An embodiment of the present application provides a preparation method of a mask assembly, including: fixing, after stretching and aligning a blocking, the blocking on a side of a frame; opening at least one stretching align hole and at least one evaporation align mark in the fixed blocking and frame; fixing, after stretching and aligning a mask sheet, the mask sheet on a side of the blocking away from the frame according to the stretching align hole; and opening at least one evaporation align mark in the fixed mask sheet to obtain the mask assembly.

A device and a method for manufacturing a thin film are provided. The device includes: a chamber; a substrate carrying member arranged within the chamber and configured to carry thereon a substrate on which the thin film is to be formed; a mask fixation member configured to fix a mask, wherein the mask includes a shielding region and an opening region, and a material for forming the thin film is allowed to pass through the opening region; and a position adjustment member configured to adjust a distance between the mask and the substrate to form the thin films of different sizes on the substrate, wherein orthogonal projections of the thin films of different sizes onto the substrate have different areas.

A liquid crystal exposure apparatus that moves a substrate supported in a noncontact manner by a noncontact holder to a projection optical system, and performs scanning exposure to the substrate equipped with: holding pads that hold a part of the substrate located at a first position above the noncontact holder; adsorption pads that hold another part of the substrate; a first drive section moves the holding pads from below the substrate direction intersecting a vertical direction, where the substrate is located at the first position held by the adsorption pads; and a second drive section that moves the adsorption pads holding the substrate, to a second position where the substrate is supported in a noncontact manner by the noncontact holder, wherein the scanning exposure, the second drive section moves the adsorption pads holding the substrate supported in a noncontact manner by the noncontact holder to the projection optical system.

A mask, and a preparation method and an operation method thereof are disclosed. The mask includes: a support and a mask strip mounted on the support, the mask strip including at least two connecting portions connected with the support, and a pattern portion located between the connecting portions, the pattern portion including a first outer surface, and the connecting portion including a second outer surface; wherein the second outer surface and the first outer surface are non-coplanar with each other.

The present invention provides a substrate processing apparatus that processes a substrate, the apparatus including a stage configured to hold and move the substrate, a conveying unit configured to hold and convey the substrate between conveying unit and the stage, an accumulation unit configured to accumulate control information concerning the stage and the conveying unit which is generated by processing the substrate, and a determination unit configured to determine a conveying procedure when conveying the substrate between the stage and the conveying unit by selecting one of a plurality of conveying procedures which can be set for the stage and the conveying unit based on control information accumulated in the accumulation unit.

A vapor deposition method for depositing evaporated materials on a substrate using a mask includes arranging a mask frame and correcting a deflection of the mask frame in the direction of gravity after the mask frame is placed. The mask frame faces the substrate so that a first side is higher than a second side in a direction of gravity. The mask frame is provided with a mask and has the first side and the second side facing each other.

Described herein are apparatus and methods used to process a substrate in a chamber, in particular to position a non-round substrate in a holding chamber or a processing chamber. Further described herein are methods and apparatus that detect radiation transmitted along the thickness of the substrate between the top surface and the bottom surface, determine a signal strength as the substrate is rotated and obtaining a signal strength pattern to determine a position of the substrate within the chamber with respect to a center position.

The present invention provides a substrate processing apparatus that processes a substrate, the apparatus including a stage configured to hold and move the substrate, a conveying unit configured to hold and convey the substrate between conveying unit and the stage, an accumulation unit configured to accumulate control information concerning the stage and the conveying unit which is generated by processing the substrate, and a determination unit configured to determine a conveying procedure when conveying the substrate between the stage and the conveying unit by selecting one of a plurality of conveying procedures which can be set for the stage and the conveying unit based on control information accumulated in the accumulation unit.

As feature sizes of semiconductor chips shrink there is a need for tighter overlay between layers in a lithography process. This means more advanced and larger overlay corrections may be necessary to ensure that die are properly manufactured into chips, especially in reconstituted substrates where the die can shift in the process of creating the substrate. Systems and methods for correcting these overlay errors in a lithographic process are provided. Additional rotation (theta) and projected image size (mag) corrections can be made to correct overlay errors present in reconstituted substrates by adjusting the stage and the reticle. Furthermore, these adjustments can be made allowing site-by-site or zone-by-zone corrections instead of a one-time adjustment of the reticle chuck as has been done in the past. These corrections can alleviate some of the issues associated with fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP).

The present disclosure relates to a processing tool that includes a first wafer-mounting frame and a second wafer-mounting frame. The first wafer-mounting frame is configured to retain a target wafer. The second wafer-mounting frame is configured to retain a masking wafer. The masking wafer includes a mask pattern made up of a number of openings passing through the masking wafer to correspond to a predetermined deposition pattern to be formed on the target wafer. A deposition chamber is configured to receive the first and second wafer-mounting frames, when the first and second wafer-mounting frames are clamped together to retain the target wafer and the masking wafer. The deposition chamber includes a material deposition source configured to deposit material from the material deposition source through the number of openings in the mask pattern to form the material in the predetermined deposition pattern on the target wafer.