A batch processing oven comprising a processing chamber and a rack configured to be positioned in the processing chamber. The rack is configured to support a plurality of substrates and a plurality of panels in a stacked manner such that one or more substrates of the plurality of substrates are positioned between at least one pair of adjacent panels of the plurality panels. Vertical gaps separate each substrate of the one or more substrates from an adjacent substrate or panel on either side of the substrate.

A micro-semiconductor chip transfer apparatus includes: a wet chip supply module configured to supply a plurality of micro-semiconductor chips and liquid onto a transfer substrate; a chip alignment module including an absorber configured to move along a surface of the transfer substrate while absorbing the liquid; and a chip extraction module configured to extract, from the absorber, the micro-semiconductor chips remaining in the absorber.

In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.

Described herein is an apparatus, for processing semiconductor components, includes support surfaces and flexible couplings. The support surfaces are parallel to a first direction and spaced apart from each other in a second direction, perpendicular to the first direction. Moreover, the support surfaces are translationally movable relative to each other in the second direction to increase a pitch between adjacent support surfaces from a first pitch to a second pitch. Each of the flexible couplings is between and fixed to respective adjacent ones of the support surfaces. The flexible couplings flex as the support surfaces translationally move relative to each other in the second direction.

A tray carrier includes a base plate having a first and second pairs of opposed sides as well as opposed first and second surfaces. Channel-shaped corner members provide containment formations for trays stacked at the first surface of the base plate. Tray carrier gripping cavities provided in the first pair of opposed sides can be engaged by gripping formations of an automated gripper to facilitate gripping the tray carrier. Raised portions at the first surface of the base plate provide a tray-gripping space engaged by gripping formations of the automated gripper to facilitate gripping trays stacked at the first surface of the base plate. Handle members at the second sides of the base plate facilitate manual handling of the tray carrier, and a pair of opposed recesses in the first sides of the base plate provide a narrowed intermediate portion of the base plate for manual handling of trays.

An apparatus for transferring a substrate to a substrate processing chamber. The apparatus comprises: a substrate transfer chamber having a floor and a side wall; a substrate transfer module comprising a holder and second magnets, and configured to be movable in the substrate transfer chamber by magnetic levitation; and a controller configured to control an operating force for moving the substrate transfer module. The controller comprises: a parameter storage configured to store at least one model parameter; a control schedule creating section configured to acquire identification information and a movement schedule, to obtain the operating force, and to output a control schedule; and a magnetic force adjusting section configured to perform feedforward control.

A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

An automatic tray loading system and a use method of the same are provided, which includes a stacked tray assembly, including at least one tray which is stacked up, where the at least one tray is provided with several locating slots; a tray lifting platform which includes a tray supporting table being connected with a elevating mechanism; a tray pick and place platform having a working region covers a tray input module, where the tray pick and place platform includes a manipulator which is connected with a multidimensional motion mechanism; and a delivery table including a tray placement plate, where each of the tray placement plate is provided with a groove which is configured to place the at least one layer of trays, and each of the tray placement plates is connected with a linear driving mechanism.

A chip tray, comprising: a first plate configured to allow a plurality of semiconductor elements to be placed thereon, a positioning and clamping mechanism for pressing and holding the semiconductor elements in predetermined locations on the first plate, and actuator means for actuating the positioning and clamping mechanism comprising movable parts of the positioning and clamping mechanism which can be actuated simultaneously to perform a pressing and holding operation and a releasing operation by the positioning and clamping mechanism simultaneously for all the semiconductor elements, wherein the positioning and clamping mechanism comprises a second plate which is laterally shiftable and lockable with respect to the first plate and comprises a plurality of openings and of elastic members each corresponding to an opening and each provided with a pressure piece adapted for abutting against at least one edge of one of the semiconductor elements, characterized in that wherein the elastic members are self-guiding elements mounted on a surface of the second plate, and elastically deformable in a plane parallel to the plane of the second plate in a self-guiding manner.