The present invention relates to an apparatus for removing fume which includes, a wafer cassette for stacking wafers; and an exhaust for exhausting the fume of the wafers stacked in the wafer cassette, wherein the wafer cassette includes stacking shelves provided at both sides for stacking wafers; and a front opening for incoming and outgoing of the wafers which are being stacked in the stacking shelf, wherein the stacking shelves include multiple inclined ramp portions which are slanted towards the wafers stacked in the stacking shelves as they travel towards the front opening, wherein a purge gas outlet is provided in the inclined ramp portion for supplying purge gas for the wafers stacked in the stacking shelves. According to the present invention, the residual process gases on wafers can be removed efficiently.

An embodiment relates to a loading cassette and a target substrate loading method to which same is applied. The loading cassette according to the embodiment comprises: an upper plate; a lower plate facing the upper plate while having a space therebetween; an edge support part for connecting the upper plate to the lower plate and supporting the left and right edges of a target substrate; and a rear surface support part for connecting the upper plate to the lower plate and supporting the center and the rear surface-edge of the target substrate.

A substrate cassette can solve a problem in prior art that the substrates having been placed inside the substrate cassette may be crashed or broken when the substrate cassette is conveyed or is picked up and placed down by a mechanical arm which is not under control of a computer system. The substrate cassette defines multiple bearing layers configured to bear substrates thereon, a sensing element is provided in each of the bearing layers, and a warning element is provided outside the substrate cassette to correspond to the sensing element. The sensing element is configured to sense whether a substrate is placed on the bearing layer; and the warning element is configured to send a warning signal when sensing the substrate on the bearing layer by the sensing element.

The disclosure provides an adjustable device including plates and at least two adjustable modules connect with two adjacent of the plates. The adjustable module can stretch or shrink to change a distance between plates. The disclosure also provides an adjustable storage box including an upper cover and a lower cover. A storage space is formed by the upper cover and the lower cover and for the accommodating of the adjustable device. When the upper cover moves upward relative to the lower cover, the adjustable modules changes from a compression state to a stretch state and increase a distance between plates. Whereby, it is easy to pick and place object when a distance of two adjacent plates increases. The overall volume of the adjustable device is reduced when a distance of two adjacent plates decrease, thereby saving the working space.

There is provided a device and method for controlling a tightness of at least one transport enclosure for conveyance and atmospheric storage of semiconductor substrates, the transport enclosure including at least two ventilation ports, the device including at least one interface configured to be coupled to the transport enclosure, the interface including at least two connecting heads, at least one connecting head of the heads being formed by a measurement head configured to engage in a ventilation port of the ventilation ports of the transport enclosure, the measurement head including a projecting end piece, opening through at least one aperture, and a peripheral sealing element surrounding the end piece, all of the ventilation ports of the transport enclosure being coupled to the connecting head of the interface. There is also provided a method for controlling the tightness of the transport enclosure.

A cooling method is a method of cooling a processed substrate in a state of being held by a substrate holder, the method including: a first cooling step of cooling the substrate by supplying a gas toward the substrate holder disposed at a reference position; a stopping step of stopping supply of the gas; and a second cooling step of cooling the processed substrate held in a lower portion of the substrate holder.

A substrate conveying system includes a substrate supply unit including a movable rack and an up-down unit which moves the movable rack down, a lift unit which has one or more ejection holes which eject a gas upward and is configured to lift-up the substrate supported on the movable rack by the pressure of the gas ejected through ejection holes when the up-down unit moves the movable rack down, and a conveying unit which includes a conveyor, and hook elements extending upward from the conveyor, and is configured to push in a conveying direction the substrate W being lifted-up by the pressure of the gas ejected through the ejection holes.

A substrate container includes a container portion having an open side or bottom, and a door to sealingly close the open side or bottom, one of the door and the container portion defining access structure. The substrate container additionally includes a check-valve assembly, the check-valve assembly being retained with respect to the access structure to provide fluid communication with an interior of the substrate container. The check-valve assembly includes a grommet, the grommet being formed of an elastomeric material. A valve seat is disposed within the grommet, the valve seat being integrally formed with the grommet according to one aspect, and being formed of a separate piece according to another aspect. An elastomeric valve member, specifically an elastomeric umbrella valve member according to one aspect, is disposed within the grommet and held to engage the valve seat, thereby restricting fluid flow through the check-valve assembly with respect to the interior of the substrate container.

A method for suppressing material warpage by means of a pressure difference comprises the following steps: a. preparing a plurality of carrier boards; b. preparing a plurality of carrier board pressing devices having an upper surface and a lower surface on which at least one air bag is provided; c. adjusting the processing chamber to be a working temperature and a working pressure, so that the carrier boards and the carrier board pressing devices placed therein are surrounded by the working temperature and the working pressure; d. effectively suppressing warpage of the carrier board by using a pressure difference between a first predetermined pressure in the air bag and the working pressure of the processing chamber. Thereby, production quality of carrier board is significantly improved, as well as the cost for production of which is effectively reduced.

The lid body side wafer support parts allow flexibility to be exhibited and supports the wafers. If a closed state substrate is defined as being a wafer which is stored in the substrate storing space in a container main body in a state wherein the container main body opening portion is closed by the lid body, and a closed time center is defined as being the center of a closed state substrate, the back side substrate support portion, when a closed state substrate is viewed in the thickness direction, are disposed in a pair about a depth direction reference line and support the wafer. A center angle which the back side substrate support portion form toward the depth direction with respect to a left/right direction reference line when a closed state substrate is viewed in the thickness direction is 20-55°.