This cross-section observation device bombards an object with a charged particle beam to repeatedly expose cross-sections of the object, bombards at least some of the cross-sections from among the plurality of the exposed cross-sections with a charged particle beam to acquire cross-sectional image information describing each of the at least some of the cross-sections, generates for each of these cross-sections a cross-sectional image described by the cross-sectional image information acquired, and generates a three-dimensional image in which the generated cross-sectional images are stacked together. This cross-section observation device displays a first three-dimensional image along with a second three-dimensional image, the first three-dimensional image being a three-dimensional image from the stacking of first cross-sectional images, which are cross-sectional images of the cross-sections described by the corresponding cross-sectional image information acquired on the basis of a first condition, and the second three-dimensional image being a three-dimensional image from the stacking of second cross-sectional images, which are cross-sectional images of the cross-sections described by the corresponding cross-sectional image information acquired on the basis of a second condition.

There is provided a primary beam scanning apparatus capable of producing data having a bit depth higher than the resolution of an analog-to-digital converter. The primary beam scanning apparatus is capable of controlling a scan rate of a primary beam for scanning a specimen. The scanning apparatus includes a detector for detecting signals generated in response to irradiation of the specimen with the primary beam and providing an analog output signal, an analog-to-digital converter for sampling the analog signal and converting it into a digital signal, and an arithmetic section for averaging the digital signal.

The present invention provides apparatuses to inspect small particles on the surface of a sample such as wafer and mask. The apparatuses provide both high detection efficiency and high throughput by forming Dark-field BSE images. The apparatuses can additionally inspect physical and electrical defects on the sample surface by form SE images and Bright-field BSE images simultaneously. The apparatuses can be designed to do single-beam or even multiple single-beam inspection for achieving a high throughput.

A scanning electron microscope includes: a retarding power source configured to apply a retarding voltage to a specimen; a combined objective lens configured to focus the primary beam on a surface of the specimen; an electrostatic deflection system configured to deflect the primary beam to direct the primary beam to each point in a field of view on the surface of the specimen; a first scintillation detector having a first scintillator configured to emit light upon incidence of secondary electrons which have been emitted from the specimen; a Wien filter configured to deflect the secondary electrons in one direction without deflecting the primary beam; and a second scintillation detector having a second scintillator configured to detect the secondary electrons deflected by the Wien filter. The second scintillator has a distal end located away from the axis of the primary beam.

A method prepares a microsample from a volume sample using multiple particle beams. The method includes providing a volume sample in the microscope system, wherein the interior of the volume sample has a sample region of interest, and producing a macrolamella comprising the sample region of interest by removing sample material of the volume sample using one of the particle beams. The method also includes orienting the macrolamella relative to one of the particle beams, and removing sample material of the macrolamella via a beam so that the region of interest is exposed.

A charged particle beam system includes a charged particle source that generates a first charged particle beam and a multi beam generator that generates a plurality of charged particle beamlets from an incoming first charged particle beam. Each individual beamlet is spatially separated from other beamlets. The charged particle beam system also includes an objective lens that focuses incoming charged particle beamlets in a first plane so that a first region in which a first individual beamlet impinges in the first plane is spatially separated from a second region in which a second individual beamlet impinges in the first plane. The charged particle beam system also includes a projection system and a detector system including a plurality of individual detectors. The projection system images interaction products leaving the first region within the first plane due to impinging charged particles onto a first detector and images interaction products leaving the second region in the first plane onto a second detector.

The system described herein relates to an object preparation device for preparing an object in a particle beam apparatus. By way of example, the particle beam apparatus is an electron beam apparatus and/or an ion beam apparatus. The system described herein moreover relates to a particle beam apparatus having such an object preparation device and to a method for operating the particle beam apparatus. The object preparation device may have an object receptacle device for receiving the object, a cutting device and a cutting bevel for cutting the object, wherein the cutting bevel may be arranged at the cutting device. The cutting bevel may lay in a cutting plane. Further, an axis of rotation may lay in the cutting plane. The cutting bevel may be embodied to be rotatable about the axis of rotation.

In accordance with the present invention, there is provided a scanning electron microscope comprising: an electron source; a sample holder for holding a sample to be analysed; a projector; and a first detector. Each of the electron source and the sample holder are arranged upon an optical axis of the scanning electron microscope. The projector is moveable between a first, operational position in which the projector is located along the optical axis downstream of the sample holder and between the sample holder and the first detector, and a second, retracted position in which the projector is located away from the optical axis. There is also provided a method of imaging a sample with the scanning electron microscope.

An apparatus and a method for measuring and monitoring the properties of a fluid, for example, pressure, temperature, and chemical properties, within a sample holder for an electron microscope. The apparatus includes at least one fiber optic sensor used for measuring temperature and/or pressure and/or pH positioned in proximity of the sample.

The system described herein relates to an imaging device for imaging an object in a particle beam apparatus and/or for imaging a structural unit of a particle beam apparatus, and to a particle beam apparatus having such an imaging device. The imaging device has an illumination unit having a first switching state and a second switching state for illuminating the object and/or the structural unit with illumination light, where, in the first switching state, the illumination light comprises only light of a first spectral range and where, in the second switching state, the illumination light comprises only light of a second spectral range. The imaging device has a control unit for switching the illumination unit into the first switching state or into the second switching state, and a camera unit for imaging the object and/or the structural unit.