A bonding apparatus according to the present embodiment includes a first holder and a second holder. The first holder holds a first substrate. The second holder includes a plurality of suction portions that suck a second substrate and that are arranged on concentric circles about a center of the second substrate substantially evenly. The second holder bonds the second substrate to the first substrate while opposing the second substrate to the first substrate. A first gas supply portion has a plurality of first gas supply ports to supply gas toward a bonding position between the first substrate and the second substrate. The first gas supply ports are provided to correspond to at least a part of outermost suction portions that are farthest ones of the suction portions from a center of the second holder, and are concentrically arranged on a circle about the center substantially evenly.

A system for applying thermal interface materials to components includes a supply of thermal interface material and a die. The die is operable for pushing against and/or removing a portion of the thermal interface material that is between the die and a corresponding one of the components. The portion of the thermal interface material is removed from the supply and applied to the corresponding one of the components.

In described examples, a microelectronic device includes a microelectronic die with a die attach surface. The microelectronic device further includes a nanoparticle layer coupled to the die attach surface. The nanoparticle layer may be in direct contact with the die attach surface, or may be coupled to the die attach surface through an intermediate layer, such as an adhesion layer or a contact metal layer. The nanoparticle layer includes nanoparticles having adjacent nanoparticles adhered to each other. The microelectronic die is attached to a package substrate by a die attach material. The die attach material extends into the nanoparticle layer and contacts at least a portion of the nanoparticles.

An applying method includes the following steps. Firstly, a conductive adhesive including a plurality of conductive particles and an insulating binder is provided. Then, a carrier plate is provided. Then, a patterned adhesive is formed on the carrier plate by the conductive adhesive, wherein the patterned adhesive includes a first transferring portion. Then, a manufacturing device including a needle is provided. Then, the needle of the manufacturing device is moved to contact the first transferring portion. Then, the transferring portion is transferred to a board by the manufacturing device.

A method of manufacturing a display device, includes: providing an adhesive tape including: an adhesive conductive layer on a base film, a cutting width corresponding to a width of an adhesive tape attaching area of a substrate and provided in plurality including cutting widths adjacent to each other along the base film, and an interval between the cutting widths adjacent to each other; within the interval, providing a plurality of half-cuts in the adhesive tape, to provide a multi-cut adhesive tape; and pressing the multi-cut adhesive tape to the substrate, at a first portion of the multi-cut adhesive tape which corresponds to the cutting width, to separate the first portion of the multi-cut adhesive tape from the base film and attach the first portion of the multi-cut adhesive tape to the substrate at the adhesive tape attaching area thereof.

A method of joining a surface-mount component to a substrate includes placing a piece of solder on top of the substrate and temporarily bonding the piece of solder to the substrate with at least one temporary bond. The method also includes placing a surface-mount component on top of the substrate with a bottom face of the surface-mount component facing the substrate. The surface-mount component has at least one lateral side. The method further includes positioning the surface-mount component with the at least one lateral side proximate the piece of solder, heating the substrate and the piece of solder to a joining temperature for a time sufficient for the solder to flow into an area between the bottom face of the surface-mount component and the substrate, and cooling the substrate and solder.

A light-emitting device includes a carrier, a light-emitting element and a connection structure. The carrier includes a first electrical conduction portion. The light-emitting element includes a first light-emitting layer capable of emitting first light and a first contact electrode formed under the light-emitting layer. The first contact electrode is corresponded to the first electrical conduction portion. The connection structure includes a first electrical connection portion and a protective portion surrounding the first contact electrode and the first electrical connection portion. The first electrical connection portion includes an upper portion, a lower portion and a neck portion arranged between the upper portion and the lower portion. The lower portion has a width is wider than of the upper portion.

A component-mounting device includes a mounting head, a discharging portion, and a paste receiving portion. The mounting head holds a component. The discharging portion applies paste by spraying to the component held by the mounting head. The paste receiving portion is provided on the mounting head and captures paste that has been discharged from the discharging portion and has failed to reach the component.

Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

This member connection method includes: a cutting step of forming cutting lines C in an adhesive layer at predetermined intervals at least in a width direction of an adhesive tape and making segments of the adhesive layer divided by the cutting lines C continuous at least in a lengthwise direction of the adhesive tape; a transfer step of disposing the segments to face a connection surface of one member to be connected, pressing a heating and pressing tool having an arbitrary pattern shape against the adhesive tape from a separator side and selectively transferring the segments to the one member to be connected; and a connection step for connecting another member to be connected to the one member to be connected via the segments transferred to the one member to be connected.