A substrate carrier includes a substrate carrier plate having a front-sided substrate carrier surface on which at least one substrate receiving area is provided for receiving a respective substrate. The substrate carrier is intended to enable a secure support of the substrate and a simple, damage-free removal of the substrate from the substrate carrier when operating in a fast manner, preferably without impairment of the characteristics of the substrate or the substrate processing. Therefore, the substrate receiving area has an interior area and an exterior area running around the interior area. The exterior area has spaced plateaus which are raised compared to a surface of the interior area for the support of edge areas of the substrates. Ventilation channels are provided between the plateaus.

A method of forming a semiconductor package includes providing a panel, providing one or more metal layers on an upper surface of the panel, forming a die pad and bond pads from the one or more metal layers, the die pad being adjacent to and spaced apart from the bond pads, attaching a die to the die pad, forming electrical connections between the die and the bond pads, encapsulating the die and the electrical connections with an electrically insulating mold compound, removing portions of the panel, and exposing the die pad and the bond pads after encapsulating the die.

An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

An apparatus for growing semiconductor wafers, in particular of silicon carbide, wherein a chamber houses a collection container and a support or susceptor arranged over the container. The support is formed by a frame surrounding an opening accommodating a plurality of arms and a seat. The frame has a first a second surface, opposite to each other, with the first surface of the frame facing the support. The arms are formed by cantilever bars extending from the frame into the opening, having a maximum height smaller than the frame, and having at the top a resting edge. The resting edges of the arms define a resting surface that is at a lower level than the second surface of the frame. The seat has a bottom formed by the resting surface.

A device for supporting a substrate, an apparatus for manufacturing a display panel, and a method for supporting a substrate are provided. The device for supporting a substrate comprises: a bearing mechanism being provided with a through hole for bearing a substrate; one or more sticky pads on the bearing mechanism surrounding the through hole, which are used for fixing the substrate on the bearing mechanism; and an elevating mechanism, which controls lifting and lowering of the substrate by passing through the through hole, wherein a top of the lifting mechanism is provided with a light-emitting member that emits light when in contact with the substrate, to illuminate the one or more sticky pads such that stickiness of the sticky pads is reduced from a first stickiness to a second stickiness.

Discussed is a device for self-assembling semiconductor light-emitting including: a chip supply part to supply the semiconductor light-emitting diodes to the substrate in cooperation with magnets disposed in a plurality of rows to form the magnetic field, wherein the chip supply part includes: a chip accommodating part to accommodate the semiconductor light-emitting diodes; a vertical moving part to adjust a distance between the chip supply part and the magnets; a horizontal moving part to move the chip supply part such that the chip accommodating part is alternately overlapped with a part of the magnets; and a controller to drive the vertical and horizontal moving parts to control a position of the chip supply part, and the controller moves the chip supply part in at least one of a horizontal direction and a vertical direction at a predetermined path and a plurality of points existing on the predetermined path.

Micro device optical inspection and repairing equipment adopting an adhesion device is provided. The micro device optical inspection and repairing equipment includes a carrying stage, an optical inspection module and at least one adhesion device. The optical inspection module is arranged corresponding to the carrying stage so as to capture image information and obtain a position coordinate from the image information. The adhesion device includes a main body and an adhesive portion. The adhesive portion is connected to the main body. The adhesion device can move to a target position of the carrying stage according to the position coordinate. The main body is adapted to drive the adhesive portion to move to the target position along a moving axis. An optical inspection and repairing method adopting the micro device optical inspection and repairing equipment is also provided.

A method of forming a blocking silicon oxide film on a target surface on which a silicon oxide film and a silicon nitride film are exposed, includes: placing a workpiece having the target surface on which the silicon oxide film and the silicon nitride film are exposed in a processing container under a depressurized atmosphere; forming a spacer polysilicon film to be a sacrificial film on the target surface on which the silicon oxide film and the silicon nitride film are exposed; and substituting the spacer polysilicon film with a substitution silicon oxide film by supplying thermal energy, oxygen radicals and hydrogen radicals onto the workpiece.

Describes are shutter disks comprising one or more of titanium (Ti), barium (Ba), or cerium (Ce) for physical vapor deposition (PVD) that allows pasting to minimize outgassing and control defects during etching of a substrate. The shutter disks incorporate getter materials that are highly selective to reactive gas molecules, including O.sub.2, CO, CO.sub.2, and water.

A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.