The first cushioning portion includes: a cushioning support portion that directly abuts the substrate storing container to support the substrate storing container; and a cushioning-portion connecting portion that is connected to the cushioning support portion, and extends downwards from the cushioning support portion. The second cushioning portion includes: a cushioning plate-like portion in which a through-hole is formed; and cushioning leg portions which are configured by a cushioning material which is softer than the cushioning-portion connecting portion of the first cushioning portion, and extend downwards from the cushioning plate-like portion. The cushioning plate-like portion supports the first cushioning portion in a state in which the cushioning-portion connecting portion penetrates through the through-hole of the cushioning plate-like portion.

Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.

Provided are a purge gas spraying plate and a fume removing apparatus, and more particularly, a purge gas spraying plate capable of spraying a purge gas, which sprays the purge gas along a curvature of a wafer and efficiently removes fumes remaining on the wafer because a concave portion is formed at one side thereof and a spraying hole and a support member configured to support the wafer are formed in the concave portion, and a fume removing apparatus having the same.

A substrate treating apparatus includes a transporting space, transport mechanisms, and heat-treating sections. The transport mechanisms are provided in the transporting space. The heat-treating section, transporting space, and heat-treating section are aligned in the stated order in a transverse direction. One heat-treating section includes a plurality of heat-treating units. The heat-treating units are arranged in a longitudinal direction. The other heat-treating section includes a plurality of heat-treating units. These heat-treating units are also arranged in the longitudinal direction. One transport mechanism transports substrates to the heat-treating units. The other transport mechanism also transports substrates to the heat-treating units.

A wafer cassette for receiving a wafer is provided. The wafer cassette includes a cassette housing, a first supporting rib and a second supporting rib. The first supporting rib is disposed in the cassette housing, wherein the first supporting rib includes a front supporting portion, a middle supporting portion and a rear supporting portion, the front supporting portion is connected to one end of the middle supporting portion, the rear supporting portion is connected to the other end of the middle supporting portion, and the front supporting portion has a front curved edge. The second supporting rib is disposed in the cassette housing. An edge portion of the wafer is supported by the first supporting rib and the second supporting rib, and the front supporting portion, the middle supporting portion and the rear supporting portion contact the wafer simultaneously.

A substrate treatment apparatus includes: a reaction tube including a substrate treatment region in which a substrate is treated; and a furnace opening member disposed in a lower portion of the reaction tube. The reaction tube includes a flange formed to protrude outward in the lower portion of the reaction tube, and an extension portion formed to extend downward from a lower end of the flange, the extension portion being formed to have a thickness larger than a thickness of the reaction tube at a position corresponding to the substrate treatment region, and being configured to cover an inner circumferential surface of the furnace opening member. An inner surface of the extension portion protrudes more inward than an inner surface of the reaction tube at the position corresponding to the substrate treatment region.

A tray carrier includes a base plate having a first and second pairs of opposed sides as well as opposed first and second surfaces. Channel-shaped corner members provide containment formations for trays stacked at the first surface of the base plate. Tray carrier gripping cavities provided in the first pair of opposed sides can be engaged by gripping formations of an automated gripper to facilitate gripping the tray carrier. Raised portions at the first surface of the base plate provide a tray-gripping space engaged by gripping formations of the automated gripper to facilitate gripping trays stacked at the first surface of the base plate. Handle members at the second sides of the base plate facilitate manual handling of the tray carrier, and a pair of opposed recesses in the first sides of the base plate provide a narrowed intermediate portion of the base plate for manual handling of trays.

A method includes disposing, by using a transport module of a workpiece storage system, a first workpiece on a first workpiece carrier; disposing, by using the transport module, the first workpiece carrier with the first workpiece in a workpiece container; disposing, by using the transport module, a second workpiece in the workpiece container, wherein the first workpiece and the second workpiece have different sizes; and transferring, by using the transport module, the workpiece container containing the second workpiece and the first workpiece carrier with the first workpiece to a stocker to store the workpiece container.

A wafer cassette and a method for placing a wafer are provided. The wafer cassette includes a box body including a plurality of groups of card slots formed on sidewalls of the box body. Each group of the card slots is configured to hold a wafer and includes a wafer input terminal. The wafer cassette also includes a guide device including a plurality of groups of guide slots configured to be docked to the wafer input terminals. Each group of the guide slots and a docking group of the card slots are formed at a same floor.

Disclosed is a substrate treating apparatus for performing a cleaning treatment on substrates. The apparatus includes an indexer block with an indexer robot, a treating block including a cleaning unit, and a path block disposed between the indexer block and the treating block. The indexer robot includes a guide rail, a base, an articulated arm, and a hand. The guide rail is positioned so as not to overlap a mount position of a substrate in the path block.