The device for observing permeation and diffusion path of observation target gas includes: a scanning electron microscope 15; an observation target ion detecting unit 20; an observation target gas supply unit 19; a diaphragm-type sample holder 12, to which the sample is mounted in attachable/detachable state, as a diaphragm dividing between the analysis chamber 11 and the observation target gas pipe 14; and a control unit 50. The control unit acquires a SEM image and at the same time detects the observation target gas, which diffuses within the sample and is discharged to the surface of the sample, by electron stimulated desorption, in a state where stress is applied to the sample due to differential pressure generated between the analysis chamber and the observation target gas pipe by supplying the observation target gas, and obtains an ESD image of the observation target ions.

The present disclosure provides a device and method for measuring a correlation between fatigue performance and a microstructure of a one-dimensional (1D) nanomaterial in situ in a transmission electron microscope (TEM), belongs to the technical field of in-situ testing and characterization of microstructures of nanomaterials. The device includes a chip part, a supporting part, and a control circuit. The supporting part is a bracket and a cable disposed on a transmission sample holder, and the circuit part consists of cables connected to the chip and a power supply capable of applying different waveforms, variable voltages, and variable frequencies. This design breaks through a traditional mechanical stress-driven fatigue performance test method, and achieves controllable adjustment of different amplitudes and cycles by using an electric field formed by a voltage and adjusting a voltage size and frequency, such that the 1D nanomaterial vibrates in the electric field to achieve fatigue performance testing.

A method of processing a substrate in a processing chamber that includes a primary volume and an auxiliary volume that can be environmentally sealed from the primary volume, the method including: transferring the substrate into the primary volume of the processing chamber and onto an upper surface of a substrate holder while the primary volume is at a vacuum pressure, wherein the substrate holder comprises one or more vacuum channels disposed at the upper surface and one or more electrodes disposed within the substrate holder proximate to the upper surface; moving the substrate holder within the processing chamber such that the substrate is moved from the primary volume to the auxiliary volume; sealing the auxiliary volume from the primary volume and increasing the pressure within the auxiliary volume; while the substrate is within the auxiliary volume, clamping and flattening the substrate to the substrate holder by applying a vacuum to the one or more vacuum channels; while the substrate is within the auxiliary volume and clamped to the substrate holder via the one or more vacuum channels, applying a voltage to the one or more electrodes to further clamp the substrate to the substrate holder with an electrostatic force; and while the substrate is clamped to the substrate holder by the electrostatic force, moving the substrate from the auxiliary volume back into the primary volume and processing the substrate in the primary volume at a vacuum pressure.

A method of processing a substrate is disclosed that comprises: transferring the substrate into a processing chamber and positioning the substrate on an upper surface of a substrate holder in the processing chamber, wherein the substrate holder comprises one or more vacuum channels disposed at the upper surface and one or more electrodes disposed within the substrate holder proximate to the upper surface; while the substrate holder is within the processing chamber, clamping and flattening the substrate to the substrate holder by applying a vacuum to the one or more vacuum channels; while the substrate is clamped to the substrate holder via the one or more vacuum channels, applying a voltage to the one or more electrodes to further clamp the substrate to the substrate holder with an electrostatic force; pumping out the processing chamber to a vacuum pressure while continuing to clamp the substrate to the substrate with the electrostatic force; and while the substrate is clamped to the substrate holder by the electrostatic force, processing the substrate in the processing chamber under vacuum conditions.