An evaluation method according to an embodiment is to evaluate a precision of an aperture formed with multiple openings, and includes steps of forming a first evaluation pattern based on evaluation data using multiple electron beams generated by electron beam that has passed through the aperture, dividing the aperture into multiple regions, each of the regions including the multiple openings and defining the multiple divided regions, forming a second evaluation pattern based on evaluation data using the electron beam that has passed through a first divided region among the multiple divided regions, comparing the first evaluation pattern with the second evaluation pattern, and evaluating the precision of the aperture based on the comparison result between the first evaluation pattern and the second evaluation pattern.

The present invention provides a lithography apparatus that forms a pattern on a substrate, the apparatus comprising a base, a stage configured to hold the substrate and be movable above the base with the stage supported by the base, a patterning device configured to perform patterning on the substrate held by the stage, a chamber housing the base and the stage, and supporting the patterning device, a detector configured to obtain information of relative positions between the patterning device and the base, a driving device configured to move the base, and a controller configured to control the driving device based on the information obtained by the detector such that the relative positions satisfy a predetermined condition.

According to one aspect of the present invention, a multiple charged particle beam lithography apparatus includes a circuitry configured to divide a lithography region of a target object into a plurality of pixel regions having a mesh shape and being irradiated with multiple charged particle beams; a circuitry configured to group the plurality of pixel regions into a plurality of pixel blocks configured with at least one pixel region; a circuitry configured to correct position deviation in unit of a pixel block for each pixel block of the plurality of pixel blocks; a dose calculating processing circuitry configured to calculate a dose being irradiated on the pixel concerned for each pixel where the position deviation is corrected; and a mechanism configured to write a pattern on the target object by using the multiple charged particle beams so that each pixel is illuminated with the calculated dose.

A device for examining and/or processing an element for photolithography with a beam of charged particles, the device including (a) means for acquiring measurement data while the element for photolithography is exposed to the beam of charged particles; and (b) means for predetermining a drift of the beam of charged particles relative to the element for photolithography with a trained machine learning model and/or a predictive filter. The trained machine learning model and/or the predictive filter use(s) at least the measurement data as input data.

A method is disclosed of removing a first material disposed over a second material adjacent to a field effect transistor gate having a gate sidewall layer that comprises an etch-resistant material on a gate sidewall. The method includes subjecting the first material to a gas cluster ion beam etch process to remove first material adjacent to the gate, and detecting exposure of the second material during the gas cluster ion beam (GCIB) etch process.

In one embodiment, a BAA apparatus 204 includes apertures 3, each of which being provided to blank charged particle beams 20. The apparatus 204 further includes first electrodes 6a, second electrodes 6b, first via plugs 5a, second via plugs 5c, drivers 2 and comparison circuitries 7 that are provided for each aperture 3, wherein a first electrode 6a and a second electrode 6b are opposite to each other, first and second via plug 5a and 5c are electrically connected to the first electrode 6a, a driver 2 supplies a driving signal to the first electrode 6a via the first via plug 5a, and a comparison circuitry 7 is provided to correspond to the first electrode 6a and compares the driving signal and a signal obtained from the second via 5c plug to output a comparison result signal indicating a result of the comparison.

A system and method for controlling an ion implantation system as a function of sampling ion beam current and uniformity thereof. The ion implantation system includes a plurality of ion beam optical elements configured to selectively steer and/or shape the ion beam as it is transported toward a workpiece, wherein the ion beam is sampled at a high frequency to provide a plurality of ion beam current samples, which are then analyzed to detect fluctuations and/or nonuniformities or unpredicted variations amongst the plurality of ion beam current samples. Beam current samples are compared against predetermined threshold levels, and/or predicted nonuniformity levels to generate a control signal when a detected nonuniformity in the plurality of ion beam current density samples exceeds a predetermined threshold. A control system can be configured to generate a control signal for interlocking the ion beam transport in the ion implantation system or for varying an input to at least one beam optical element to control variations in beam current.

An ion implantation apparatus includes a beam scanner that provides a reciprocating beam scan in a beam scan direction in accordance with a scan waveform, a mechanical scanner that causes a wafer to reciprocate in a mechanical scan direction, and a control device that controls the beam scanner and the mechanical scanner to realize a target two-dimensional dose amount distribution on a surface of the wafer. The control device includes a scan frequency adjusting unit that determines a frequency of the scan waveform in accordance with the target two-dimensional dose amount distribution, and a beam scanner driving unit that drives the beam scanner by using the scan waveform having the frequency determined by the scan frequency adjusting unit.

A method for measuring conductance of a material real-time during etching/milling includes providing a fixture having a socket for receiving the material. The socket is attached to a printed circuit board (PCB) mounted on one side of a plate that has at least one opening for providing ion beam access to the material sample. Conductive probes extend from the other side of the PCB to contact and span a target area of the material. A measurement circuit in electrical communication with the probes measures the voltage produced when a current is applied across the material sample to measure changes in electrical properties of the sample over time.

A charged particle beam writing apparatus includes a processing circuitry configured to calculate a third proximity effect correction irradiation coefficient where at least one correction irradiation coefficient term up to k-th order term, in correction irradiation coefficient terms of from a first order term to a n-th order term for a first proximity effect correction irradiation coefficient which does not take account of a predetermined effect, are replaced by at least one correction irradiation coefficient term up to the k-th order term, for a second proximity effect correction irradiation coefficient which takes account of the predetermined effect; and a processing circuitry configured to calculate a dose by using the third proximity effect correction irradiation coefficient.