In substrate processing using the batch processing unit and the single substrate processing unit, the entire substrate processing is efficiently advanced. A substrate processing method includes: a process of calculating a required period of time that is a period of time taken for the substrates to complete the substrate processing in the single substrate processing unit according to a standby number that is a number of the substrates after being subjected to chemical liquid processing in the batch processing unit and before being subjected to drying processing in single substrate processing unit; and a process of controlling a start timing of the chemical liquid processing in the batch processing unit to make the required period of time shorter than a period of time taken for the chemical liquid processing in the batch processing unit.

In one example, a sorting unit includes a sorting system and a plurality of bins into which substrates are sorted. The sorting unit includes a bin handler having a first end effector for receiving one bin of the plurality of bins, and second end effector for disposing an empty bin in the previous location of the received bin. In one example, a method of operating a sorting unit is also provided.

Apparatus and methods for rotating wafers during processing include a wafer rotation assembly with a support fixture connected to a shaft and a wafer transfer assembly with a robot blade with an opening therethrough, the opening sized to allow the support surface of the support fixture to pass through the opening. A first actuator is connected to the wafer rotation assembly to rotate the support fixture assembly about an axis of the shaft. A second actuator is connected to the wafer rotation assembly to move the support fixture assembly a stroke distance along the axis of the shaft. Process kits including the wafer rotation assemblies and robot blades with openings can used to retrofit existing mainframe processing chambers.

Abbe error that needs to be considered in high accuracy positioning of a device to be maintained, is suppressed. A prober includes: a plurality of measurement sections arranged between a conveyance area and a maintenance area, each of the measurement sections having a device to be maintained which is used for inspection of a semiconductor element formed on a wafer, and a draw-out mechanism configured to draw out the device to be maintained to a side of the maintenance area; a conveyance unit configured to convey an object to be conveyed to a destination measurement section; and a loading part configured to load the object to be conveyed from the side of the maintenance area to the measurement section. The object to be conveyed is loadable into the measurement section from a conveyance area side and the maintenance area side.

An EFEM includes first and second chambers, an airflow formation unit, and a gas discharge port. The first chamber includes a dry air introduction port. The second chamber is connected with a lower part of the first chamber and includes an openable door. The airflow formation unit produces a circulating airflow between the first and second chambers. The gas discharge port discharges a gas of the second chamber therefrom. The first and second chambers are connected via first and second communication sections. In the first communication section, a filter is disposed, and an airflow from the first chamber to the second chamber is generated. In the second communication section, a ventilation state is changed by a ventilation state switchable unit, and an airflow from the second chamber to the first chamber is generated.

A conveyance system includes a track, ceiling conveyance vehicles, storage apparatuses, and a conveyance controller configured or programmed to control operations of the ceiling conveyance vehicles and a local vehicle in accordance with an operation mode. The storage apparatus includes a storage plate and the local vehicle that transfer a FOUP between the storage plate and an apparatus port. The conveyance controller switches the operation mode among a first mode prohibiting transfer from the apparatus port to the storage plate by the local vehicle, a second mode prohibiting transfer to the storage plate by any of the ceiling conveyance vehicles and transfer from the storage plate to the apparatus port by the local vehicle, and a third mode that does not restrict transfer by the local vehicle.

A wafer cassette and a method for placing a wafer are provided. The wafer cassette includes a box body including a plurality of groups of card slots formed on sidewalls of the box body. Each group of the card slots is configured to hold a wafer and includes a wafer input terminal. The wafer cassette also includes a guide device including a plurality of groups of guide slots configured to be docked to the wafer input terminals. Each group of the guide slots and a docking group of the card slots are formed at a same floor.

A substrate treating apparatus including an unloading order changing unit. The unloading order changing unit reverses an order, in regard to unloading of substrates in a carrier from the top, between a poor inclined substrate and a substrate at least immediately above the poor inclined substrate when the poor inclined substrate is present whose inclination is determined larger than a pre-set threshold by a poor inclination determining unit. That is, the order is reversed such that the poor inclined substrate whose surface may be possibly be scratched with a hand is unloaded prior to the substrate immediately above the poor inclined substrate. Accordingly, this inhibits damages on the substrate caused by scratching a substrate surface with the hand of a substrate transport mechanism.

Apparatus and methods for rotating wafers during processing include a wafer rotation assembly with a support fixture connected to a shaft and a wafer transfer assembly with a robot blade with an opening therethrough, the opening sized to allow the support surface of the support fixture to pass through the opening. A first actuator is connected to the wafer rotation assembly to rotate the support fixture assembly about an axis of the shaft. A second actuator is connected to the wafer rotation assembly to move the support fixture assembly a stroke distance along the axis of the shaft. Process kits including the wafer rotation assemblies and robot blades with openings can used to retrofit existing mainframe processing chambers.

Disclosed is a substrate processing apparatus including: n (n is an integer of 4 or more) vacuum processing modules each provided with a vacuum container for processing a substrate in a vacuum atmosphere; and an auxiliary facility group including a processing gas supply facility, an evacuation facility, a chiller facility, and a power supply facility. The n vacuum processing modules are grouped into first and second group sets, and in each group set, the vacuum processing modules included in each group share an auxiliary facility selected from the auxiliary facility group.