A composite charged particle beam apparatus includes a first charged particle beam column that irradiates a thin sample with a first charged particle beam, and a second charged particle beam column that irradiates an irradiation position of the first charged particle beam on the thin sample with a second charged particle beam. A sample holder as a base stage disposed on a sample stage, a motor-driven rotation driving section, a rotation stand rotatable about a flip axis by the driving of the rotation driving section, and a TEM grid that holds the thin sample. The TEM grid is movable within a plane perpendicular to an observation surface of the thin sample together with the rotation stand by being reciprocally driven around the flip axis by the driving section.

Embodiments described herein relate to methods of forming gratings with different slant angles on a substrate and forming gratings with different slant angles on successive substrates using angled etch systems. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle relative to a surface normal of the substrates and form gratings in the grating material. The substrates are rotated about an axis of the platen resulting in rotation angles ϕ between the ion beam and a surface normal of the gratings. The gratings have slant angles relative to the surface normal of the substrates. The rotation angles ϕ selected by an equation ϕ=cos.sup.−1 (tan()/tan()).

To provide a charged particle beam apparatus. The charged particle beam apparatus includes: a stage on which a sample is placed; a cleaner configured to remove a contaminant on the sample; and a stage control unit configured to adjust a relative positional relationship between the cleaner and the sample by moving the stage during use of the cleaner.

The invention provides an ion milling device capable of cross-sectional milling on an all-solid-state battery while reducing an occurrence of a short circuit due to a redeposition film. The ion milling device includes a sample stage 5 on which a sample 8 is placed, an ion source 1 configured to emit an unfocused ion beam 4 toward the sample, a stage controller 6 configured to cause the sample stage to perform a swing operation centered on a swing axis S.sub.0 set to be orthogonal to an ion beam center B.sub.0 of the ion beam, and cause the sample stage to perform a sliding operation along a line of intersection between a plane (YZ plane) including the ion beam center and perpendicularly intersecting the swing axis and a sample placement surface of the sample stage, in which the stage controller causes, in a first mode operation, the sample stage to perform the swing operation and the ion source to emit the ion beam to mill the sample, and causes in a second mode operation, the sample stage to perform the sliding operation and the ion source to emit the ion beam to remove sputter particles adhered again to the sample in the first mode operation.

A charged particle beam apparatus includes a tilt mechanism that tilts a specimen, a detector that detects an electromagnetic wave emitted from the specimen, a table storage unit that stores a table in which tilt angle information on a tilt angle of the specimen and detection solid-angle information on the detection solid angle of the detector are associated with each other, a tilt control unit that controls the tilt mechanism, and a detection-solid-angle information acquisition unit that acquires the tilt angle information from the tilt control unit and acquires the detection solid-angle information with reference to the table.

Apparatus for a multi-source ion beam etching (IBE) system are provided herein. In some embodiments, a multi-source IBE system includes a multi-source lid comprising a multi-source adaptor and a lower chamber adaptor, a plurality of IBE sources coupled to the multi-source adaptor, a rotary shield assembly coupled to a shield motor mechanism configured to rotate the rotary shield, wherein the shield motor mechanism is coupled to a top portion of the multi-source lid, and wherein the rotary shield includes a body that has one IBE source opening formed through the body, and at least one beam conduit that engages the one IBE source opening in the rotary shield on one end, and engages the bottom portion of the IBE sources on the opposite end of the beam conduit.

A system and method that is capable of measuring the incident angle of an ion beam, especially an ion beam comprising heavier ions, is disclosed. In one embodiment, X-rays, rather than ions, are used to determine the channeling direction. In another embodiment, the workpiece is constructed, at least in part, of a material having a high molecular weight such that heaver ion beams can be measured. Further, in another embodiment, the parameters of the ion beam are measured across an entirety of the beam, allowing components of the ion implantation system to be further tuned to create a more uniform beam.

There is provided a sample holder which is for use in a charged particle beam system and which can prevent damage to a sample stage during transportation of a cartridge. The sample holder includes: the cartridge having the sample stage for holding a sample therein; and a holder base having a mounting portion to which the cartridge can be mounted. The cartridge has: a tilt mechanism for tilting the sample stage; and a lock lever which, when the cartridge has been taken out from the mounting portion, makes contact with the sample stage and limits tilt of the stage.

There is provided a sample holder capable of reducing positional deviation of a cartridge in the heightwise direction of a sample. The sample holder includes the cartridge and a holder base having a mounting portion for the cartridge. The mounting portion includes a placement surface, a first tilted surface, and a rotary drive mechanism for imparting a rotary force to the cartridge. The cartridge includes an opposing first tilted surface opposite to the first tilted surface of the mounting portion. As the rotary drive mechanism imparts the rotary force to the cartridge, the first tilted surface of the cartridge is pressed against the first tilted surface of the mounting portion, whereby the cartridge is pressed against the placement surface.

A specimen machining device includes an ion source which irradiates a specimen with an ion beam, a first rotating body (specimen holder) that holds the specimen and is rotatable about a first axis serving as a rotation axis, and a second rotating body on which the first rotating body is disposed and which is rotatable about a second axis serving as a rotation axis different from the first axis. The specimen machining device irradiates the specimen with the ion beam while moving the specimen by the rotation of the first rotating body and the rotation of the second rotating body.