A horizontal substrate carrier is provided, for example a carrier for holding semiconductor substrates during horizontal thermal processing. The horizontal substrate carrier has asymmetrically placed support rails. One side of the horizontal substrate carrier has no upper rail while the other side of the horizontal substrate carrier has an upper rail placed at a relatively high location, for example at an angular location of 60 or more, more preferably of 70 or more, and most preferably at 90. The side without an upper rail may be used for robotic loading of the horizontal substrate carrier. In a preferred embodiment, only three rails are provided: one upper rail on one side and two lower rails. The use and placement of these three rails can hold the substrate in precise uniform locations, minimize substrate movement, and minimize particle generation, all while allowing for easy robotic access.

In one embodiment, a semiconductor manufacturing apparatus includes a container to contain wafers, and supporting tables provided in the container so as to be stacked on one another, and each including a supporting face that comes into contact with a wafer to support the wafer. The apparatus further includes supporting columns to join the supporting tables together and provided at positions where the supporting columns are contained inside outer circumferences of the supporting tables. The apparatus further includes a gas feeder to feed a gas to the wafers on the supporting tables, and a gas discharger to discharge the gas fed to the wafers on the supporting tables. Each of the supporting tables includes a first upper face as the supporting face, and a second upper face provided so as to surround the first upper face at a level higher than a level of the first upper face.

In a substrate arrangement apparatus, a holder elevating mechanism disposes each first substrate between each pair of second substrates, with the first and second substrates being alternately arranged front-to-front and back-to-back. Each substrate is curved in a first radial direction to one side in a thickness direction with a minimum curvature, and curved in a second radial direction orthogonal to the first radial direction to the one side in the thickness direction with a maximum curvature. The first radial direction of the first substrates, each arranged between each pair of the second substrates, is approximately orthogonal to the first radial direction of the second substrates. This improves uniformity in the up-down direction of the distance in the direction of arrangement between the first and second substrates that are alternately arranged adjacent to each other in the direction of arrangement.

A semiconductor processing device according to an embodiment includes a processing tank configured to store a chemical therein to allow a semiconductor substrate to be immersed in the chemical. A gas supply part is provided below the semiconductor substrate accommodated in the processing tank and is configured to supply air bubbles to the chemical from below the semiconductor substrate. A chemical supply part is provided above the gas supply part and below the semiconductor substrate and is configured to discharge the chemical caused to circulate from the processing tank, towards the air bubbles appearing from the gas supply part.

Devices and methods for transferring solar cells while maintaining a controlled environment are provided. Such devices include a solar cell carrying cassette adapted to support a stack of solar cells within a solar cell carrying pod that maintains a sealed micro-environment of inert gas and allows for automated transfer of solar cells between the pod and a fabrication line. The solar cell carrying cassette includes a pair of end plates and a plurality of rods extending therebetween that are configured to support a stack of solar cells. An identifier, such as an RFID chip, is included in each of the pair of end plates so as to allow for ready identification of the cassette from a single location relative the pod, while the cassette is coupled within the pod, regardless of the orientation of the cassette within the pod.

Substrates can be suppressed from being separated from supporting grooves. A substrate processing apparatus includes a substrate holding unit and a processing tub. The substrate holding unit is configured to hold multiple substrates. The processing tub is configured to store a processing liquid therein. The substrate holding unit includes a supporting body, an elevating device and a restriction unit. The supporting body has multiple supporting grooves and is configured to support the multiple substrates with a vertically standing posture from below in the multiple supporting grooves, respectively. The elevating device is configured to move the supporting body between a standby position above the processing tub and a processing position within the processing tub. The restriction unit is configured to be moved up and down along with the supporting body by the elevating device and configured to restrict an upward movement of the substrates with respect to the supporting body.

An apparatus for processing two or more substrates in a batch process by subjecting at least part of the surface of the substrates to alternating surface reactions of at least a first and a second precursor. The apparatus includes: multiple substrate holders for supporting the substrates, and a reaction chamber that includes a reaction space for depositing material on the surface of the substrates during a processing phase. The substrate holders are installed or arranged to be installed inside the reaction chamber for processing of the substrates inside the reaction chamber during the processing phase. During a loading phase in which the substrates are loaded to the substrate holders by a loading device, at least some of the substrate holders are arranged to be movable relative to each other.

Disclosed is a magnetic annealing apparatus including a processing container having a horizontally-elongated tubular shape and configured to perform a magnetic annealing processing on a plurality of substrates accommodated therein in a magnetic field; a heating unit provided to cover at least a part of a surface of the processing container that extends in a longitudinal direction, from outside; a magnet provided to cover the heating unit from the outside of the heating unit; a substrate holder configured to hold the plurality of substrates within the processing container; and a heat shielding plate provided to surround a part of the substrate holder.

A method of manufacturing a semiconductor device, includes: supplying precursor gas into process chamber in which plural substrates are accommodated by sequentially performing: supplying inert gas at first inert gas flow rate from first nozzle into the process chamber; supplying the inert gas at second inert gas flow rate higher than the first inert gas flow rate from the first nozzle into the process chamber while supplying precursor gas from the first nozzle into the process chamber; and supplying the inert gas at the first inert gas flow rate from the first nozzle into the process chamber while the process chamber is evacuated from an upstream side of flow of the precursor gas; stopping supply of the precursor gas; removing the precursor gas remaining in the process chamber; supplying reaction gas from a second nozzle into the process chamber; and removing the reaction gas remaining in the process chamber.

Devices and methods for transferring solar cells while maintaining a controlled environment are provided. Such devices can include a solar cell carrying pod adapted to support and maintain a stack of solar cells within a sealed micro-environment of inert gas. The solar cell carrying pod can further allow for ready removal of a solar cell carrier to facilitate automated transport of solar cells. The solar cell carrying pod can include a cover adapted to receive a solar cell carrier cassette securely mounted on a base that is sealably coupled with the cover to maintain solar cells within the carrier cassette in a sealed micro-environment for an extended period of time. The base can include a collet-operated gear train to facilitate unlocking and removal of the base from the cover in an automated process to facilitate large-scale solar cell fabrication.