A method of determining a desired relative position between a first object of a lithographic apparatus and a second object of the lithographic apparatus. Generating a measurement signal representing a position of the first object relative to the second object, at an initial relative position. Determining a gradient associated with the initial relative position, based on the measurement signal. Determining a position set point based on the gradient and wherein the position set point comprises a three-dimensional dither signal. Controlling the position of the first object relative to the second object to a further relative position, based on the position set point.

A mask, and a preparation method and an operation method thereof are disclosed. The mask includes: a support and a mask strip mounted on the support, the mask strip including at least two connecting portions connected with the support, and a pattern portion located between the connecting portions, the pattern portion including a first outer surface, and the connecting portion including a second outer surface; wherein the second outer surface and the first outer surface are non-coplanar with each other.

The present disclosure relates to a processing tool that includes a first wafer-mounting frame and a second wafer-mounting frame. The first wafer-mounting frame is configured to retain a target wafer. The second wafer-mounting frame is configured to retain a masking wafer. The masking wafer includes a mask pattern made up of a number of openings passing through the masking wafer to correspond to a predetermined deposition pattern to be formed on the target wafer. A deposition chamber is configured to receive the first and second wafer-mounting frames, when the first and second wafer-mounting frames are clamped together to retain the target wafer and the masking wafer. The deposition chamber includes a material deposition source configured to deposit material from the material deposition source through the number of openings in the mask pattern to form the material in the predetermined deposition pattern on the target wafer.

The present disclosure relates to a processing tool that includes a first wafer-mounting frame and a second wafer-mounting frame. The first wafer-mounting frame is configured to retain a target wafer. The second wafer-mounting frame is configured to retain a masking wafer. The masking wafer includes a mask pattern made up of a number of openings passing through the masking wafer to correspond to a predetermined deposition pattern to be formed on the target wafer. A deposition chamber is configured to receive the first and second wafer-mounting frames, when the first and second wafer-mounting frames are clamped together to retain the target wafer and the masking wafer. The deposition chamber includes a material deposition source configured to deposit material from the material deposition source through the number of openings in the mask pattern to form the material in the predetermined deposition pattern on the target wafer.

The present invention provides a processing system that includes a first apparatus and a second apparatus, and processes a substrate, wherein the first apparatus includes a first measurement unit configured to detect a first structure and a second structure different from the first structure provided on the substrate, and measure a relative position between the first structure and the second structure, and the second apparatus includes an obtainment unit configured to obtain the relative position measured by the first measurement unit, a second measurement unit configured to detect the second structure and measure a position of the second structure, and a control unit configured to obtain a position of the first structure based on the relative position obtained by the obtainment unit and the position of the second structure measured by the second measurement unit.

An apparatus for manufacturing a display device includes: a mask assembly tilted with respect to a plane parallel to the ground; a deposition source facing the mask assembly; and a carrier facing the mask assembly and configured to support a display substrate. The mask assembly includes: a mask frame having a flat surface; and a mask sheet having an end on the flat surface of the mask frame and coupled to the mask frame.

The present invention relates to an apparatus for manufacturing a display device and a method of manufacturing a display device. The apparatus for manufacturing a display device includes: a mask assembly tilted with respect to one plane parallel to a ground; a support unit configured to support a rear surface of the mask assembly and to support a lower surface of the mask assembly; a deposition source arranged to face the mask assembly; and a carrier arranged to face the mask assembly and configured to support a display substrate.

A substrate processing apparatus includes a film forming chamber in which a film is formed on a substrate, and a movable member configured to support a mask or both the mask and the substrate in an internal space of the film forming chamber and be movable. Before the film is formed on the substrate, in a state in which the substrate conveyed to the internal space of the film forming chamber by a substrate conveying mechanism is separated from the mask supported by the movable member, the movable member moves so as to reduce an alignment error between the substrate and the mask and then supports the substrate. The movable member moves to a predetermined position after the substrate is supported by the movable member and before the substrate is taken out from the film forming chamber by the substrate conveying mechanism.

According to one embodiment, a position measuring apparatus includes a substrate holding part, a projection part, a liquid supply part, an imaging part, a position measuring part, and a control unit. The substrate holding part is configured to hold a substrate including at least part of a circuit pattern. The projection part is configured to irradiate the substrate held on the substrate holding part with illumination light, and to transmit reflected light from the substrate, of the illumination light radiated on the substrate. The liquid supply part is configured to supply a liquid into a space between the substrate held on the substrate holding part and the projection part. The imaging part is configured to receive the reflected light transmitted through the projection part, and to generate an image signal based on the reflected light. The position measuring part is configured to obtain positional information on a position of the substrate holding part. The control unit is configured to determine a coordinate position of the at least part of a circuit pattern in the substrate, on a basis of the positional information and the image signal.

An optical system may include a light source to provide a beam of light. The optical system may include a reflector to receive and redirect the beam of light. The optical system may include a light gate having an opening to permit the beam of light, from the reflector, to travel through the opening. The optical system may include a light sensor to receive a portion of the beam of light after the beam of light travels through the opening, and convert the portion of the beam of light to a signal. The optical system may include a processing device to determine whether a notch of a wafer is in an allowable position based on the signal.