An integrated circuit semiconductor die is arranged on a substrate having electrically conductive leads. Electrical coupling of the semiconductor die is provided via electrically conductive ribbons having a first end portion electrically coupled to the semiconductor die and a second end portion electrically coupled to the lead. The first end portion of the electrically conductive ribbon is ultrasonically coupled (bonded) to the semiconductor die. The second end portion of the electrically conductive ribbon is coupled to the lead via electrically conductive material, such as film or tape or glue/solder paste added at the second end portion of the electrically conductive ribbon.

A package includes a functional chip configured to provide an electric function involving an electric current, and a sense chip configured to provide an electric sense signal which characterizes the electric current. The functional chip and the sense chip are physically separate chips.