A semiconductor manufacturing system has a series of steps, from manufacturing of a semiconductor on a wafer until packaging, that can be easily linked. A semiconductor chip manufacturing device manufactures a semiconductor chip, and a semiconductor packaging device packages the semiconductor chip by attaching the semiconductor chip to a package substrate which is larger than the wafer. The semiconductor chip manufacturing device includes a PLAD system for loading the wafer into and out of the semiconductor chip manufacturing device through a shuttle which is capable of housing the wafer. The semiconductor packaging device includes a PLAD system capable of loading the package substrate into and out of the semiconductor packaging device through a shuttle which is capable of housing the package substrate. The shuttles have container bodies of a same shape.

A combined PV panel assembly jig and forklift transport pallet is used to assemble PV panels for transport to a field array from a protected manufacturing environment. The panels are assembled to have adhesively applied rails for transport by a robotic drone on a ground-support rack and are pre-wired. The PV panel assembly jig holds, protects, and aligns the PV panels in an upside down position, opposite to their operational position, for ease of wiring in order to decrease the manual labor required in the field. Once the pallet is transported to the load station at the end of a row of solar panel racks in the field array, a robotic loader lifts the upside down PV panels from the combined PV panel assembly jig and forklift transport pallet in an arcing overhead motion that lifts, tilts, and deposits the PV panels in an upright position at the loading station of a railed rack support as ground-mounted in a solar panel field array.

A substrate cassette can solve a problem in prior art that the substrates having been placed inside the substrate cassette may be crashed or broken when the substrate cassette is conveyed or is picked up and placed down by a mechanical arm which is not under control of a computer system. The substrate cassette defines multiple bearing layers configured to bear substrates thereon, a sensing element is provided in each of the bearing layers, and a warning element is provided outside the substrate cassette to correspond to the sensing element. The sensing element is configured to sense whether a substrate is placed on the bearing layer; and the warning element is configured to send a warning signal when sensing the substrate on the bearing layer by the sensing element.

The present disclosure provides a fixing device and a method of manufacturing a display panel, the fixing device including a carrier plate provided with a fixing member, wherein the fixing member includes at least two opening regions, an area of the opening region is adjustable, the opening region is configured for accommodating the display panel.

Pallets for transporting one or more glass substrates in a substantially vertical orientation through a sputtering system. In some cases, a pallet comprising a frame with an aperture and an adjustable grid array within the aperture. The adjustable grid array is configurable to hold a plurality of glass substrates of different shapes and/or sizes. In one case, the adjustable grid array comprises a system of vertical and horizontal support bars, wherein the vertical support bars configured to both support the plurality of glass substrates at their vertical edges, wherein the horizontal support bars are configured to support the plurality of glass substrates at their horizontal edges, wherein the ends of the horizontal support bars are slideably engaged with the vertical support bars.

The present disclosure provides a support device for conveying at least one solar cell element in a transport direction, wherein the support device comprises a support element configured for supporting the at least one solar cell element and an electric arrangement configured for providing an electrostatic force for holding the at least one solar cell element on the support element.

A substrate processing system includes a substrate loading unit which loads a plurality of substrates, a substrate transfer unit which transfers N (where N is natural number) substrates at the same time from the substrate loading unit, and a substrate processing unit including a plurality of process chambers which receives the N substrates at the same time from the substrate transfer unit and processes the received substrates where each of the process chambers includes a stage on which the N substrates are disposed and an insulation layer disposed between the N substrates.

An assembled grid tray is disclosed, comprising a frame for holding multiple substrate trays to form a larger tray for use in a semiconductor processing tool. The frame may be comprised of two outer frame members that hold one or more of the trays, each with a magnet rail use with a maglev system. The frame may be further comprised of an inner frame member positioned between the outer frame members, which may also include a magnet rail, with the frame members being held in position by one or more outer beam members. The frame members may be fabricated of a material having a similar thermal expansion to trays to be placed in the frame.

A holding arrangement for holding a substrate is described. The holding arrangement includes a body having a first wall of flexible material; an adhesive arrangement configured for attaching the substrate, wherein the adhesive arrangement is provided on a first side of the first wall, and a force transmission arrangement configured for applying a force to a second side of the first wall opposing the first side of the first wall.

Provided is a panel storage container that can suppress flexure of the middle portions of the panels. A panel storage container has: a container body for storing panels; and a panel support means for supporting the panels. The panel support means has: a panel support portion for supporting right and left edges of the panels; a central support portion for supporting each middle portion of the panels; and elastic bodies for contacting the panels, the elastic bodies being provided along a front and rear direction of the central support portion at a predetermined interval.