A method of forming an integrated circuit includes placing a first and a second standard cell layout design of the integrated circuit on a layout design, and manufacturing the integrated circuit based on at least the first or second standard cell layout design. The first standard cell layout design has a first height. The second standard cell layout design has a second height. Placing the first standard cell layout design includes placing a first set of pin layout patterns on a first layout level over a first set of gridlines, extending in a first direction, and having a first width in a second direction. Placing the second standard cell layout design includes placing a second set of pin layout patterns on the first layout level over a second set of gridlines, extending in the first direction, and having a second width in the second direction.

An electronic device comprises a supporting substrate, a flexible substrate disposed on the supporting substrate, a plurality of electronic units and a conductive pattern layer. The flexible substrate is bent from a front side to a back side of the supporting substrate, and a portion of the flexible substrate is disposed on the back side of the supporting substrate. The electronic units are disposed within a display region of the flexible substrate. The conductive pattern layer extends from the display region to the portion of the flexible substrate, and the conductive pattern layer electrically connects at least two of the electronic units.

A head includes: a head unit; and a wiring film configured to be connected to the head unit. The wiring film includes: a flexible substrate; a first IC provided on the flexible substrate; a second IC provided on the flexible substrate; a first wire provided on the flexible substrate to connect the first IC and a first contact portion of the head unit; a second wire provided on the flexible substrate to connect the second IC and a second contact portion of the head unit; and a third wire provided on the flexible substrate. The first IC has a long side extended in a predetermined direction and connected to the first wire, the second IC has a long side extended in the predetermined direction and connected to the second wire, and the first IC and the second IC are aligned along the predetermined direction to be apart from each other.

The subject matter of the present disclosure may be embodied in devices, such as flexible wiring, that include: an elongated flexible substrate; multiple electrically conductive traces arranged in an array on a first side of the elongated flexible substrate; and an electromagnetic shielding layer on a second side of the elongated flexible substrate, the second side being opposite the first side, in which the elongated flexible substrate includes a fold region between a first electronically conductive trace and a second electrically conductive trace such that the electromagnetic shielding layer provides electromagnetic shielding between the first electronically conductive trace and the second electrically conductive trace.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

A chip on film, a display panel, and a method of manufacturing the display panel are provided. The chip on film includes a flexible film and a driver chip. The flexible film includes at least a first group of lines and a second group of lines. M lines of the first group of lines are electrically connected to pins of the driver chip to form driver lines; and N lines of the secondgroup of lines are not electrically connected to any pin of the driver chip, serving as nominal lines. By arranging the nominal lines, a conventional bonding machine may be applied to bond the chip on film to the display substrate. Costs for modifying the bonding machine may be reduced, and application scenarios of the chip on film may be increased.

A display device according to an example embodiment of the present disclosure may include a stretchable lower substrate, a pattern layer disposed on the lower substrate and including a plurality of plate patterns and a plurality of line patterns, a plurality of pixels disposed on each of the plurality of plate patterns, and a plurality of connection lines connecting the plurality of pixels. The plurality of connection lines are disposed on each of the plurality of line patterns, so that stretching reliability may be improved.

A display device according to an example embodiment of the present disclosure may include a stretchable lower substrate; a lower pattern layer disposed on the lower substrate and including a plurality of lower plate patterns and a plurality of lower line patterns; a plurality of pixel circuits disposed on each of the plurality of lower plate patterns; a plurality of lower stretched lines disposed on each of the plurality of lower line patterns; an upper pattern layer disposed on the lower pattern layer and including a plurality of upper plate patterns and a plurality of upper line patterns; a plurality of light emitting elements disposed on each of the plurality of upper plate patterns; and a plurality of upper stretched lines disposed on each of the plurality of upper line patterns, so that a uniform power may be supplied.

A semiconductor device includes: a first insulating circuit substrate; a first semiconductor chip mounted on a top surface of the first insulating circuit substrate; a printed circuit board arranged over the first insulating circuit substrate; a first external terminal inserted to the printed circuit board and having one end bonded to the top surface of the first insulating circuit substrate; and a first pin inserted to the printed circuit board and having one end bonded to a top surface of the first semiconductor chip, wherein the first insulating circuit substrate and the printed circuit board having warps complimentary to each other.

A method for forming a semiconductor structure includes curing a shape memory polymer in a first shape. The shape memory polymer is coupled to a conductive layer. The method further includes folding the shape memory polymer from the first shape into a second shape. The method also includes bonding a semiconductor wafer to the conductive layer while the shape memory polymer is in the second shape. The semiconductor wafer has first and second dies. The semiconductor wafer is then singulated to separate the first die from the second die. The method further includes expanding the shape memory polymer to its first shape and singulating the shape memory polymer to separate the first and second dies.