A batch processing oven comprising a processing chamber and a rack configured to be positioned in the processing chamber. The rack is configured to support a plurality of substrates and a plurality of panels in a stacked manner such that one or more substrates of the plurality of substrates are positioned between at least one pair of adjacent panels of the plurality panels. Vertical gaps separate each substrate of the one or more substrates from an adjacent substrate or panel on either side of the substrate.

Described herein is a technique capable of reducing the time necessary for stabilizing the inner temperature of the processing furnace. A substrate processing apparatus may include: a wafer retainer configured to support a plurality of wafers; a upright cylindrical process vessel; a seal cap configured to cover an opening at a lower end of the process vessel; a first heater configured to heat an inside of the process vessel from a lateral side thereof; an insulating unit disposed between the seal cap and the wafer retainer; and a second heater facing at least one of the plurality of wafers and configured to heat the at least one of the plurality of wafers, the second heater including: a pillar penetrating centers of the seal cap and the insulating unit; an annular member connected to and concentric with the pillar; a pair of connecting parts connecting end portions of the annular member to the pillar; and an heating element disposed inside the annular member.

Methods and apparatus for supporting substrates are provided herein. In some embodiments, a substrate support for supporting a plurality of substrates includes: a plurality of substrate support elements having a ring shape configured to support a plurality of substrates in a vertically spaced apart relation; and a plurality of substrate lift elements interfacing with the plurality of substrate support elements and configured to simultaneously selectively raise or lower substrates off of or onto respective substrate support elements.

The invention relates to an injector configured for arrangement within a reaction chamber of a substrate processing apparatus to inject gas in the reaction chamber. The injector may be elongated along a first axis and configured with an internal gas conduction channel extending along the first axis and provided with at least one gas entrance opening and at least one gas exit opening. The injector may have a width extending along a second axis perpendicular to the first axis substantially larger than a depth of the injector extending along a third axis perpendicular to the first and second axis. The wall of the injector may have a varying thickness.

Disclosed are a substrate treating apparatus and a substrate transporting method for the substrate treating apparatus. Two treating blocks are arranged so as not to be stacked, and a first treating block, an ID block, and a second treating block are linearly connected horizontally. Accordingly, the number of treatment layers is increasable while a height of the substrate treating apparatus is suppressed. The first and second treating blocks are each connected to the ID block directly. This enables suppression in step of passing a substrate through a treating block without performing any treatment on the substrate, leading to prevention of decrease in throughput. In addition, a substrate buffer is placed in the middle of the two treating blocks. The two treating blocks enable transportation of substrates W with the substrate buffer. Thus, reduction in footprint of the substrate treating apparatus is obtainable.

A substrate processing apparatus having a tube, a closed liner lining the interior surface of the tube, a plurality of gas injectors to provide a gas to an inner space of the liner, and, a gas exhaust duct to remove gas from the inner space is disclosed. The liner may have a substantially cylindrical wall delimited by a liner opening at a lower end and being substantially closed for gases above the liner opening. The apparatus may have a boat constructed and arranged moveable into the inner space via the liner opening and provided with a plurality of substrate holders for holding a plurality of substrates over a substrate support length in the inner space. Each of the gas injectors may have a single exit opening at the top and the exit openings of the plurality of injectors are substantially equally divided over the substrate support length.

Provided is a system for processing a substrate. The system for processing the substrate includes a process tube configured to provide a processing space for the substrate and an exhaust module connected to an exhaust port of the process tube to exhaust process residues within the processing space to the outside. The exhaust module includes an exhaust tube connected to the exhaust port, a sealing case configured to accommodate at least a portion of the exhaust tube, and a local exhaust part provided in the sealing case to exhaust the inside of the sealing case.

A device for recognizing wafer identification number with automatically turning on and off recognizing function comprises a base, a support frame, a light source, a plurality of image capturing units, an image recognition unit and a control unit. The base comprises a wafer boat placing portion and a first switch disposed on the wafer boat placing portion. The light source and the image capturing units are disposed on the support frame. The control unit is electrically connected to the first switch, the light source, the image capturing units and the image recognition unit. As such, the device for recognizing wafer identification number with automatically turning on and off recognizing function can automatically turn on and off the light source, the image capturing units, and the image recognition unit, therefore the operation is very easy and convenience.

Described herein is a technique capable of detecting a substrate state without contacting the substrate. According to one aspect of the technique, there is provided (a) loading a substrate retainer, where a plurality of substrates is placed, into a reaction tube; (b) processing the plurality of the substrates by supplying a gas into the reaction tube; (c) unloading the substrate retainer out of the reaction tube after the plurality of the substrates is processed; and (d) detecting the plurality of the substrates placed on the substrate retainer after the substrate retainer is rotated by a first angle with respect to a transferable position, wherein the plurality of the substrates is transferable to/from the substrate retainer in the transferable position.

There is provided a configuration installed on a mount provided with an opening, that includes a main body connected to the mount to penetrate the opening while providing a micro space; a first positioner attached to a side of a leading end portion of the main body with respect to the mount; and a second positioner attached to a side of a tail end portion of the main body with respect to the mount, wherein the main body is movable within a range determined by the micro space, the first positioner, and the second positioner.