A non-degradable substance degradation device using an ultrasound according to an embodiment of the present invention may include: a sample inflow unit into which a sample containing a non-degradable substance is introduced; a sample circulation unit having a circulation space connected to communicate with the sample inflow unit, and in which the sample moved through the sample inflow unit is circulated; and an ultrasound vibration unit surrounding at least a part of the sample circulation unit to be spaced apart from an outer surface of the sample circulation unit, and generating an ultrasound and providing the ultrasound to the sample circulated in the sample circulation unit to degrade the non-degradable substance of the sample.

According to one embodiment, a substrate treatment method of removing an upper end of a protrusion on a substrate is disclosed. An unevenness is formed on a surface of the substrate. The method can supply a first liquid on the surface of the substrate. The unevenness is formed on the surface. The method can form a protective layer. The protective layer covers the surface of the substrate from the first liquid supplied to the surface of the substrate. The method can supply a second liquid onto the protective layer. In addition the method can physically remove the protective layer which is on the upper end of the protrusion, and can bring the second liquid into contact with the upper end of the protrusion. The protective layer is removed from the upper end of the protrusion.

Disclosed is a substrate treating method for performing cleaning treatment to a substrate by contacting a brush against the substrate. The method includes a rotating step of rotating a spin holder, holding the substrate, around a vertical shaft axis, an outer periphery edge contacting step of contacting the brush against the substrate at an outer periphery edge contacting position closer to an outer periphery edge of the substrate than to the shaft axis while the substrate is rotated in a horizontal plane, a first moving step of moving the brush from the outer periphery edge contacting position to a side adjacent to the shaft axis while the brush is brought into contact against the substrate, and a second moving step of moving the brush from the side adjacent to the shaft axis toward the outer periphery edge after the first moving step.

A new technique for removing warping and undulations in the shape of a workpiece, and a new technique for protecting a surface of a workpiece having projections and depressions without using a soft film are proposed. A protective layer forming method includes the steps of: coating a front surface of a workpiece with a water-soluble resin; pressing a liquid resin that cures in response to an external stimulus with a surface of the water-soluble resin coating the front surface of the workpiece and a resin film; and applying an external stimulus to the pressed liquid resin to cure the liquid resin.

A wafer cleaning device includes: a first brush assembly on a first side of a wafer and comprising a plurality of brushes configured to clean a first surface of the wafer; a first brush cleaner configured to clean the plurality of brushes of the first brush assembly; a brush mover including at least one actuator, the brush mover connected to the plurality of brushes of the first brush assembly and configured to move positions of the plurality of brushes; and a brush rotator including at least one actuator, the brush rotator connected to the plurality of brushes of the first brush assembly and configured to rotate each of the plurality of brushes.

A sheet fixing apparatus includes an image capturing unit having a first camera for capturing images of a target surface of a workpiece before a sheet is fixed to the target surface and a controller for controlling the image capturing unit. The controller determines whether the foreign matter is attached to the target surface or not on the basis of a first image captured of the target surface by the first camera by controlling the image capturing unit to capture the first image before the sheet is fixed to the target surface.

A mirror device manufacturing method includes a forming step of forming a structure by forming a base portion, a movable portion, and a coupling portion coupling the base portion and the movable portion to each other such that the movable portion is able to swing with respect to the base portion through processing of a wafer, and forming a mirror layer in the movable portion; and a collecting step of performing collection of foreign substances from the structure using a collection member after the forming step. A mirror unit manufacturing method includes a sealing step of sealing the mirror device after the collecting step.