A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility.

A calibration system is of a wafer processing system. The calibration system includes a calibration substrate configured to be disposed on a plurality of support structures of the wafer processing system. The calibration substrate includes a calibration pin. The calibration substrate enables a calibration operation of a robot arm of the wafer processing system to automatically determine robot arm error of the robot arm.

There is provided a cushioning material, the cushioning material including a lower cushioning material that supports a lower portion of each of two rows of containers on a lower tier, middle cushioning materials that are interposed between the containers on an upper tier and the containers on the lower tier, and upper cushioning materials that are disposed in each of the two rows of the containers on the upper tier and that hold each of an upper portion of the containers on the upper tier, in which the lower cushioning material is formed without a space between the lower cushioning material and side plates of a packing case and the middle cushioning materials and the upper cushioning materials are formed with a predetermined space between the middle cushioning materials and the upper cushioning materials and the side plates of the packing case.

According to one embodiment of the present disclosure, a wafer storage container cleaning apparatus includes a cleaning chamber that cleans a wafer storage container including a shell including an opening on one surface and a gripped portion on another surface crossing the one surface with the opening, and a door detachable from the opening; and a transfer robot including a robot hand that individually grips the shell and the door. The robot hand includes a shell gripping portion including a pair of first gripping claws that are movable toward and away from each other along a first straight line; and a door gripping portion including a pair of second gripping claws movable toward and away from each other along a second straight line intersecting the first straight line in a top view. The cleaning chamber cleans the shell with the opening facing downward.

According to one embodiment of the present disclosure, a wafer storage container cleaning apparatus includes a cleaning chamber that cleans a wafer storage container. The cleaning chamber includes: a chamber that accommodates a shell of the wafer storage container, and capable of being opened and closed by an opening/closing lid via a hinge; a door holder that holds the door; a cleaning nozzle that supplies a cleaning liquid to the shell and the door; a rotation mechanism that rotates the shell and the door; a circular frame that surrounds an outside of the door and has a height that covers a part of the thickness of the door; and an inclined cover that is provided to be inclined such that an end opposite the hinge is the lowest and is higher toward the circular frame, and guides the cleaning liquid supplied to the door and scattered thereon.

A transport case is configured to hold a plurality of wafers for transport of the wafers. The transport case includes a plurality of slots each configured to receive and hold a respective wafer. The transport case includes a sensor system configured to measure the positions or orientations of wafers within the slots or during loading into the slots. The transport case includes a communication system configured to transmit sensor data from the sensor system to an external control system.

A determination section determines that a transport vehicle entered a curved zone from a straight zone based on a front-rear rotation speed difference between the rotation speed of a first rear wheel and a second rear wheel and the rotation speed of at least either a first or second front wheel. A measurement section measures a distance-to-curve, which is the distance that the transport vehicle travels from when a detector detects a detection target until when the determination section determines that the transport vehicle entered the curved zone from the straight zone. If the detector detects a curve ahead detection target while curve ahead information is stored in a storage section, a travel control section executes speed change control before or when the transport vehicle enters the curved zone.

A substrate processing apparatus includes a boat including plural slots to hold at least one substrate, a process furnace that processes the at least one substrate held in the boat, a boat elevator that raises and lowers the boat, a transfer device that transfers the at least one substrate between plural carriers where the at least one substrate is stored and the boat, and a controller capable of controlling the boat elevator and the transfer device, wherein the controller sets plural positions where the transfer device transfers the at least one substrate to the boat elevator, and select the positions to minimize a number of shifts among the positions of the boat elevator or total time taken during the shifts.

The disclosure relates to an apparatus for processing wafers with a process chamber to process wafers held in a wafer boat; a cassette handler chamber to handle wafer cassettes; and, a wafer handler chamber provided with a wafer handler to transfer wafers from wafer cassettes to the wafer boat. The wafer handler is constructed and arranged to transfer wafers between a wafer storage, the wafer boat and wafer cassettes.

A cover for a module tray includes a cover structure to cover a case of a semiconductor device, and a card accommodation portion on an upper surface of the cover structure to accommodate a card. The card accommodation portion includes a first bracket having a first accommodation guide extending in the first horizontal direction, a second bracket spaced apart from the first bracket and having second and third accommodation guides, the second accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the third accommodation guide extending in the second horizontal direction, and a third bracket spaced apart from the first and second brackets, and having fourth and fifth accommodation guides, the fourth accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the fifth accommodation guide extending in the second horizontal direction to face the third accommodation guide.