There is provided a detection device for detecting position misalignment of an object to be transferred with respect to a transfer mechanism. The detection device comprises: an image sensor configured to capture images including the transfer mechanism and the object to be transferred which is held by the transfer mechanism; and a calculation unit configured to calculate an amount of position misalignment including misalignment in a horizontal direction and a rotational direction of the object to be transferred based on the images captured by the image sensor.

Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving. The movement may be due to vibrations in the system and/or movement of a movable stage on which the NCEM-enabled cell vehicle is positioned. Position information for an electron beam column producing the electron beam performing the NCEMs and/or for the moving stage may be used to align the electron beam with targets on the NCEM-enabled cell vehicle while it is moving.

An optical system used in a charged particle beam inspection system. The optical system includes one or more optical lenses, and a compensation lens configured to compensate a drift of a focal length of a combination of the one or more optical lenses from a first medium to a second medium.

First shape data representing a three-dimensional shape of a sample unit including a sample is generated based on a result of three-dimensional shape measurement of the sample. Second shape data representing a three-dimensional shape of a structure which exists in a sample chamber is generated. Movement of the sample unit is controlled based on the first shape data and the second shape data such that collision of the sample unit with the structure does not occur.

A wafer inspection system includes a controller in communication with an electron-beam inspection tool. The controller includes circuitry to: acquire, via an optical imaging tool, coordinates of defects on a sample; set a Field of View (FoV) of the electron-beam inspection tool to a first size to locate a subset of the defects; determine a position of each defect of the subset of the defects based on inspection data generated by the electron-beam inspection tool during a scanning of the sample; adjust the coordinates of the defects based on the determined positions of the subset of the defects; and set the FoV of the electron-beam inspection tool to a second size to locate additional defects based on the adjusted coordinates.

Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving. The movement may be due to vibrations in the system and/or movement of a movable stage on which the NCEM-enabled cell vehicle is positioned. Position information for an electron beam column producing the electron beam performing the NCEMs and/or for the moving stage may be used to align the electron beam with targets on the NCEM-enabled cell vehicle while it is moving.

A height measuring device includes a light source that emits light in a direction oblique to a top surface of a specimen, a slit that shapes the light from the light source to form a slit image on the specimen, an imaging element that detects reflected light reflected by the specimen, and an arithmetic unit. The arithmetic unit: identifies a slit image of the reflected light reflected by the top surface of the specimen from among a plurality of slit images based on respective positions of the plurality of slit images on a detection surface of the imaging element; and determines the height of the top surface of the specimen based on the position of the slit image of the reflected light reflected by the top surface of the specimen on the detection surface.

A charged particle beam device according to the present invention includes a first movement table and a second movement table disposed above the first movement table, measures a first relative position between a sample chamber and the first movement table, a second relative position between the sample chamber and the second movement table, and a third relative position between a lens barrel and a sample, and corrects a relative position between the first movement table and the second movement table according to the first relative position and the second relative position.

A stage device includes: a sample installation unit in which a positioning target is installed; a scale plate used to measure displacement of the sample installation unit in a vertical direction; and a lower axis table configured to support the scale plate. A free support unit is provided between the scale plate and the lower axis table.

The present disclosure provides a substrate processing apparatus including at least one input/output chamber. The load lock device includes a base, a guide rail, a platform and an optical measuring module. The guide rail is connected to the base. The platform, carrying a cassette for holding a batch of spaced substrates, is movably disposed on the guide rail. The optical measuring module is configured to acquire an actual moving distance traveled by the platform along the guide rail based on at least one optical signal reflected from the platform.