Provided is a stage apparatus including: a first table that is movable on a base; a second table that is movable in a state of floating above the first table and includes a first portion and a second portion below the first portion; a first position measuring device that measures a position of the first portion of the second table; a second position measuring device that measures a position of the second portion of the second table; and a computer that controls a motor that drives the second table. The computer drives the second table based on information on the position of the first portion measured by the first position measuring device and information on the position of the second portion measured by the second position measuring device.

The present disclosure is directed to a stocker utilizing one or more storage carriers to optimize the utilization of a storage compartment within the stocker. The stocker includes one or more storage towers each including one or more shelves that may be moved from a closed position to an opened position by being pulled outward by a hook of a forking structure. This forking structure is configured to lift up a corresponding storage carrier off the shelf to be transported to a storage carrier load port to position one or more workpieces or toolpieces within the storage carrier, which is then transported back to the corresponding shelf for storage. The utilization of the forking structure along with the pull out shelves allows for a large number of storage carriers to be stored within the storage compartment of the stocker.

A stacking apparatus that stacks substrate and a second substrate includes: a plurality of holding members that hold the first substrate, wherein the plurality of bolding members correct positional misalignment of the first substrate relative to the second substrate by preset amounts of correction, and the plurality of holding members include holding members having the amounts of correction that are different from each other. The stacking apparatus may further include a carrying unit that carries a holding member that is selected from among the plurality of holding members and holds the first substrate from a position here the holding member is housed to a position where the first substrate is held.

A semiconductor device includes a circuit substrate, at least one semiconductor die, a first frame, and a second frame. The at least one semiconductor die is connected to the circuit substrate. The first frame is disposed on the circuit substrate and encircles the at least one semiconductor die. The second frame is stacked on the first frame. The first frame includes a base portion and an overhang portion. The base portion has a first width. The overhang portion is disposed on the base portion and has a second width greater than the first width. The overhang portion laterally protrudes towards the at least one semiconductor die with respect to the base portion. The first width and the second width are measured in a protruding direction of the overhang portion.

A semiconductor device includes a circuit substrate, at least one semiconductor die, a first frame, and a second frame. The at least one semiconductor die is connected to the circuit substrate. The first frame is disposed on the circuit substrate and encircles the at least one semiconductor die. The second frame is stacked on the first frame. The first frame includes a base portion and an overhang portion. The base portion has a first width. The overhang portion is disposed on the base portion and has a second width greater than the first width. The overhang portion laterally protrudes towards the at least one semiconductor die with respect to the base portion. The first width and the second width are measured in a protruding direction of the overhang portion.

A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.

In a wafer storage container, a first ring and a second ring are stacked alternatively in a vertical direction. A wafer delivery device is provided with a first ring support and a second ring support. The first ring support includes a first support piece fixed at the vertical position and a first driving mechanism to drive the first support piece. The first driving mechanism is selectively switchable among a first state, a second state, and a third state. In the first state, the first support piece overlaps with the first position in a plan view. In the second state, the first support piece overlaps with the second position in a plan view. In the third state, the first support piece does not overlap with the first and the second positions in a plan view.

A method for storage a workpiece used in fabrication of a semiconductor device includes disposing the workpiece on a workpiece carrier, disposing the workpiece carrier with the workpiece in a workpiece container via a workpiece storage system, identifying a content of the workpiece container, and adjusting a storage condition inside the workpiece container in response to the content of the workpiece container via the workpiece storage system.

A substrate processing apparatus includes: a substrate holder configured to hold a substrate; a processing liquid supply part configured to supply a processing liquid to the substrate held by the substrate holder; a chemical liquid supply part configured to supply a chemical liquid as a component of the processing liquid to the processing liquid supply part; a pure water supply part configured to supply pure water as a component of the processing liquid to the processing liquid supply part; a low-dielectric constant solvent supply part configured to supply a low-dielectric constant solvent as a component of the processing liquid to the processing liquid supply part; and a controller configured to control a ratio of the chemical liquid, the pure water, and the low-dielectric constant solvent contained in the processing liquid by controlling the chemical liquid supply part, the pure water supply part, the low-dielectric constant solvent supply part.

A ring storage station used for delivering a consumable part to a substrate processing system includes a housing that includes a base plate and a rotating plate disposed over the base plate. An end-effector opening is disposed at a first side of the housing and a service window opening is disposed at a second side of the housing. A set of finger support structures is connected to the rotating plate. Each finger support structure includes a support column and support fingers disposed thereon. At least two of the set of columns have support fingers with index pins to radially align consumable parts when disposed in the ring storage station. In one configuration, consumable parts may be designed to match the rotation angle engagement to ensure catching the angle alignment between ring storage and process module.