A method of forming a material layer on a substrate comprises loading a substrate into a printing zone of a coating system using a substrate handler, printing an organic ink material on a substrate while the substrate is located in the printing zone, transferring the substrate from the printing zone to a treatment zone of the coating system, treating the organic ink material deposited on the substrate in the treatment zone to form a film layer on the substrate, and removing the substrate from the treatment zone using the substrate handler.

A substrate supporting and transferring apparatus and associated methods, the apparatus including a shuttle configured to move in a x-direction and a y-direction, the y-direction being perpendicular to the x-direction; a lower wedge block on the shuttle, the lower wedge block including a lower surface that is parallel with an upper surface of the shuttle and an upper surface that is inclined with respect to the lower surface of the lower wedge block; an upper wedge block on the lower wedge block, the upper wedge block including a lower surface that is parallel with the upper surface of the lower wedge block and an upper surface that is parallel with the upper surface of the shuttle; and a chuck on the upper wedge block, the chuck being configured to support a substrate.

Apparatus and techniques for use in manufacturing a light emitting device, such as an organic light emitting diode (OLED) device can include using one or more modules having a controlled environment. The controlled environment can be maintained at a pressure at about atmospheric pressure or above atmospheric pressure. The modules can be arranged to provide various processing regions and to facilitate printing or otherwise depositing one or more patterned organic layers of an OLED device, such as an organic encapsulation layer (OEL) of an OLED device. In an example, uniform support for a substrate can be provided at least in part using a gas cushion, such as during one or more of a printing, holding, or curing operation comprising an OEL fabrication process. In another example, uniform support for the substrate can be provided using a distributed vacuum region, such as provided by a porous medium.

Provided is a substrate processing apparatus and method capable of controlling a gripper to stably suck a substrate even when the substrate is deformed, the substrate processing apparatus including a floating stage for floating a substrate, lift pins liftably mounted in the floating stage, a substrate aligner for aligning the substrate floated from the floating stage, a gripper for vacuum-sucking the aligned substrate, and a controller capable of controlling a floating height of the substrate, wherein the controller reduces the floating height of the substrate when the gripper fails to vacuum-suck the substrate.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

Systems and methods for depositing materials on a substrate via OVJP are provided. A float table and grippers are used to move and position the substrate relative to one or more OVJP print bars to reduce the chance of damaging or compromising the substrate or prior depositions.

The disclosure relates to a positioning conveyance mechanism and a positioning conveyance production system, and belongs to the field of conveyance production equipment. The main technical solution adopted is that the positioning conveyance mechanism comprises a conveyance device, the conveyance device comprising a conveyance part used for carrying and conveying an object; and positioning devices used for fixing the object conveyed to a preset position by the conveyance part. The positioning conveyance mechanism provided by the disclosure can accurately fix the object on a horizontal plane after conveying the object by a fixed distance, so as to realize accurate automatic production.

A system for detecting a load location and a dump location at a worksite is provided. The system includes a controller coupled to a position detection module and a speed detection module. The controller receives a position signal and a speed signal associated with the machine. The controller identities a load location based on a relative distance between the machine and a loading tool and the speed of the machine. The controller monitors a velocity of the machine as the machine moves away from the identified load location, gathers data related to a plurality of stops made by the machine, and builds a heuristic model. The controller selects one stop from the plurality of stops as a dump location based on a distance between the respective dump location and the load location, a duration of stopping of the machine, and a confidence score associated with the respective dump location.

A system for glass substrate inspection, such as flat patterned media, includes an air table that holds the glass substrate. The air table includes chucks that emit gas as air bearings. A camera is disposed over the air table and moves in a direction across a width of a top surface of the glass substrate. An assembly includes a gripper and a probe bar configured to be transported under the camera. The gripper is configured to grip a bottom surface of the glass substrate opposite the top surface. The probe bar delivers driving signals to the glass substrate through a plurality of probe pins.

A laser processing apparatus includes: a stage 2 capable of levitating and transporting a substrate 3 by jetting gas from a front surface; a laser oscillator configured to irradiate a laser beam 20a onto the substrate 3; and a gas jetting port arranged at a position overlapping a focus point position of the laser beam 20a in plan view, and being configured to jet inert gas. The front surface of the stage 2 is constituted by upper structures 5a and 5b, and the upper structures 5a and 5b are arranged so as to be spaced apart from each other and face each other. A gap between the upper structures 5a and 5b overlaps the focus point position of the laser beam 20a in plan view. A filling member 8 is arranged between the upper structures 5a and 5b so as to fill the gap between the upper structures 5a and 5b.