A method of manufacturing a microelectromechanical system includes forming of an electromechanical element on a substrate. The method further includes preparation of an encapsulation package to form a sealed cavity integrating the electromechanical element, with the sealed cavity having a volume smaller than 10 mm.sup.3. The method includes physical vapor deposition of a getter film on the substrate or on a wall of the encapsulation package so that the getter film has a specific absorption surface area smaller than 8 m.sup.2/g, and sealing of the encapsulation package on the substrate by means of a thermal sealing cycle having a temperature enabling to activate said getter film.

A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.

A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.

A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.

A semiconductor device, including a semiconductor element; a case having a frame portion, which has an inner periphery that surrounds a housing space for accommodating the semiconductor element; and a lid covering the housing space. The inner periphery of the frame portion has a stepped portion formed thereon, the stepped portion including a step supporting surface positioned at a level lower than a front surface of the frame portion and being approximately parallel to the front surface of the frame portion. The lid has a lateral surface surrounding the lid, and a front surface and a bottom surface approximately parallel to the step supporting surface. The lid has a reservoir formed in the front surface thereof and extending from the lateral surface, the reservoir having a reservoir surface positioned at a level lower than the front surface of the lid.

A bonded structure is disclosed. The bonded structure can include a first element that has a first bonding surface. The bonded structure can further include a second element that has a second bonding surface. The first and second bonding surfaces are bonded to one another along a bonding interface. The bonded structure can also include an integrated device that is coupled to or formed with the first element or the second element. The bonded structure can further include a channel that is disposed along the bonding interface around the integrated device to define an effectively closed profile The bonded structure can also include a getter material that is disposed in the channel. The getter material is configured to reduce the diffusion of gas into an interior region of the bonded structure.

A bonded structure is disclosed. The bonded structure can include a first element that has a first bonding surface. The bonded structure can further include a second element that has a second bonding surface. The first and second bonding surfaces are bonded to one another along a bonding interface. The bonded structure can also include an integrated device that is coupled to or formed with the first element or the second element. The bonded structure can further include a channel that is disposed along the bonding interface around the integrated device to define an effectively closed profile The bonded structure can also include a getter material that is disposed in the channel. The getter material is configured to reduce the diffusion of gas into an interior region of the bonded structure.

The present invention relates to a getter composition comprising magnesium oxide particle doped with alkali metal, a getter layer comprising the same, and an organic electronic device comprising the getter layer. The getter composition comprising magnesium oxide particle doped with alkali metal according to the present invention has remarkably improved hygroscopicity simultaneously with maintaining transparency of the previously used magnesium oxide particles, and thus, is used in a getter layer comprising the same and an organic electronic device comprising the getter layer, thereby effectively protecting water sensitive devices.

The present invention relates to a getter composition comprising magnesium oxide particle doped with alkali metal, a getter layer comprising the same, and an organic electronic device comprising the getter layer. The getter composition comprising magnesium oxide particle doped with alkali metal according to the present invention has remarkably improved hygroscopicity simultaneously with maintaining transparency of the previously used magnesium oxide particles, and thus, is used in a getter layer comprising the same and an organic electronic device comprising the getter layer, thereby effectively protecting water sensitive devices.

A packaged integrated circuit is provided. The packaged integrated circuit includes a die, a package including a base, a lid, and a plurality of package leads, and die attach adhesive for securing the die to the package base. the die includes a plurality of die pads. The die is secured to the base with the die attach adhesive. After the die is secured to the base, at least one of the plurality of die pads is electrically connected to at least one of the plurality of package leads with a printed bond connection. After printing the bond connection, the lid is sealed to the base.