A moisture and hydrogen adsorption getter is provided. The moisture and hydrogen adsorption getter includes a silicon substrate including a concave portion and a convex portion, a silicon oxide layer conformally provided along a surface of the concave portion and a surface of the convex portion and configured to adsorb moisture, and a hydrogen adsorption pattern disposed on the silicon oxide layer. A portion of the silicon oxide layer is exposed between portions of the hydrogen adsorption pattern.

A moisture and hydrogen adsorption getter is provided. The moisture and hydrogen adsorption getter includes a silicon substrate including a concave portion and a convex portion, a silicon oxide layer conformally provided along a surface of the concave portion and a surface of the convex portion and configured to adsorb moisture, and a hydrogen adsorption pattern disposed on the silicon oxide layer. A portion of the silicon oxide layer is exposed between portions of the hydrogen adsorption pattern.

High-capacity dispensable moisture and hydrogen getter to be used as sealant and/or to control the level of these substances in electronic or optoelectronic sensitive devices, its use for the hermetic sealing or semi-hermetic sealing of such electronic or optoelectronic sensitive devices and a method to control the level of contaminants within them.

Various embodiments of the present application are directed towards a method for forming a semiconductor-on-insulator (SOI) substrate with a thick device layer and a thick insulator layer. In some embodiments, the method includes forming an insulator layer covering a handle substrate, and epitaxially forming a device layer on a sacrificial substrate. The sacrificial substrate is bonded to a handle substrate, such that the device layer and the insulator layer are between the sacrificial and handle substrates, and the sacrificial substrate is removed. The removal includes performing an etch into the sacrificial substrate until the device layer is reached. Because the device layer is formed by epitaxy and transferred to the handle substrate, the device layer may be formed with a large thickness. Further, because the epitaxy is not affected by the thickness of the insulator layer, the insulator layer may be formed with a large thickness.

A semiconductor device, a leak detection device, an outer wall, and a separation wall are provided on a substrate. A first hollow structure in contact with the semiconductor device and a second hollow structure in contact with the leak detection device are separated by the separation wall and formed in a hermetically sealed state. At least a part of a portion of the leak detection device in contact with the second hollow structure is made of a corrodible metal or an alloy containing a corrodible metal. At least a part of the outer wall is in contact with the second hollow structure.

A semiconductor device, a leak detection device, an outer wall, and a separation wall are provided on a substrate. A first hollow structure in contact with the semiconductor device and a second hollow structure in contact with the leak detection device are separated by the separation wall and formed in a hermetically sealed state. At least a part of a portion of the leak detection device in contact with the second hollow structure is made of a corrodible metal or an alloy containing a corrodible metal. At least a part of the outer wall is in contact with the second hollow structure.

A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.

A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.

Disclosed are a packaging cover plate, an organic light-emitting diode display and a manufacturing method therefor. The packaging cover plate comprises: a cover plate body, the cover plate body being provided with open slots; cover plugs for covering openings at two ends of the open slots; and water absorption layers for at least covering mouths of the open slots. By means of the arranged open slots, the packaging cover plate can conveniently introduce a dry gas. In addition, the water absorption layers absorb water vapour, the introduced dry gas dries the water absorption layers, and the water vapour and oxygen in the water absorption layers can be taken away by means of the circular flow of the dry gas, so that damage to a device by water vapour and oxygen can be reduced, and the packaging effect is better.

Provided are an organic light emitting diode display panel and packaging method thereof. The organic light emitting diode display panel is provided with an adhesive layer on a passivation layer corresponding to a position of a sealant. When packaging the organic light emitting diode, the sealant on a cover plate is adhered corresponding to a position of the adhesive layer. The adhesive layer has a good bonding force with the sealant and also has a good bonding force with the passivation layer. Thus, water vapor does not easily enter the organic light emitting diode element, which will not reduce the performance of the organic light emitting diode element to improve a service life of organic light emitting diode element and to possess a good reliability performance.