Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a die on the first surface of the package substrate. In an embodiment, the electronic package further comprises a socket interface on the second surface of the package substrate. In an embodiment, the socket interface comprises a first layer, wherein the first layer comprises a plurality of wells, a liquid metal within the plurality of wells, and a second layer over the plurality of wells.

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a die on the first surface of the package substrate. In an embodiment, the electronic package further comprises a socket interface on the second surface of the package substrate. In an embodiment, the socket interface comprises a first layer, wherein the first layer comprises a plurality of wells, a liquid metal within the plurality of wells, and a second layer over the plurality of wells.

A semiconductor module includes a power electronics carrier including a metallization layer disposed on an electrically insulating substrate, a power semiconductor die mounted on the power electronics carrier, a housing that surrounds an interior volume over the power electronics carrier, a volume of electrically insulating encapsulant that fills the interior volume and encapsulates the power semiconductor die, and a pressure compensation element disposed on or within the electrically insulating encapsulant, wherein the electrically insulating encapsulant is a liquid, wherein the semiconductor module forms an impermeable seal that contains the volume of electrically insulating encapsulant, and wherein the pressure compensation element is configured to maintain the electrically insulating encapsulant at a substantially constant pressure during thermal expansion and thermal contraction of the electrically insulating encapsulant.

A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench.

A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench.

Disclosed is a ceramic package for filling with a liquid-containing electrolyte, which includes: a package body defining a recessed cavity open at a front surface of the package body and including first and second ceramic layers stacked together; a plurality of electrode pads disposed on a bottom surface of the recessed cavity; and a plurality of outer connection terminals disposed on a back surface of the package body, wherein each of the electrode pads includes a pad body portion having a polygonal shape in plan view and an interlayer pad portion formed along an interlayer surface between the first and second ceramic layers, wherein the interlayer pad portion has a protruding part protruding outwardly from the pad body portion, and wherein via conductors are formed between the protruding parts of the electrode pads and the outer connection terminals through the first ceramic layer.

Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.

A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm.sup.2/g or more.

Disclosed are a packaging cover plate, an organic light-emitting diode display and a manufacturing method therefor. The packaging cover plate comprises: a cover plate body, the cover plate body being provided with open slots; cover plugs for covering openings at two ends of the open slots; and water absorption layers for at least covering mouths of the open slots. By means of the arranged open slots, the packaging cover plate can conveniently introduce a dry gas. In addition, the water absorption layers absorb water vapour, the introduced dry gas dries the water absorption layers, and the water vapour and oxygen in the water absorption layers can be taken away by means of the circular flow of the dry gas, so that damage to a device by water vapour and oxygen can be reduced, and the packaging effect is better.

A cooling device includes a substrate defining a substrate upper surface, and a fin positioned on the substrate upper surface, the fin including a deformable encapsulating layer coupled to the substrate upper surface and defining an interior region, and a phase-change material encapsulated within the interior region, where the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer.