A semiconductor module includes a rectangular base plate; a substrate which is placed on the base plate and on which a circuit including a semiconductor chip and so forth is formed; a rectangular parallelepiped case made of resin that is attached to the base plate and houses the substrate within; and a plurality of external terminals lower ends of which are fixed to the substrate with upper ends thereof being exposed on a top face of the case. The case is provided with a first case opening portion and a second case opening portion that are respectively formed by cutting off a front face and a rear face of the case from an upper edge thereof along a longitudinal direction thereof; and the top face of the case between the first case opening portion and the second case opening portion includes an external terminal holding portion to hold the plurality of external terminals along the longitudinal direction with the upper ends thereof being exposed. A sealing material is injected from the first case opening portion and the second case opening portion onto a top face of the substrate, and thereby the semiconductor module is sealed.

There are provided a semiconductor module capable of preventing the adhesion of an epoxy resin to a terminal to which at least one of a high current and a high voltage is supplied and a method for manufacturing a semiconductor module. A semiconductor module includes: a case having an inner wall defining a casting region and a peripheral edge portion arranged outside the inner wall; an intermediate terminal arranged in along side portion of a peripheral edge portion and having a fastening surface to which a cable is fastened; a structure arranged in a long side portion of the inner wall to be adjacent to the long side portion where the intermediate terminal is arranged and higher than the fastening surface; and a sealing section formed of an epoxy resin, having weld lines formed close to the side of the structure on a surface, and cast into a casting region to seal transistors.

A package structure and a method of forming the same are provided. A method includes forming first electrical connectors and second electrical connectors on a first side of an interposer wafer. An integrated circuit die is bonded to the first side of the interposer wafer using the first electrical connectors. A stiffener structure is attached to the first side of the interposer wafer adjacent the integrated circuit die. The stiffener structure covers the second electrical connectors in a plan view. The integrated circuit die and the stiffener structure are encapsulated with a first encapsulant. The interposer wafer and the stiffener structure are singulated to form a stacked structure.

A package structure and a method of forming the same are provided. A method includes forming first electrical connectors and second electrical connectors on a first side of an interposer wafer. An integrated circuit die is bonded to the first side of the interposer wafer using the first electrical connectors. A stiffener structure is attached to the first side of the interposer wafer adjacent the integrated circuit die. The stiffener structure covers the second electrical connectors in a plan view. The integrated circuit die and the stiffener structure are encapsulated with a first encapsulant. The interposer wafer and the stiffener structure are singulated to form a stacked structure.

A semiconductor device includes a base plate, a case, a power semiconductor element, and a control semiconductor element. Case is provided on base plate. Power semiconductor element is disposed over base plate in case. Control semiconductor element is disposed in case. Case has an opening formed therein opposite to base plate. The semiconductor device further includes a cover to close opening in case. Cover has a hole formed in at least a portion of a region overlapping control semiconductor element in plan view.

An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.

Disclosed is a circuit assembly, in particular for a motor vehicle. The circuit assembly comprises a circuit board, an electronic component which is arranged on the circuit board and electrically connected to the circuit board via at least one electrical contact point, and a foamed material sealing element which seals off the electronic component and the at least one electrical contact point in media-tight fashion with respect to surroundings.

The semiconductor device includes a semiconductor element, a plurality of terminal electrodes, internal wiring, and a sealing material. The semiconductor element is mounted on a circuit pattern provided on an insulating substrate. The plurality of terminal electrodes are provided on a case in which the insulating substrate and the semiconductor element are contained. The internal wiring connects the semiconductor element and the plurality of terminal electrodes. The sealing material fills a space in the case. The internal wiring includes a plurality of circuit patterns, a plurality of metal blocks, and metal wire. The plurality of metal blocks are electrically connected to the respective circuit patterns. The metal wire connects the plurality of metal blocks and is bonded to the plurality of metal blocks at positions closer to an upper surface of the sealing material than surfaces of the plurality of circuit patterns.

Some embodiments of the present disclosure provide a method of manufacturing a device. The method includes providing a carrier, the carrier including a top surface, covering a portion of the top surface with a plurality of active dies, disposing a protrudent band over a periphery of the carrier, wherein the protrudent band includes a rim shaped along the contour of the carrier, and forming a molding compound over the carrier to cover the plurality of active dies. A method for determining a width of the protrudent band of a device described herein is also provided.

Some embodiments of the present disclosure provide a method of manufacturing a device. The method includes providing a carrier, the carrier including a top surface, covering a portion of the top surface with a plurality of active dies, disposing a protrudent band over a periphery of the carrier, wherein the protrudent band includes a rim shaped along the contour of the carrier, and forming a molding compound over the carrier to cover the plurality of active dies. A method for determining a width of the protrudent band of a device described herein is also provided.