A pre-jig wafer carrier disc installation/uninstallation device and a method thereof, including a first displacement mechanism, a wafer frame installation/uninstallation mechanism, a wafer installation/uninstallation mechanism, a mask installation/uninstallation mechanism and a robotic arm arranged around the first displacement mechanism. The said mechanisms sequentially stack the wafer frame, the wafer and the mask on the first displacement mechanism to form an assembly. An installation/uninstallation mechanism is disposed at a movable end of the robotic arm. The robotic arm drives the installation/uninstallation mechanism to remove and lock the assembly on an assembly carrier section of a carrier disc for successive processing. After the wafers are processed, the robotic arm drives the installation/uninstallation mechanism to move the assembly back onto the first displacement mechanism. The said mechanisms sequentially disassemble the assembly and recover the mask, the wafer and the wafer frame.

A method includes placing a first wafer on a first wafer stage, placing a second wafer on a second wafer stage, and pushing a center portion of the first wafer to contact the second wafer. A bonding wave propagates from the center portion to edge portions of the first wafer and the second wafer. When the bonding wave propagates from the center portion to the edge portions of the first wafer and the second wafer, a stage gap between the top wafer stage and the bottom wafer stage is reduced.

The present disclosure relates to a technology of manufacturing electronic components, especially semiconductor components with an irregular shape. The present disclosure provides an improved alignment method and system which may be used in cases, where features on a top surface of the semiconductor component or device are not sufficient due to process limitations and where a bottom surface might also not show any alignment correlation with the top surface.

A device for wafer bonding alignment includes: a first fixing apparatus, configured to fix a first wafer, a first alignment mark being disposed on the first wafer; a second fixing apparatus, configured to fix a second wafer, a second alignment mark being disposed on the second wafer, the second fixing apparatus being disposed opposite to the first fixing apparatus; a reflection apparatus, located between the first fixing apparatus and the second fixing apparatus; and a mark reader, reading position information of the first alignment mark and the second alignment mark using the reflection apparatus to align the first wafer fixed on the first fixing apparatus and the second wafer fixed on the second fixing apparatus.

A cutting apparatus includes a table including a support plate transparent in a visible region, a cutting unit, a first feeding mechanism that includes a first moving section for supporting the table and a first motor, a second feeding mechanism that includes a second moving section for supporting the cutting unit and a second motor, a first camera disposed on the side of a first surface of the support plate, a second camera disposed on the side of a second surface opposite to the first surface of the support plate, and a storage section that stores positional deviation amounts in the X-axis direction and the Y-axis direction between an imaging region at a reference position of the first camera and an imaging region at a reference position of the second camera.

A substrate cleaning system includes a cleaner module to clean a substrate after polishing of the substrate, a drier module to dry the substrate after cleaning by the cleaner module, a substrate support movable along a first axis from a first position in the drier module to a second position outside the drier module, and an in-line metrology station including a line-scan camera positioned to scan the substrate as the substrate is held by the substrate support and the substrate support is between the first position to the second position. The first axis is substantially parallel to a face of the substrate as held in by the substrate support.

A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

A method and an apparatus for bonding semiconductor substrates are provided. The apparatus includes a first support configured to carry a first semiconductor substrate and a second semiconductor substrate bonded to each other, a gauging component embedded in the first support and comprising a fiducial pattern, and a first sensor disposed proximate to the gauging component, and configured to emit a light source towards the fiducial pattern of the gauging component.

The method includes the steps of: detecting a part, of a surface of a target, that is located on an inner circumferential side of a predetermined circle centered on a rotation axis and passing the target, by an object detection sensor, at plural rotation positions when at least one of a rotation position of the target about the rotation axis on a substrate placement portion and a rotation position of a detection area about a robot reference axis is changed; calculating a quantity correlated with an index length representing a distance from the robot reference axis to the target when the target is detected by the object detection sensor, for each rotation position; and calculating the positional relationship between the robot reference axis and the rotation axis on the basis of, among the rotation positions, the one at which the quantity correlated with the index length is maximized or minimized.

A bonding apparatus includes a bond head structure, an optical unit and an actuator unit. The bond head structure includes a bond head collet, a connecting unit to which the bond head collet is attached and a look-through passage extending through the bond head collet and the connecting unit along a central axis of the bond head structure. In use, the bond head collet holds an electrical component to be bonded to a bonding area of a base member and the optical unit is positioned relative to the bond head structure to view and inspect the electrical component through the look-through passage of the bond head structure. The actuator unit moves the connecting unit of the bond head structure based on the inspection of the electrical component by the optical unit, to align the electrical component with the bonding area of the base member.