electrode with respect to the direction of the trajectory central axis.

A scanning electron microscope device for a sample to be detected and an electron beam inspection apparatus are provided, the scanning electron microscope device being configured to project electron beam to a surface of the sample to generate backscattered electrons and secondary electrons, and comprising: an electron beam source, a deflection mechanism, and an objective lens assembly. The deflection mechanism comprises a first deflector located downstream the electron beam source and a second deflector located downstream the first deflector. The objective lens assembly comprises: an excitation coil; and a magnetic yoke, formed by a magnetizer material as a housing which opens towards the sample and comprising a hollow body defining an internal chamber where the excitation coil is accommodated, and at least one inclined portion extending inward from the hollow body at an angle with reference to the hollow body and directing towards the optical axis, with an end of the at least one inclined portion being formed into a pole piece. The deflection mechanism further comprises a third deflector located between the second deflector and the objective lens assembly and disposed in an opening delimited and circumscribed by the pole piece, and each of the first deflector, the second deflector and the third deflector is an electrostatic deflector.

Disclosed are a charged particle beam apparatus wherein the charged particle beam apparatus can efficiently performs finish processing of a sample and acquisition of a high-precision SEM image of a processing surface of the sample in a short time, and a sample processing observation method using the same.

The charged particle beam apparatus includes: a gallium ion beam column radiating a gallium ion beam toward a sample to form a cross-section of the sample; an electron beam column having a semi-in-lens type objective lens and radiating an electron beam toward the sample; a gas ion beam column radiating a gas ion beam toward the sample to perform finish processing of the cross-section of the sample, wherein the gas ion beam has a beam diameter larger than a maximum diameter of the cross-section of the sample.