A system is described for removing a dielectric gel, which has been layered atop the electrical components of a failed electrical system, without further damaging the electrical components of the failed electrical system. The system includes a raster component configured to project a laser for vaporizing a dielectric layer of an electric component into a plasma plume located above the dielectric layer. The system further includes a first vacuum nozzle positioned on a first side of the raster component and configured to extract a first portion of the plasma plume while the plasma plume is located above the dielectric layer, and a second vacuum nozzle positioned on a second side of the raster component and configured to extract a second portion of the plasma plume while the plasma plume is located above the dielectric layer.

A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.

An electronic device includes a leadframe including a die pad and contacts, where a die attached is to the die pad. Wire bonds are attached from the die to the contacts and a mold compound overlies the leadframe and encapsulates the die and the wire bonds. The mold compound has angled side surfaces that extend from a top of the mold compound to a bonding surface of the contacts. The contacts extend from the angled side surfaces in a range of approximately 100 to 300 um.

The inventive concept provides a method for treating a substrate. The method includes removing a film on the substrate by applying a pulsed laser to the rotating substrate, in which thickness of the film to be removed is measured and pulse energy of the pulsed laser is selected based on the measured thickness of the film.

Semiconductor packages with electromagnetic interference (EMI) shielding and a method of manufacture therefor is disclosed. The semiconductor packages may house single electronic components or may be a system in a package (SiP) implementation. The EMI shielding may be provided on top of and along the periphery of the semiconductor package. The EMI shielding on the periphery may be formed of cured conductive ink or cured conductive paste disposed on sidewalls of molding that encapsulates the electronic component(s) provided on the semiconductor package. The top portion of the EMI shielding may be a laminated metal sheet provided on a top surface of the molding. The semiconductor package may further have vertical portions of the EMI shielding with conductive ink filled trenches in the molding that may separate one or more electronic components from other electronic components of the semiconductor package.

A system is disclosed, which comprises a component carrier having a first side, and a second side opposite the first side; and a light source to couple light into the carrier. In an example, the carrier is to propagate, through internal reflection, at least a portion the light to both the first and second sides of the carrier. The portion of light may be sufficient to release a first component and second component affixed to the first and second sides of the carrier via a first photosensitive layer and second photosensitive layer, respectively.

A display apparatus may include a base substrate including a first portion and a second portion smaller than the first portion, a plurality of pixels disposed on the first portion, a protection substrate disposed below the base substrate, and a groove disposed in a portion of the protection substrate and overlapped with the second portion. The groove may include a first region extending in a first direction, and a second region and a third region, which are arranged along the first direction, wherein the first region is interposed between the second region and the third region. The first and second portions may be arranged in a second direction crossing the first direction, and a width of each of the second and third regions may be larger than a first width of the first region, when measured in the second direction.

Semiconductor packages with electromagnetic interference (EMI) shielding and a method of manufacture therefor is disclosed. The semiconductor packages may house single electronic components or may be a system in a package (SiP) implementation. The EMI shielding may be provided on top of and along the periphery of the semiconductor package. The EMI shielding on the periphery may be formed of cured conductive ink or cured conductive paste disposed on sidewalls of molding that encapsulates the electronic component(s) provided on the semiconductor package. The top portion of the EMI shielding may be a laminated metal sheet provided on a top surface of the molding. The semiconductor package may further have vertical portions of the EMI shielding with conductive ink filled trenches in the molding that may separate one or more electronic components from other electronic components of the semiconductor package.

An apparatus for cleaning a semiconductor fabrication chamber may include a cleaning module, an inspection module and a drive module. The cleaning module may clean an inner area of the semiconductor fabrication chamber in a non-contact manner. The inspection module may be configured to inspect a cleaning of the semiconductor fabrication chamber by the cleaning module. The drive module may be configured to move the cleaning module and the inspection module in the semiconductor fabrication chamber. Thus, the non-contact type cleaning module may effectively remove the contaminant on an inner wall of the semiconductor fabrication chamber having a complicated shape and/or a part on the inner wall of the semiconductor fabrication chamber having a complicated shape.

Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.