An optical apparatus includes a folding mirror configured to direct first and second illumination lights on first and second alignment marks respectively and reflect first and second reflected lights reflected from the first and second alignment marks in different horizontal directions respectively, first and second lenses arranged respectively in optical paths of the first and second reflected lights reflected from the first and second reflective surfaces of the folding mirror, first and second reflection portions configured to reflect the first and second reflected lights passing through the first and second lenses respectively, and a beam splitter prism configured to divide an illumination light incident through a first surface into the first and second illumination lights and direct to the first and second reflection portions, and transmit the first and second reflected lights reflected by the first and second reflection portions through a second surface.

A bonding device measures a position deviation amount of the chip with respect to the substrate in a state where the chip and the substrate are in contact, and corrects and moves the chip relatively to the substrate in such a way as to reduce the position deviation amount, based on the measured position deviation amount. Then, the bonding device fixes the chip to the substrate by irradiating a resin portion of the chip with an ultraviolet ray and curing the resin portion when the position deviation amount of the chip with respect to the substrate is equal to or less than a position deviation amount threshold value.

A system for monitoring alignment of a second component relative to a first component includes a camera, and a controller including a processor and a nontransitory memory. The controller is configured to receive a first captured image from the camera when the second component is in a predetermined position relative to the first component, receive a selection of a region of interest (ROI) in the first captured image, identify a visible feature of the second component within the ROI of the first captured image, receive captured images from the camera during a subsequent operation, identify a second captured image when the second component is expected to be in the predetermined position relative to the first component, and determine if the second component is in the predetermined position relative to the first component based on the second captured image and the identified visible feature of the first captured image.

A method for transferring a plurality of die operatively associated with a transfer apparatus to a glass substrate to form a circuit component. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.

A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.

A system includes a wafer shape metrology sub-system configured to perform one or more shape measurements on post-bonding pairs of wafers. The system includes a controller communicatively coupled to the wafer shape metrology sub-system. The controller receives a set of measured distortion patterns. The controller applies a bonder control model to the measured distortion patterns to determine a set of overlay distortion signatures. The bonder control model is made up of a set of orthogonal wafer signatures that represent the achievable adjustments. The controller determines whether the set of overlay distortion signatures associated with the measured distortion patterns are outside tolerance limits provides one or more feedback adjustments to the bonder tool.

A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

The present application provides a wafer alignment device, a wafer alignment method and a wafer alignment system. The wafer alignment device includes a detector and an adjustor; the detector is configured to detect an offset of a wafer from a standard position; and the adjustor is configured to adjust a position of the wafer according to the offset of the wafer detected by the detector, so that an error between the position of the wafer and the standard position meets a requirement. The present application can achieve the automatic adjustment of an offset of a wafer, thus achieving the effect of increasing the accuracy of a manipulator subsequently grabbing the wafer.

According to one embodiment, a substrate supporting apparatus includes a mounting plate that is configured by including ceramics and has a mounting surface on which the substrate is to be mounted; a power supply plate that is built in the mounting plate and electrostatically attracts the substrate to the mounting plate; a plurality of protruding portions which internally includes an electrically conductive member respectively, is arranged on at least a central region and outer edge region of the mounting plate, and protrudes from the mounting surface; and a plurality of elastic members which is embedded in the mounting plate to correspond to the plurality of protruding portions, supports the plurality of protruding portions while protruding the protruding portions from the mounting surface, and electrically connects the power supply plate and the electrically conductive members included in the plurality of protruding portions to each other.

A module for operating a carrier of one or more substrates to be treated in a vacuum deposition method includes a frame provided with a plate receiving, on a first side, an electronic assembly comprising radio transmitter/receiver electronics, a processor card, motor controller electronics and a battery for supplying power to the module. The processor card has a program memory with a program for controlling the motor controller electronics according to data received from a remote apparatus provided with a radio transmitting/receiving device for communicating with the module's radio transmitter/receiver electronics and, on a second side, a device for operating the carrier, which device is provided with a first motor for rotating the carrier about a first axis parallel to the plate and with a second motor for rotating the carrier about a second axis perpendicular to the plate.