A method of measuring a critical dimension (CD) includes forming a plurality of patterns in a substrate, creating first to n-th images, where n is a natural number greater than 1, for first to n-th areas in the substrate, respectively, where the first to n-th areas do not overlap with each other, where each of the first to n-th areas comprising at least some of the plurality of patterns, creating a merged image for the first to n-th images, and measuring a CD for a measurement object from the plurality of patterns using the merged image. The merged image has a higher resolution than each of the first to n-th images.

In a diagnosis apparatus for diagnosing a state of a plasma processing apparatus, prior distribution information including a probability distribution function is previously obtained for each of first sensors by using first sensor values obtained by the first sensors in a first plasma processing apparatus, a probability distribution in each of second sensors corresponding to each of the first sensors is estimated based on the previously obtained prior distribution information and second sensor values obtained by the second sensors in a second plasma processing apparatus different from the first plasma processing apparatus, and a state of the second plasma processing apparatus is diagnosed by using the estimated probability distribution.

A method for operating a multi-beam particle beam microscope includes: scanning a multiplicity of particle beams over an object; directing electron beams emanating from impingement locations of the particle beams at the object onto an electron converter; detecting first signals generated by impinging electrons in the electron converter via a plurality of detection elements of a first detection system during a first time period; detecting second signals generated by impinging electrons in the electron converter via a plurality of detection elements of a second detection system during a second time period; and assigning to the impingement locations the signals which were detected via the detection elements of the first detection system during the first time period, for example on the basis of the detection signals which were detected via the detection elements of the second detection system during the second time period.

To provide a technique capable of measuring high-frequency electrical noise in a charged particle beam device. A charged particle beam device 100 includes an electron source 2 for generating an electron beam EB1, a stage 4 for mounting a sample 10, a detector 5 for detecting secondary electrons EB2 emitted from the sample 10, and a control unit 7 electrically connected to the electron source 2, the stage 4, and the detector 5 and can control the electron source 2, the stage 4, and the detector 5. Here, when the sample 10 is mounted on the stage 4, and a specific portion 11 of the sample 10 is continuously irradiated with the electron beam EB1 from the electron source 2, the control unit 7 can calculate a time-series change in irradiation position of the electron beam EB1 based on an amount of the secondary electrons EB2 emitted from the specific portion 11, and can calculate a feature quantity for a shake of the electron beam EB1 based on the time-series change in irradiation position. Further, the feature quantity includes a frequency spectrum.

There is provided a detection device for detecting position misalignment of an object to be transferred with respect to a transfer mechanism. The detection device comprises: an image sensor configured to capture images including the transfer mechanism and the object to be transferred which is held by the transfer mechanism; and a calculation unit configured to calculate an amount of position misalignment including misalignment in a horizontal direction and a rotational direction of the object to be transferred based on the images captured by the image sensor.

A multi charged particle beam apparatus irradiates a substrate placed on a stage with a multi charged particle beam through an illumination optical system including a plurality of components, and an objective lens successively. In one embodiment, an optical system adjustment method for the multi charged particle beam apparatus includes measuring positional deviation amounts of a plurality of individual beams included in the multi charged particle beam at two or more different heights in an optical axis direction of a measurement surface or an imaging position of the multi charged particle beam, calculating a normalized position difference based on the two or more heights and the positional deviation amounts, the normalized position difference being an illumination system aberration equivalent amount of the illumination optical system, and adjusting a set value for at least one of the plurality of components using a value of the normalized position difference.

Apparatus and methods are disclosed for particle beam focusing, suitable for use in sample preparation or test environments, including SEM-based nanoprobing platforms. With a particle beam incident on a sample surface, stage current is used as an indicator of spot size. By scanning or searching settings of a working distance control, a control value having maximum (or minimum) stage current is used to set the beam waist at the sample surface. Alternatively, minima (or maxima) of reflected current can be used. Stigmator controls can be adjusted similarly to reduce astigmatism. The scan of control settings can be performed concurrently with sweeping the beam across a region of interest on the sample. Curved sweep patterns can be used. Energy measurements can be used as an alternative to current measurement. Applications to a nanoprobing workflow are disclosed.

A substrate processing apparatus includes a vacuum container, a placing part provided inside the vacuum container and having a placing surface on which a substrate is placed, and a ceiling member provided above the placing part. The ceiling member includes a fixed member fixed to the vacuum container, a movable member attached to the fixed member and having a first facing surface facing the placing surface, a spacer sandwiched between the fixed member and the movable member, a first seal member provided between the fixed member and the spacer, a second seal member provided between the movable member and the spacer, and a plurality of adjustment bolts screwed into the fixed member through the movable member.

A method of determining a distortion of a field of view of a scanning electron microscope is described. The method may include: providing a sample including substantially parallel lines extending in a first direction; performing scans across the field of view of the sample along respective scan-trajectories extending in a scan direction; the scan direction being substantially perpendicular to the first direction; detecting a response signal of the sample caused by the scanning of the sample; determining a distance between a first line segment of a line and a second line segment of the line, whereby each of the first line segment and the second line segment are crossed by scan trajectories, based on the response signal; performing the previous step for multiple locations within the field of view; and determining the distortion across the field of view, based on the determined distances at the multiple locations.

Even when the amount of overlay deviation between patterns located in different layers is large, correct measurement of the amount of overlay deviation is stably performed. The charged particle beam device includes a charged particle beam irradiation unit that irradiates a sample with a charged particle beam, a first detection unit that detects secondary electrons from the sample, a second detection unit that detects backscattered electrons from the sample, and an image processing unit that generates a first image including an image of a first pattern located on the surface of the sample based on an output of the first detection unit, and generates a second image including an image of a second pattern located in a lower layer than the surface of the sample based on an output of the second detection unit. A control unit adjusts the position of a measurement area in the first image based on a first template image for the first image, and adjusts the position of a measurement area in the second image based on a second template image for the second image.