Patent classifications
H01J2237/2802
Beam trajectory via combination of image shift and hardware alpha tilt
Methods include holding a sample with a movement stage configured to rotate the sample about a rotation axis, directing an imaging beam to a first sample location with the sample at a first rotational position about the rotation axis and detecting a first transmitted imaging beam image, rotating the sample using the movement stage about the rotation axis to a second rotational position, and directing the imaging beam to a second sample location by deflecting the imaging beam in relation to an optical axis of the imaging beam and detecting a second transmitted imaging beam image, wherein the second sample location is spaced apart from the first sample location at least at least in relation to the optical axis. Related systems and apparatus are also disclosed.
SAMPLE STAND AND METHOD FOR MANUFACTURING SAMPLE STAND
A sample stand includes a base portion that is made of a first material and has an arcuate outer edge in a plane having a first direction and a second direction orthogonal to the first direction, a first portion that is provided on an upper portion of the base portion in the second direction and in which a second material is embedded, a second portion that is provided on the upper portion of the base portion in the second direction and in which a third material is embedded, and a sample holding portion on which a sample is to be held. The sample holding portion is provided on the upper portion of the base portion in the second direction, between the first portion and the second portion in a third direction orthogonal to each of the first direction and the second direction.
METHOD FOR TILTING CHARACTERIZATION BY MICROSCOPY
Aspects of the disclosure provide a method of tilting characterization. The method includes measuring a first tilting shift of structures based on a first disposition of the structures. The structures are formed in a vertical direction on a horizontal plane of a product. A second tilting shift of the structures is measured based on a second disposition of the structures. The second disposition is a horizontal flip of the first disposition. A corrected tilting shift is determined based on the first tilting shift and the second tilting shift.
Charged Particle Beam Device and Image Generation Method
A charged particle beam device scans a specimen with a charged particle beam and generates an image based on a detected signal from a detector that detects a signal generated from the specimen based on the scan performed by the charged particle beam. The charged particle beam device includes: a blanker that performs blanking of the charged particle beam; an image acquisition unit that acquires a plurality of images by controlling the blanking during the scan performed by the charged particle beam, the plurality of images including pixels corresponding to a region of the specimen that is irradiated with the charged particle beam and pixels corresponding to a region of the specimen that is not irradiated with the charged particle beam; and an integrated image generation unit that generates an integrated image by integrating the plurality of acquired images.
Electron Microscope and Image Acquisition Method
An electron microscope includes an electron source for emitting an electron beam, an illumination lens for focusing the beam, an aberration corrector for correcting aberrations, an illumination deflector assembly disposed between the illumination lens and the aberration corrector and operating to deflect the beam and to vary its tilt relative to a sample, a scanning deflector for scanning the sample with the beam, an objective lens, a detector for detecting electrons transmitted through the sample and producing an image signal, a control section for controlling the illumination deflector assembly, and an image generating section for receiving the image signal and generating a differential phase contrast (DPC) image. The tilt of the beam is varied by the illumination deflector assembly such that the image generating section generates a plurality of DPC images at different tilt angles of the beam and creates a final image based on the DPC images.
Device with at least one adjustable sample holder and method of changing holder tilt angle and method of preparing a lamella
A device comprises an electron column or an ion column, provided with an adjustable holder. The adjustable holder maintains the whole range of movements of the manipulation stage and is adapted to change its position in relation to the stage at least in one direction, wherein the range of movements of the manipulation stage is sufficient to change this position and it is unnecessary to install any other control drive or actuator.
SYSTEMS AND METHODS OF CLAMP COMPENSATION
A method of producing a compensation signal to compensate for misalignment of a drive unit clamp element can include applying a clamp element drive signal to a drive unit clamp element to engage a mover element, determining a first displacement of the mover element, and determining a first compensation signal based at least in part on the first displacement. The method can further comprise applying the first compensation signal to the drive unit shear elements and the clamp element drive signal to the drive unit clamp element and determining a second displacement of the mover element. If the second displacement is less than a preselected threshold, the first compensation signal can be combined with an initial shear element drive signal to produce a modified shear element drive signal. If the second displacement is greater than the preselected threshold, a second compensation signal can be determined.
Semiconductor Analysis System
A semiconductor analysis system includes a machining device that machines semiconductor wafer to prepare a thin film sample for observation, a transmission electron microscope device that acquires a transmission electron microscope image of the thin film sample, and a host control device that controls the machining device and the transmission electron microscope device. The host control device evaluates the thin film sample based on the transmission electron microscope image, updates machining conditions based on an evaluation result of the thin film sample, and outputs the updated machining conditions to the machining device.
Electron Microscope and Specimen Contamination Prevention Method
A contamination prevention irradiation device includes a generation unit and a mirror unit. The generation unit generates a laser beam. The mirror unit has a mirror surface for reflecting a laser beam. The laser beam reflected on the mirror surface is applied to a specimen disposed inside an objective lens. The laser beam is composed of a pulse train. Once a laser beam is applied to the specimen before observation of the specimen, deposition of contaminants on the specimen can be prevented for a predetermined subsequent period.
SAMPLE CARRIER FOR USE IN A CHARGED PARTICLE MICROSCOPE, AND A METHOD OF USING SUCH A SAMPLE CARRIER IN A CHARGED PARTICLE MICROSCOPE
The disclosure relates to a method of preparing a sample in a charged particle microscope. The method comprises the steps of providing a sample carrier having a mechanical support contour and a grid member connected thereto. The method comprises the step of connecting said sample carrier to a mechanical stage device of the charged particle microscope. Additionally, the method comprises the step of providing a sample, for example a chunk-shaped or lamella-shaped sample and connecting said sample to the grid member of the sample carrier. The method allows, in an embodiment, easy and reliable transfer of a sample between a bulk sample and a sample carrier.