The present disclosure provides laminates, which include adhesive materials and methods that allow for the removal of contaminants, e.g. particulate contaminants, from a substrate surface. In one embodiment, the laminates include (i) a substrate with contaminant disposed on its surface, (ii) a liquid, adhesive precursor and (iii) a film layer. The liquid, adhesive precursor is disposed between the substrate and the film layer. In another embodiment, the laminates include (i) a substrate with contaminant disposed on its surface, (ii) a cured adhesive layer and (iii) a film layer. The cured adhesive layer is disposed between the substrate and the film layer. The laminates may be used to remove contaminant from the substrate surface by removal of the film layer and the cured adhesive layer, which entraps the contaminant therein.

A method for effectively removing minute impurities of 1 ?m or less in size that are present on a surface of an aluminum nitride single-crystal substrate without etching the surface includes scrubbing a surface of an aluminum nitride single-crystal substrate using a polymer compound material having lower hardness than an aluminum nitride single crystal, and an alkali aqueous solution having 0.01-1 mass % concentration of potassium hydroxide or sodium hydroxide, the alkali aqueous solution being absorbed in the polymer compound material.

A substrate processing apparatus includes an upper cup part including a first tubular portion and a second tubular portion that are formed each in a tubular shape capable of surrounding a substrate held by a substrate holder, the second tubular portion being connected to an upper side of the first tubular portion. The substrate processing apparatus also includes a cup moving unit that moves the upper cup part in a vertical direction with respect to the substrate holder to stop the upper cup part at each of a position where the first tubular portion surrounds the substrate, and a position where the second tubular portion surrounds the substrate.

The present invention prevents or alleviates cleaning unevenness in cleaning of a substrate with the use of a roll cleaning member having protruding members. The roll cleaning device includes: a substrate support member that supports and rotates a substrate W; and an upper roll cleaning member (52) for scrub cleaning a surface of the substrate W which is rotated by the substrate support member, while rotating. The upper roll cleaning member (52) has a plurality of protruding members provided thereon that are arrayed in the longitudinal direction thereof, and slidably contact the surface of the substrate W. The roll cleaning device cleans the substrate W so that the trajectories of high cleaning force regions out of the parts of the protruding members which slidably contact the substrate W are present without a gap in a radial direction of the substrate W.

A brush is moved from a central position to an outer periphery position while the brush is contacted with an upper surface of a substrate being rotated at a first rotational speed. In this way, a flat region of the substrate is scrub-cleansed. Thereafter, the brush is contacted with a bevel region of the substrate being rotated at a second rotational speed lower than the first rotational speed. In this way, the bevel region of the substrate is scrub-cleansed. Thereafter, while the substrate is rotated at a third rotational speed higher than the second rotational speed, the brush is disposed at an overlapping region cleaning position. In this way, an overlapping region of the flat region and the bevel region are scrub-cleansed.

A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.

A substrate cleaning apparatus for bringing an elongated roll cleaning member into sliding contact with a flat plate type substrate to perform cleaning processing on the substrate includes a roll holder for supporting the roll cleaning member so that the roll cleaning member is rotatable, an elevating mechanism that has a linking member for supporting the roll holder, and moves the roll holder up and down so that the roll cleaning member applies a predetermined roll load to the substrate, a sensor member that is provided to the linking member and measures frictional force between the roll cleaning member and the substrate, and a controller for performing feedback control on the frictional force between the roll cleaning member and the substrate based on a measured value of the sensor member.

In accordance with some embodiments, a method includes placing a semiconductor wafer over a wafer stage; pressing a brush assembly against a backside surface of the semiconductor wafer, wherein the brush assembly comprises an inner brush member and an outer brush member laterally surrounding the inner brush member, and the outer brush member is made of a material having a lower rigidity than the inner brush member; rotating the brush assembly relative to the semiconductor wafer.

An object is to eliminate a harmful effect when a film is bonded by wiping an adhering sealant (30a). Characterized is a wiping device (200) including a stage (230) that supports a sheet-like member (220), a wiping means (210) that wipes an adhering object (30a) adhering on a peripheral portion of the sheet-like member (220), a wiping cloth (241) that is attachably and detachably provided for the wiping means (210), and a solvent (261) that adheres to the wiping cloth (241), in which the wiping means (210) is provided with the wiping cloth (241), makes the solvent (261) adhere to the wiping cloth (241), and wipes the adhering object (30a), or a stack manufacturing apparatus (1000) including such a wiping device (200).

A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.