A scanning electron microscope device for a sample to be detected and an electron beam inspection apparatus are provided, the scanning electron microscope device being configured to project electron beam to a surface of the sample to generate backscattered electrons and secondary electrons, and comprising: an electron beam source, a deflection mechanism, and an objective lens assembly. The deflection mechanism comprises a first deflector located downstream the electron beam source and a second deflector located downstream the first deflector. The objective lens assembly comprises: an excitation coil; and a magnetic yoke, formed by a magnetizer material as a housing which opens towards the sample and comprising a hollow body defining an internal chamber where the excitation coil is accommodated, and at least one inclined portion extending inward from the hollow body at an angle with reference to the hollow body and directing towards the optical axis, with an end of the at least one inclined portion being formed into a pole piece. The deflection mechanism further comprises a compensation electrode, which is located between the pole piece and the surface of the sample and is configured to adjust a focusing position of the electron beam at which the electron beam is focused, in a condition of excitation thereof with a voltage being applied thereon, by adjusting the voltage.

Compact correctors for correcting spherical aberrations of a particle-optical lens in a charged particle microscope system, according to the present disclosure a strong hexapole configured to generate a strong hexapole field when a voltage is applied to it, and a weak hexapole positioned between the strong hexapole and a sample. The strong hexapole is positioned such that the crossover of a charged particle beam of the charged particle system does not pass through the center of the strong hexapole, such that the strong hexapole field applies at least an A2 aberration and a D4 aberration to the charged particle beam. The weak hexapole is further positioned or otherwise configured such that, when a voltage is applied to the weak hexapole it generates a weak hexapole field that applies at least a combination A2 aberration and a combination D4 aberration to the charged particle beam of the charged particle microscopy system.

The present invention is directed to an electrode component with at least two electrodes or a multipole component as generally known in the art. Each of the electrodes can be provided with a beam neighboring section or end section forming the free electrodes. This section is the section exposed to high voltages, i.e. more than 10 KV, and is intended to nevertheless work very reliable and precise with respect to the guidance and/or controlling of a beam of a charged particle beam in a microscope or lithographic apparatus. This neighboring section are positioned in the vicinity or close to a charged particle beam or even facing it. This bears the preferred advantage that high voltages can be generated by the electrodes or to the electrode component and they can withstand those high voltages. This assists in a better guidance and/or controlling of the charged beam, such as for compensating aberration etc. The beam neighboring section can have a surface configured to face the beam. This neighboring section or surface are fabricated with absolute dimensional tolerances less than a desired maximum absolute dimensional tolerance wherein the desired maximum absolute dimensional tolerance is based at least on a maximum voltage to be applied to the electrode. With such a precisely fabricated surface, a more precise and/or efficient field can be generated being able to control the charged particle beam more precisely and efficiently.

A deflector for multiple electron beams includes a first electrode substrate, second to fourth electrode substrates disposed in order in parallel to each other in a first same plane which is orthogonal to the substrate surface of the first electrode substrate, a fifth electrode substrate disposed opposite to the first electrode substrate, and sixth to eighth electrode substrates disposed in order in parallel to each other in a second same plane such that they are opposite to the second to fourth electrode substrates, wherein the first to eighth electrode substrates are disposed such that they surround a space through which multiple electron beams pass.

An improved source conversion unit of a charged particle beam apparatus is disclosed. The source conversion unit comprises a first micro-structure array including a plurality of micro-structures. The plurality of micro-structures is grouped into one or more groups. Corresponding electrodes of micro-structures in one group are electrically connected and driven by a driver to influence a corresponding group of beamlets. The micro-structures in one group may be single-pole structures or multi-pole structures. The micro-structures in one group have same or substantially same radial shifts from an optical axis of the apparatus. The micro-structures in one group have same or substantially same orientation angles with respect to their radial shift directions.

A multi-beam apparatus for observing a sample with high resolution and high throughput is proposed. In the apparatus, a source-conversion unit forms plural and parallel images of one single electron source by deflecting plural beamlets of a parallel primary-electron beam therefrom, and one objective lens focuses the plural deflected beamlets onto a sample surface and forms plural probe spots thereon. A movable condenser lens is used to collimate the primary-electron beam and vary the currents of the plural probe spots, a pre-beamlet-forming means weakens the Coulomb effect of the primary-electron beam, and the source-conversion unit minimizes the sizes of the plural probe spots by minimizing and compensating the off-axis aberrations of the objective lens and condenser lens.

Provided is a method of adjusting an electron-beam irradiated area in an electron beam irradiation apparatus that deflects an electron beam with a deflector to irradiate an object with the electron beam, the method including: emitting an electron beam while changing an irradiation position on an adjustment plate by controlling the deflector in accordance with an electron beam irradiation recipe, the adjustment plate detecting a current corresponding to the emitted electron beam; acquiring a current value detected from the adjustment plate; forming image data corresponding to the acquired current value; determining whether the electron-beam irradiated area is appropriate based on the formed image data; and updating the electron beam irradiation recipe when the electron-beam irradiated area is determined not to be appropriate.

An aberration corrector includes: a first multipole, a second multipole, a third multipole, and a fourth multipole arranged along an optical axis A; a first transfer lens system arranged between the first multipole and the second multipole; a second transfer lens system arranged between the second multipole and the third multipole; and a third transfer lens system arranged between the third multipole and the fourth multipole, wherein each of the first multipole, the second multipole, the third multipole, and the fourth multipole generates a three-fold symmetric field.

A method of adjusting a charged particle optical system in a charged particle beam apparatus provided with the charged particle optical system including an aberration corrector in which multipole elements disposed in three or more stages and transfer optical systems are alternately disposed. The method includes adjusting aberration using at least two of the multipole elements without using at least one of the multipole elements, and adjusting parameters of the charged particle optical system other than aberration using at least one of the transfer optical systems that is not disposed between the at least two of the multipole elements used.

A multi-beam apparatus for observing a sample with high resolution and high throughput is proposed. In the apparatus, a source-conversion unit forms plural and parallel images of one single electron source by deflecting plural beamlets of a parallel primary-electron beam therefrom, and one objective lens focuses the plural deflected beamlets onto a sample surface and forms plural probe spots thereon. A movable condenser lens is used to collimate the primary-electron beam and vary the currents of the plural probe spots, a pre-beamlet-forming means weakens the Coulomb effect of the primary-electron beam, and the source-conversion unit minimizes the sizes of the plural probe spots by minimizing and compensating the off-axis aberrations of the objective lens and condenser lens.