The present disclosure relates to a TFT liquid crystal module, and the package structure and the package method thereof. The TFT package structure includes a first protection layer covering a surface of the TFT, a second protection layer arranged above the first protection layer, and a hydrophobic layer arranged above the second protection layer. With such configuration, the organic photoresist layer is formed on the external surface of the protection layer, and the plasma gas treatment is applied to the organic photoresist material to obtain the hydrophobic layer. As the hydrophobic layer does not absorb the moisture, that is, the moisture is cut off. Thus, the TFT performance may be kept stable.

The present disclosure relates to a TFT liquid crystal module, and the package structure and the package method thereof. The TFT package structure includes a first protection layer covering a surface of the TFT, a second protection layer arranged above the first protection layer, and a hydrophobic layer arranged above the second protection layer. With such configuration, the organic photoresist layer is formed on the external surface of the protection layer, and the plasma gas treatment is applied to the organic photoresist material to obtain the hydrophobic layer. As the hydrophobic layer does not absorb the moisture, that is, the moisture is cut off. Thus, the TFT performance may be kept stable.

Provided are a thin film transistor, a manufacturing method therefor, an oxide back plate and a display apparatus. The thin film transistor comprises: an oxide active layer (4) and source and drain electrodes (6a, 6b) connected to the oxide active layer (4), wherein the source and drain electrodes (6a, 6b) comprise a main portion (M) and a connective portion (C), the main portion (M) being isolated from the active layer (4), and being electrically connected to the active layer (4) via the connective portion (C), and an electrical resistivity of the connective portion (C) is greater than that of the main portion (M). In the thin film transistor provided above, since the main portions of the source and drain electrodes are not in contact with the oxide active layer, a metal with a relatively high electrical conductivity can be used as the source and drain electrodes, without having a relatively great impact on the electrical performance of the oxide active layer.

A TFT substrate, a TFT switch and a manufacturing method for the same are disclosed. The method includes steps of disposing a gate electrode layer on a substrate, thinning at least a portion of each side region along a thickness direction of the gate electrode layer in order to form two thin regions, disposing a semiconductor layer above the gate electrode layer, and disposing a source electrode layer and a drain electrode layer on the semiconductor layer, wherein, a contact region between the source electrode layer and the semiconductor layer, and a contact region between the drain electrode layer and the semiconductor layer are respectively corresponding to the two thin regions. The present invention can omit a doping process in order to achieve a good ohmic contact so as to solve a schottky contact problem.

A semiconductor device including an oxide semiconductor and an organic resin film is manufactured in the following manner. Heat treatment is performed on a first substrate provided with an organic resin film over a transistor including an oxide semiconductor in a reduced pressure atmosphere; handling of the first substrate is performed in an atmosphere containing moisture as little as possible in an inert gas (e.g., nitrogen) atmosphere with a dew point of lower than or equal to 60 C., preferably with a dew point of lower than or equal to 75 C. without exposing the first substrate after the heat treatment to the air; and then, the first substrate is bonded to a second substrate that serves as an opposite substrate.

In a semiconductor device including a transistor, the transistor is provided over a first insulating film, and the transistor includes an oxide semiconductor film over the first insulating film, a gate insulating film over the oxide semiconductor film, a gate electrode over the gate insulating film, a second insulating film over the oxide semiconductor film and the gate electrode, and a source and a drain electrodes electrically connected to the oxide semiconductor film. The first insulating film includes oxygen. The second insulating film includes hydrogen. The oxide semiconductor film includes a first region in contact with the gate insulating film and a second region in contact with the second insulating film. The first insulating film includes a third region overlapping with the first region and a fourth region overlapping with the second region. The impurity element concentration of the fourth region is higher than that of the third region.

A method of forming a self-forming spacer using oxidation. The self-forming spacer may include forming a fin field effect transistor on a substrate, the fin field effect transistor includes a gate on a fin, the gate is perpendicular to the fin; forming a gate spacer on the gate and a fin spacer on the fin, the gate spacer and the fin spacer are formed in a single step by oxidizing an exposed surface of the gate and an exposed surface of the fin; and removing the fin spacer from the fin.

A TFT substrate, a TFT switch and a manufacturing method for the same are disclosed. The method includes steps of disposing a gate electrode layer on a substrate, thinning at least a portion of each side region along a thickness direction of the gate electrode layer in order to form two thin regions, disposing a semiconductor layer above the gate electrode layer, and disposing a source electrode layer and a drain electrode layer on the semiconductor layer, wherein, a contact region between the source electrode layer and the semiconductor layer, and a contact region between the drain electrode layer and the semiconductor layer are respectively corresponding to the two thin regions. The present invention can omit a doping process in order to achieve a good ohmic contact so as to solve a schottky contact problem.

The present disclosure discloses a manufacturing method of TFTs. The method includes: providing a substrate; forming a first metallic layer on the substrate, and applying a patterning process to the first metallic layer such that the first metallic layer comprises a pattern having a gate; forming a gate insulation layer on the substrate and the first metallic layer, the gate insulation layer covers a surface of the substrate and the gate; forming an oxide conductor layer orthogonally projecting on the gate on the gate insulation layer, wherein the oxide conductor layer is formed by physical vapor deposition (PVD); forming a second metallic layer on the substrate having the gate insulation layer formed thereon, patterning the second metallic layer to form a source and a drain of the TFT, wherein the source and the drain cover a portion of the oxide conductor layer.

The present application discloses a thin film transistor comprising a source electrode; a drain electrode; an active layer; a first connecting layer connecting the active layer to the source electrode; a second connecting layer connecting the active layer to the drain electrode; and an insulating layer between the first connecting layer and the second connecting layer.