An ion beam irradiation apparatus includes modules for generating an ion beam according to a recipe, and a control device. The control device receives the recipe including a processing condition for new processing, reads, from a monitored value storage, a monitored value that indicates a state of a module during a last processing immediately before the new processing, inputs the processing condition and the monitored value to a trained machine learning algorithm and receives, as an output from the trained machine learning algorithm, an initial value for the module, and outputs the initial value to the module to set up the module for generating the ion beam.

Described are ion implantation devices, systems, and methods, and in particular to an ion source that is useful for generating an aluminum ion beam.

A method includes: receiving a first wafer; defining a first zone and a second zone on the first wafer and a plurality of first areas; defining a plurality of first areas and second areas for the first and second zones, respectively; projecting first ion beams onto the first areas and receiving first thermal waves in response to the first ion beams; rotating the first wafer by a twist angle; projecting second ion beams onto the second areas and receiving second thermal waves in response to the second ion beams; and estimating a first crystalline orientation angle of the first wafer based on the first and second ion beams and the first and second thermal waves.

Disclosed herein are approaches for adjusting extraction slits of an extraction plate using a set of adjustable beam blockers. In one approach, an ion extraction optics may include an extraction plate including a first opening and a second opening, and a first beam blocker extending over the first opening and a second beam blocker extending over the second opening. Each of the first and second beam blockers may include an inner slit defined by a first distance between an inner edge and the extraction plate, and an outer slit defined by a second distance between an outer edge and the extraction plate, wherein the first and second beam blockers are movable to vary at least one of the first distance and the second distance. As a result, extraction through the inner and outer slits of ion beamlets characterized by similar mean angles may be achieved.

A method for performing an ion implantation process including providing a hardmask layer disposed atop a substrate, providing a photoresist layer disposed atop the hardmask layer and defining a pattern exposing a portion of the hardmask layer, performing a room temperature ion implantation process wherein an ion beam formed of an ionized first dopant species is directed onto the exposed portion of the hardmask layer to make the exposed portion more susceptible to ion etching or wet etching, performing an etching process wherein the exposed portion of the hardmask layer is etched away to expose an underlying portion of the substrate, and performing a high energy, hot ion implantation process wherein an ion beam formed of a ionized second dopant species is directed onto the exposed portion of the substrate.

To provide an ion milling apparatus adapted to suppress the contamination of a beam forming electrode. The ion milling apparatus includes: an ion gun containing therein a beam forming electrode for forming an ion beam; a specimen holder for fixing a specimen to be processed by irradiation of an ion beam; a mask for shielding a part of the specimen from the ion beam; and an ion gun controller for controlling the ion gun.

Embodiments disclosed herein include an abatement system for abating compounds produced in semiconductor processes. The abatement system includes an exhaust cooling apparatus located downstream of a plasma source. The exhaust cooling apparatus includes at least one cooling plate a device for introducing turbulence to the exhaust flowing within the exhaust cooling apparatus. The device may be a plurality of fins, a cylinder with a curved top portion, or a diffuser with angled blades. The turbulent flow of the exhaust within the exhaust cooling apparatus causes particles to drop out of the exhaust, minimizing particles forming in equipment downstream of the exhaust cooling apparatus.

An ion source having dual indirectly heated cathodes is disclosed. Each of the cathodes may be independently biased relative to its respective filament so as to vary the profile of the beam current that is extracted from the ion source. In certain embodiments, the ion source is used in conjunction with an ion implanter. The ion implanter comprises a beam profiler to measure the current of the ribbon ion beam as a function of beam position. A controller uses this information to independently control the bias voltages of the two indirectly heated cathodes so as to vary the uniformity of the ribbon ion beam. In certain embodiments, the current passing through each filament may also be independently controlled by the controller.

Substrates that can act as optical elements for transmitting infrared light and that have low reflectance for infrared light and the assembly of such substrates with a source of infrared light and/or with an infrared-sensitive optical component. The substrates are suitable for cover glasses and optical elements, such as lenses, prisms, or mirrors to be used with infrared light. Ions are implanted into a substrate in order to reduce its reflectance of infrared light.

Disclosed herein are approaches for adjusting extraction slits of an extraction plate using a set of adjustable beam blockers. In one approach, an ion extraction optics may include an extraction plate including a first opening and a second opening, and a first beam blocker extending over the first opening and a second beam blocker extending over the second opening. Each of the first and second beam blockers may include an inner slit defined by a first distance between an inner edge and the extraction plate, and an outer slit defined by a second distance between an outer edge and the extraction plate, wherein the first and second beam blockers are movable to vary at least one of the first distance and the second distance. As a result, extraction through the inner and outer slits of ion beamlets characterized by similar mean angles may be achieved.