Embodiments have two approaches as follows: (1) Embedded PCB-based fabrication and (2) PCB assembly-based fabrication. An embedded printed circuit board (PCB) type approach involves the creation of a space of coolant direct interconnection, using immersion cooling to link on any type of power semiconductor device hot spots to convectively and evaporatively cool directly. This means fabricating PCB embedded channels, to utilize the microgap between die and PCB as the cooling channel. A printed circuit board (PCB) assembly embodiment includes a PCB having at least one heat generating component. A lid is mounted to the PCB, wherein the lid defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path.