Stacked semiconductor dies for semiconductor device assemblies and associated methods and systems are disclosed. In some embodiments, the semiconductor die assembly includes a substrate with a first opening in an inner portion and a second opening in an outer portion of the substrate. Further, the semiconductor die assembly can include a master die attached to a front side of the substrate, where the master die includes a first bond pad proximate to the first opening and a second bond pad proximate to the second opening. The first and second bond pads of the master die can be coupled with first and second substrate bond pads on a back side of the substrate, opposite to the front side, using first and second bonding wires extending through the first and second openings, respectively.

The present invention provides a small and thin semiconductor device. The semiconductor device flip-chip bonds a semiconductor chip 1 and a lead 6 via a metal bonding portion 5 and includes a sealing resin covering them. The metal bonding portion 5 is provided with a gold-rich bonding layer 5a on the side of a first electrode 3a of the semiconductor chip 1 and a gold-rich bonding layer 5b on the side of a second electrode 3b of the lead 6, and connection between the semiconductor chip 1 and the lead 6 is strengthened, so that the semiconductor device does not require an anchor portion.

An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.

Stacked semiconductor dies for semiconductor device assemblies and associated methods and systems are disclosed. In some embodiments, the semiconductor die assembly includes a substrate with a first opening in an inner portion and a second opening in an outer portion of the substrate. Further, the semiconductor die assembly can include a master die attached to a front side of the substrate, where the master die includes a first bond pad proximate to the first opening and a second bond pad proximate to the second opening. The first and second bond pads of the master die can be coupled with first and second substrate bond pads on a back side of the substrate, opposite to the front side, using first and second bonding wires extending through the first and second openings, respectively.

The present invention provides a small and thin semiconductor device. The semiconductor device flip-chip bonds a semiconductor chip 1 and a lead 6 via a metal bonding portion 5 and includes a sealing resin covering them. The metal bonding portion 5 is provided with a gold-rich bonding layer 5a on the side of a first electrode 3a of the semiconductor chip 1 and a gold-rich bonding layer 5b on the side of a second electrode 3b of the lead 6, and connection between the semiconductor chip 1 and the lead 6 is strengthened, so that the semiconductor device does not require an anchor portion.

An improved system for measuring current within a power semiconductor module is disclosed, where the system is integrated within the power module. The system includes a point field detector sensing a magnetic field resulting from current flowing in one phase of the module. A lead frame conductor may be provided to shape the magnetic field and minimize the influence of cross-coupled magnetic fields from currents conducted in other power semiconductor devices within one phase of the module. Optionally, a second point field detector may be provided at a second location within the module to sense a magnetic field resulting from the current flowing in the same phase of the module. Each phase of the power module includes at least one point field detector. A decoupling circuit is provided to decouple multiple currents flowing within the same phase or to decouple currents flowing within different phases of the power module.

Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.

A semiconductor device package having galvanic isolation is provided. The semiconductor device includes a package substrate having a first inductive coil formed from a first conductive layer and a second inductive coil formed from a second conductive layer. The first conductive layer and the second conductive layer are separated by a non-conductive material. A first semiconductor die is attached to a first major side of the package substrate. The first semiconductor die is conductively interconnected to the first inductive coil. A second semiconductor die is attached to the first major side of the package substrate. A first wireless communication link between the first semiconductor die and the second semiconductor die is formed by way of the first and second inductive coils.

Each of a plurality of semiconductor elements included in a semiconductor package includes a front-surface electrode being provided on a semiconductor substrate on a side opposite to a conductor substrate, a back-surface electrode being joined to the conductor substrate, a control pad configured to control current flowing between the front-surface electrode and the back-surface electrode, a frame being electrically connected to the front-surface electrode, a portion of the frame being exposed from a surface of a sealing material from which a lower surface of the conductor substrate is exposed, and a plurality of terminal blocks being electrically connected to a plurality of first pads, a portion of the plurality of terminal blocks being exposed from a surface of the sealing material, the surface being provided on a side opposite to the surface of the sealing material from which the lower surface of the conductor substrate is exposed.

An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.