H01L21/67784

WORKPIECE LOADER FOR A WET PROCESSING SYSTEM
20170372938 · 2017-12-28 ·

Techniques herein provide a workpiece handling and loading apparatus for loading, unloading, and handling relatively flexible and thin substrates for transport and electrochemical deposition. Such a system assists with workpiece holder exchange between a delivery cartridge or magazine, and a workpiece holder. Embodiments include a workpiece handler configured to provide an air cushion to a given workpiece, and maneuvering to a given workpiece holder that can edge clamp the workpiece.

Laser irradiation apparatus
11688622 · 2023-06-27 · ·

In a laser irradiation apparatus 1 according to one embodiment, each of first and second flotation units 30a, 30b includes a base 31, and a porous plate 32 bonded to an upper surface of the base 31 by an adhesive layer 34, the base 31 includes a rising portion 312 protruding upward at an outer periphery facing at least the gap, and the porous plate 32 includes a cutout portion 321 configured to fit to the rising portion 312, and the adhesive layer 34 is formed along an inner wall of the rising portion 312 having fitted to the cutout portion 321.

Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device

A laser irradiation apparatus includes a laser generation device, a levitation unit to levitate an object to which the laser light is applied, and a conveyance unit to convey the levitated object. The conveyance unit includes a holding mechanism for holding the object by absorption, and a moving mechanism for moving the holding mechanism in a conveyance direction. The holding mechanism includes a base including a plurality of through holes, a plurality of pipes respectively connected to the through holes, a vacuum generation device configured to evacuate air from the pipes, and a plurality of absorption assistance valves each disposed in the middle of a respective one of the pipes, each of the plurality of absorption assistance valves being configured to be closed when a flow rate of a gas flowing into the pipe through the through hole becomes equal to or higher than a threshold.

Workpiece conveyance apparatus, semiconductor manufacturing apparatus, and workpiece conveyance method

A workpiece conveyance apparatus having: a conveyance path on which the workpiece moves; a gas flotation section that gas-floats the workpiece over the conveyance path; a movable holding section that holds the workpiece to move on the conveyance path along with the workpiece; and a treatment region conveyance path that is located on the conveyance path, and has a treatment region where predetermined treatment for the workpiece is performed, wherein the movable holding section has at least two or more holding sections along a movement direction of the conveyance path, each of the holding sections is capable of switching between release of holding and holding for the workpiece during movement of the workpiece, operation for releasing holding of the workpiece by the holding section on the treatment region conveyance path, and holding the workpiece on the conveyance path other than the treatment region conveyance path.

Method and apparatus for depositing atomic layers on a substrate

Method of depositing an atomic layer on a substrate. The method comprises supplying a precursor gas from a precursor-gas supply of a deposition head that may be part of a rotatable drum. The precursor gas is provided from the precursor-gas supply towards the substrate. The method further comprises moving the precursor-gas supply by rotating the deposition head along the substrate which in its turn is moved along the rotating drum.

Dynamic fluid valve and method for establishing the same
09822447 · 2017-11-21 · ·

A method, comprising: —providing a process space atmosphere at a process space atmosphere pressure; —providing an exterior atmosphere at an exterior atmosphere pressure that is different from the process space atmosphere pressure; —providing a passage via which the exterior atmosphere is in open communication with the process space atmosphere, and via which substrates are exchangeable between the exterior atmosphere and the process space atmosphere; —injecting an exchange fluid into the passage at at least one exchange fluid injection point, so as to effect a flow of exchange fluid that extends through at least a part of the passage, wherein said flow is directed towards —the exterior in case the exterior atmosphere pressure is greater than the process space atmosphere pressure; or —the process space in case the exterior atmosphere pressure is smaller than the process space atmosphere pressure.

Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same

An organic layer deposition apparatus, and a method of manufacturing an organic light-emitting display device using the organic layer deposition apparatus. The organic layer deposition apparatus includes: an electrostatic chuck that fixedly supports a substrate that is a deposition target; a deposition unit including a chamber maintained at a vacuum and an organic layer deposition assembly for depositing an organic layer on the substrate fixedly supported by the electrostatic chuck; and a first conveyor unit for moving the electrostatic chuck fixedly supporting the substrate into the deposition unit, wherein the first conveyor unit passes through inside the chamber, and the first conveyor unit includes a guide unit having a receiving member for supporting the electrostatic chuck to be movable in a direction.

Conveying system with vacuum wheel
09776809 · 2017-10-03 · ·

A system for conveying a substrate includes a noncontact support platform for supporting the substrate. A vacuum wheel is located adjacent to the support platform. A rim of the vacuum wheel includes perforations that open between an exterior of the rim and an interior of the vacuum wheel. A fixed suction surface is interior to the vacuum wheel and includes an opening of a conduit that is connectable to a suction source. A chamber is formed by the suction surface, walls of the vacuum wheel, and a section of the peripheral rim that is adjacent to the suction surface and that extends outward from the support platform. When suction is applied to the conduit, the suction is applied via the chamber to the perforations in the rim section so as to exert a pull on the substrate toward the rim such that rotation of the vacuum wheel conveys the substrate.

GUIDED TRANSPORT PATH CORRECTION
20220039265 · 2022-02-03 ·

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

Flotation conveyance apparatus and laser processing apparatus

A flotation conveyance apparatus according to an embodiment is for conveying a substrate while floating the substrate by ejecting a gas to a lower surface of the substrate. The flotation conveyance apparatus includes a plurality of ejecting ports configured to eject the gas to the substrate, a downstream flow-path configured to supply the gas to the plurality of ejecting ports, a upstream flow-path configured to supply the gas to the downstream flow-path, and a gas supply port configured to supply the gas to the downstream flow-path. A cross-sectional area of the upstream flow-path is configured to be larger than a cross-sectional area of the downstream flow-path.