A deform lead-retract removal track is provided which is configured to convey non-defective integrated circuit packages and remove integrated circuit packages having a lead-retract defect. The distance between the outside walls of the track is less than the distance between leads of the non-defective integrated circuit packages and greater than the distance between the leads of the integrated circuit packages having a lead-retract defect. The defective integrated circuit packages having a lead-retract defect are unable to enter the track or will become stuck on the track.

An artificial intelligence-based wafer rotation method according to an embodiment includes receiving measurement data of a manufacturing process from a data measurement module integrated into manufacturing equipment, calculating rotation angle of a wafer for each process step that maximizes manufacturing yield of the manufacturing process based on the measurement data, and rotating the wafer at the calculated rotation angle in at least one of process steps.