A film-forming device which includes a chamber having a horizontal central axis, capable of maintaining a vacuum, and movable along the horizontal central axis, the chamber including an inner chamber and an outer chamber that houses the inner chamber; a workpiece holder that aligns and holds workpieces to be processed in multiple stages in the inner chamber; and a heater that heats an inside of the chamber.

An in-line system for mass production of an organic optoelectronic device is disclosed. The in-line system includes a patterned holder, a first chamber, and a second chamber. The patterned holder is for holding a substrate covered with a first electrode layer and a contact electrode layer, in which the first electrode layer and the contact electrode layer are partially shielded by the patterned holder. The first chamber is for forming an organic layer on portions of the first electrode layer and the contact electrode layer that are not shielded by the patterned holder. The second chamber is aligned with the first chamber and is for forming a second electrode layer on the organic layer.

In an embodiment, the present invention discloses a stackable substrate carrier for scalably storing, transporting or processing multiple substrates. The present substrate carriers can be stacked side-by-side by an attaching mechanism, forming an integrated carrier with double, triple or multiple capacity. The attaching mechanism comprises a locking mechanism to secure the substrate carriers together, engaged by mating two substrate carriers, together with an additional rotating or translating action of the two substrate carriers. Alternatively, the locking mechanism can be engaged by pressing two substrate carriers against each other, using friction to keep the carriers together. Other locking mechanism can also be used, such as hooks or latches.

This specification describes methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer carriers. The methods and wafer carriers can be used for increasing the rigidity of wafers, e.g., large and thin wafers, by intentionally bowing the wafers to an extent that does not break the wafers. In some examples, a method for processing semiconductor wafers includes loading each semiconductor wafer into a respective semiconductor wafer slot of a semiconductor wafer carrier, horizontally bowing each semiconductor wafer, and moving the semiconductor wafer carrier into a processing station and processing the semiconductor wafers at the processing station while the semiconductor wafers are loaded into the semiconductor wafer carrier and horizontally bowed.

An in-line system for mass production of an organic optoelectronic device is disclosed. The in-line system includes a patterned holder, a first chamber, and a second chamber. The patterned holder is for holding a substrate covered with a first electrode layer and a contact electrode layer, in which the first electrode layer and the contact electrode layer are partially shielded by the patterned holder. The first chamber is for forming an organic layer on portions of the first electrode layer and the contact electrode layer that are not shielded by the patterned holder. The second chamber is aligned with the first chamber and is for forming a second electrode layer on the organic layer.

A wafer processing system according to one embodiment includes a chamber housing having an exhaust and a rotatable wafer support member for supporting a wafer. A filter fan unit is contained internally within the chamber housing and includes a variable speed fan. A controller is in communication with the variable speed fan to allow the housing to be maintained at either a net positive pressure or a net negative pressure relative to a surrounding environment (e.g., the clean room) outside the housing and also the relative pressures of the chamber housing, the surrounding environment and a handler area can be monitored and controlled.

A method of manufacturing a semiconductor device, includes: supplying precursor gas into process chamber in which plural substrates are accommodated by sequentially performing: supplying inert gas at first inert gas flow rate from first nozzle into the process chamber; supplying the inert gas at second inert gas flow rate higher than the first inert gas flow rate from the first nozzle into the process chamber while supplying precursor gas from the first nozzle into the process chamber; and supplying the inert gas at the first inert gas flow rate from the first nozzle into the process chamber while the process chamber is evacuated from an upstream side of flow of the precursor gas; stopping supply of the precursor gas; removing the precursor gas remaining in the process chamber; supplying reaction gas from a second nozzle into the process chamber; and removing the reaction gas remaining in the process chamber.

In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.

This specification describes semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The semiconductor wafer carriers can include features for avoiding double-slotting, for preventing glove marks on semiconductor wafers, and for providing additional sitting and storage options for the wafer carrier. In some examples, a semiconductor wafer carrier includes multiple notched left-side rods that are parallel in a vertical direction and multiple notched right-side rods that are parallel in the vertical direction. The semiconductor wafer carrier includes one or more bottom rods. The left-side rods, the right-side rods, and the one or more bottom rods are joined to define semiconductor wafer slots.

A substrate storing container includes a container main body, a lid body, and a lateral substrate support portion. The lateral substrate support portion of the substrate storing container includes substrate contact portions touching a substrate when supporting an edge portion of the substrate, and contact portion support portions supporting the substrate contact portions. The substrate contact portions are made of a material having a heat-resisting property with respect to temperature of the substrate touching the substrate contact portions. The contact portion support portions are made of a material having a lower heat-resisting property than that of the substrate contact portions and having a lower coefficient of moisture absorption than that of the substrate contact portions.