A semiconductor processing system includes a first component and a second component. The first component forms a first chamber with a first sealed environment at a first state within the first chamber. The second component is coupled to the first component. The second component forms a second chamber with a second sealed environment at a second state within the second chamber. A third component is to change the first state of the first sealed environment within the first chamber to cause the first state to be substantially similar to the second state of the second sealed environment within the second chamber. The second sealed environment is at the second state prior to changing of the first state of the first sealed environment to be substantially similar to the second state.

In some embodiments, a system for monitoring a tool is provided. The system includes a tool monitoring device, a transporting system and an external apparatus. The tool monitoring device is configured to monitor an environmental parameter of a load port of a tool. The tool monitoring device includes a wafer pod and a monitoring module disposed in the wafer pod. The monitoring module includes at least one sensor, a computer coupled to the at least one sensor, a power supply electrically coupled to the at least one sensor and the computer, and a wireless unit coupled to the computer. The transporting system is configured to transfer the tool monitoring device from one load port to another load port. The external apparatus is coupled to the tool monitoring device.

The present invention discloses a bifacial tube-type PERC solar cell, which comprises a rear silver major grid line, a rear aluminum grid line, a rear surface composite film, P-type silicon, an N-type emitter, a front surface silicon nitride film, and a front silver electrode. The present invention also discloses a method and a device for preparing a bifacial tube-type PERC solar cell. The present invention absorbs sunlight on both surfaces, has high photoelectric conversion efficiency, high appearance quality, and high EL yield, and could solve the problems of both scratching and undesirable deposition.

An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

Abbe error that needs to be considered in high accuracy positioning of a device to be maintained, is suppressed. A prober includes: a plurality of measurement sections arranged between a conveyance area and a maintenance area, each of the measurement sections having a device to be maintained which is used for inspection of a semiconductor element formed on a wafer, and a draw-out mechanism configured to draw out the device to be maintained to a side of the maintenance area; a conveyance unit configured to convey an object to be conveyed to a destination measurement section; and a loading part configured to load the object to be conveyed from the side of the maintenance area to the measurement section. The object to be conveyed is loadable into the measurement section from a conveyance area side and the maintenance area side.

The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.

A substrate production, manufacturing, and processing system includes storages with one or more separations that store substrates, loading stations that include robots, opener systems, and a software management system. The storage separations hold first containers that store carriers and the substrates in stacks. Each robot is able to access and move at least one of: the first container, a second container or carrier, and one of the substrates. The opener systems open the first containers such that the carriers and the substrates are able to be accessed by the robots in the loading station, and the software management system assigns at least one category to each stack of carriers and the substrates. The first containers store the substrates with a higher density than the second container or carrier, and the opener systems each include effectors that each hold an individual one of the substrates.

Electronic device processing apparatus including a factory interface chamber purge apparatus with purge gas heating. The factory interface chamber purge apparatus includes one or more heating elements configured to heat the purge gas. In some embodiments, the provision of heated purge gas to the chamber filter assembly can rapidly reduce moisture contamination after the access door is opened for factory interface servicing. In further embodiments, the provision of heated purge gas to the factory interface chamber can aid in desorbing certain chemical compounds from the substrates following processing when a low-humidity environment is provided. Purge control methods and apparatus are described, as are numerous other aspects.

A method for bonding large modules with the following steps, a large module is fed to a bonder from behind in a loading plane by means of a feeder unit. The large module is passed from the feeder unit to a first transverse conveyor unit, and is brought by the same to a first buffer position provided in the bonder, wherein the first buffer position is provided in a loading plane of the bonder. The large module is brought from the first buffer position into a first receiving position in the loading plane via the first transverse conveyor unit and is passed there to a vertical conveyor unit.

A transfer system for transferring multiple microelements to a receiving substrate includes a main pick-up device, a testing device, and first and second carrier plates. The testing device includes a testing platform, a testing circuit, and multiple testing electrodes electrically connected to the testing circuit. The main pick-up device is operable to releasably pick up the microelements from the first carrier plate and position the microelements on the testing electrodes. The testing device is operable to test the microelements to distinguish unqualified ones of the microelements from qualified ones. The main pick-up device is operable to release the qualified ones of the microelements to the receiving substrate.