A display apparatus includes a printed circuit board including first to fourth output pad regions and a flexible circuit board having a first end connected to a display panel and a second end connected to the printed circuit board. The first output pad region includes a 1.sup.st-1.sup.st output pad group and a 1.sup.st-2.sup.nd output pad group, the second output pad region includes a 2.sup.nd-1.sup.st output pad group and a 2.sup.nd-2.sup.nd output pad group, the fourth output pad region includes a 4.sup.th- 1.sup.st output pad group and a 4.sup.th-2.sup.nd output pad group, and the printed circuit board includes a first input terminal electrically connected to the 1.sup.st-1.sup.st output pad group, a second input terminal electrically connected to the 2.sup.nd-2.sup.nd output pad group, a third input terminal electrically connected to the first input terminal, and a fourth input terminal electrically connected to the 4.sup.th-2.sup.nd output pad group.

A liquid jetting apparatus includes: a head unit including a first driving element, a second driving element, a first contact portion connected to the first driving element, and a second contact portion connected to the second driving element; and a wiring member including a flexible substrate, a first driving IC provided on the flexible substrate, a second driving IC provided on the flexible substrate, a first wire formed in the flexible substrate and connecting the first driving IC and the first contact portion, and a second wire formed in the flexible substrate and connecting the second driving IC and the second contact portion. A conductive part different from the first wire and the second wire is disposed in an area of the flexible substrate between the first driving IC and the second driving IC.

An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 μm. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.

A semiconductor device includes: a first semiconductor element; a second semiconductor element; a first insulating base member including a fifth face and a sixth face; a second insulating base member including a seventh face and an eighth face; a first wiring that penetrates through the first insulating base member, and disposed on the sixth face; a second wiring that penetrates through the second insulating base member, and disposed on the eighth face; a first wiring member that faces the second face of the first semiconductor element; and a second wiring member that is provided on the second wiring. The first wiring member is provided on the seventh face of the second insulating base member. A current flows in a first direction in the first wiring member, and flows in a second direction opposite to the first direction in the second wiring member.

A semiconductor device includes: a first semiconductor element including a first face and a second face; a second semiconductor element including a third face and a fourth face; an insulating base member including a fifth face and a sixth face; a first wiring that penetrates through the insulating base member, and is disposed on the sixth face; a second wiring that penetrates through the insulating base member, and is disposed on the sixth face; a first wiring member that faces the second face; and a second wiring member that faces the sixth face, and is electrically connected to the second wiring. The second wiring member is bonded to the first and second wirings while the insulating base member is folded. A current flows in a first direction in the first wiring member, and flows in a second direction opposite to the first direction in the second wiring member.

A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.

An integrated device package sized and shaped to fit in a small space, such as within a body lumen or cavity of a human patient, is disclosed. The integrated device package includes a package substrate and integrated device dies. The first and second integrated device dies are angled relative to one another about the longitudinal axis by a fixed non-parallel angle.

A chip on film assembly, a display panel, and a display module are disclosed. The chip on film assembly includes a substrate, an input terminal disposed on a first end of the substrate, a plurality of output terminals disposed on a second end of the substrate, wherein the second end is opposite to the first end, and a plurality of driving chips disposed on a surface of the substrate. The driving chips are electrically connected to the input terminal and are electrically connected to the output terminals by one to one, so space utilization of chip on films (COFs) can be improved, and a problem of insufficient COF bonding spaces for high-resolution products can be solved.

A semiconductor device with redistribution layers formed utilizing dummy substrates is disclosed and may include forming a first redistribution layer on a first dummy substrate, forming a second redistribution layer on a second dummy substrate, electrically connecting a semiconductor die to the first redistribution layer, electrically connecting the first redistribution layer to the second redistribution layer, and removing the dummy substrates. The first redistribution layer may be electrically connected to the second redistribution layer utilizing a conductive pillar. An encapsulant material may be formed between the first and second redistribution layers. Side portions of one of the first and second redistribution layers may be covered with encapsulant. A surface of the semiconductor die may be in contact with the second redistribution layer. The dummy substrates may be in panel form. One of the dummy substrates may be in panel form and the other in unit form.

An integrated circuit package provides a high bandwidth interconnect between wafers using a very high density interconnect using a silicon bridge or a multi-layer flex between wafers. In some embodiments, more than one wafer may be mounted and connected with a rigid silicon bridge onto a common substrate. This common substrate can be matched, with respect to their coefficients of thermal expansion (CTE), to the silicon wafer. The CTE matched substrate can reduce the thermal mechanical stress on the wafers and the rigid silicon bridge interconnect. In some embodiments, a thinned silicon bridge is utilized to interconnect wafers which are mounted on separate glass substrates. The thinned bridge would allow for mechanical compliance between the wafers. In some embodiments, the wafers can be mounted onto separate glass substrates and attached with a fine pitch multi-layer flex structure which provides compliance between the wafers.