A substrate lifting apparatus and a substrate transferring method are provided in which, without waiting for the complete charge clearing of a to-be-processed substrate, and without giving rise to the positional deviation and rebounding of the to-be-processed substrate, the to-be-processed substrate that has been processed can be moved to the substrate hand over position.

A substrate lifting apparatus LM according to this invention is built into a stage ST having, on an upper surface, an electrostatic chuck EC for attracting a to-be-processed substrate W hands over the to-be-processed substrate to and from the stage has: lifting pins 5 which are moveable upward and downward between a hidden position in which the lifting pins lie hidden into the stage, and a protruded position protruding upward from the upper surface of the stage; and a driving means 9 for moving the lifting pins upward and downward. The driving means is arranged to be able to stop the upward movement of the lifting pins in an intermediate position in the course of moving the lifting pins upward from the hidden position to the protruded position.

An apparatus, system and method for a wafer leveling rim, and for installing a wafer leveling rim. The leveling rim for a semiconductor wafer may include: a thin, substantially rigid receiver ring suitable to receive a circumferential rim of the semiconductor wafer; and a substantially flexible containment ring removably associated with the rigid receiver ring. Thereby, the rigid receiver ring imparts rigidity to a circumferential shape of the semiconductor wafer, and the containment ring retains the semiconductor wafer within the rigid receiver ring.

A substrate storage rack for a semiconductor processing system includes a bottom plate, a top plate, and a column assembly. The top plate is spaced apart from the bottom plate, the column assembly connects the top plate to the bottom plate, and a ball member is compressively seated within the column assembly. The ball member protrudes from the column assembly in a direction toward the top plate to support a substrate within the substrate storage rack and on the ball member. Semiconductor processing systems and methods of making substrate storage racks are also described.

A cassette for a workpiece processing system is provided. The cassette is configured to hold one or more replaceable parts, one or more workpieces and one or more pedestal protectors. The cassette includes a divider configured to separate the one or more replacement parts from the one or more workpieces and/or one or more pedestal protectors. The cassette is configured to be disposed in a storage chamber of a workpiece processing apparatus to facilitate automated replacement of replacement parts in one or more processing chambers. Workpiece processing systems and methods of replacing replacement parts in a workpiece processing system are also provided.

The system, method and apparatus described relates generally to a device related to substrate storage and processing. In one example embodiment to methods, apparatus, and systems of a substrate storage and processing module improving upon existing devices used in one or more instances for substrate transportation, sorting, and cleaning. The single piece design system may contain and support substrates in a method, reducing strain on its contents by utilizing an innovative support system without the use of standard clamping techniques and, in this or other iterations, such stacking methods may minimize chaffing of surfaces. Thus the device is vastly improved in its ability to preserve pristine conditions of contained substrates.

An atomic-layer-deposition equipment, includes a reaction chamber, a carrier, a coverage mechanism and a dispensing unit. The carrier and the dispensing unit are disposed within a containing space of the reaction chamber. The coverage mechanism includes a connecting shaft and a cover plate, wherein the cover plate is disposed within the containing space and faces the carrier, the connecting shaft is connected to the cover plate and extends through the reaction chamber. The carrier is configured to carry a substrate assembly and move the substrate assembly with respect to the coverage mechanism, so as to allow the cover plate contacting a top surface of the substrate assembly. When the cover plate contacts the top surface of the substrate assembly, the dispensing unit surrounds the substrate assembly and dispenses a precursor to a lateral surface of the substrate assembly, so as to form a protective layer thereon.

The tool (4000) for handling substrates (3000) comprises a fork (4100); the fork (4100) comprises two arms (4120, 4140) configured to directly or indirectly grip or support one or more substrates (3000) by applying by contact lateral and/or vertical force when in use; there is provided a screen (4500) fixed or fixable to the fork (4100) so as to be overhanging at distance the substrate(s) (3000) when, in use, it/they is/are gripped or supported by the fork (4100).

A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

A storage container in which a uniform flow velocity of the purge gas can be achieved is provided with a plurality of stages of storage units each having an accommodating region to accommodate an article. A supply portion supplies a purge gas; a duct portion communicates with other duct portions of other storage units and serves as a flow path for the purge gas supplied from the supply portion; and an introducing portion communicably connects the duct portion with the accommodating region and introduces the purge gas to the accommodating region. In the flow path for the purge gas in the duct portion, a diffusion member is arranged.

A substrate processing apparatus includes: a substrate holder configured to hold a substrate; a processing liquid supply part configured to supply a processing liquid to the substrate held by the substrate holder; a chemical liquid supply part configured to supply a chemical liquid as a component of the processing liquid to the processing liquid supply part; a pure water supply part configured to supply pure water as a component of the processing liquid to the processing liquid supply part; a low-dielectric constant solvent supply part configured to supply a low-dielectric constant solvent as a component of the processing liquid to the processing liquid supply part; and a controller configured to control a ratio of the chemical liquid, the pure water, and the low-dielectric constant solvent contained in the processing liquid by controlling the chemical liquid supply part, the pure water supply part, the low-dielectric constant solvent supply part.