A wire bonding method, comprising the steps of: extending a length of bonding wire from a capillary to form a wire tail; deforming a point on the wire tail to form a weakened portion between the wire tail and a remainder of the bonding wire retained within the capillary; and retracting at least a portion of the wire tail including the weakened portion into the capillary prior to bonding the wire tail to at least one of a bonding pad and a substrate.

There is provided a bonding method capable of accurately positioning a bonding stage. According to an aspect of the present invention, a bonding method using a bonding apparatus including a rotation drive mechanism for rotating a bonding stage 1 about a -axis includes the steps of: (e) locking the bonding stage with respect to the -axis, and bonding a wire or bump onto a certain area of a substrate held on the bonding stage; (f) unlocking the bonding stage with respect to the -axis, and rotating the bonding stage about the -axis with the rotation drive mechanism; and (g) locking the bonding stage with respect to the -axis, and bonding a wire or bump onto a remaining region of the substrate.

A micro-coaxial wire has an overall diameter in a range of 0.1 m-550 m, a conductive core of the wire has a cross-sectional diameter in a range of 0.05 m-304 m, an insulator is disposed on the conductive core with thickness in a range of 0.005 m-180 m, and a conductive shield layer is disposed on the insulator with thickness in a range of 0.009 m-99 m.

A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of nickel or palladium and an adjacent 1 to 250 nm thick outer layer of gold, characterized in that the wire exhibits a total carbon content of 40 wt.-ppm.

A bonding tool for bonding two conductive plates in contact with each other by pressing the bonding tool against the two conductive plates while vibrating a bonding end portion thereof in a direction parallel to the conductive plates. The bonding end portion of the bonding tool includes a bonding base having an end surface, the end surface having a protrusion area that has two sides facing and parallel to each other in a first direction that is parallel to the end surface, a plurality of protrusions provided in the protrusion area of the end surface, and a suppression portion provided on the end surface along the two sides of the protrusion area. The bonding end portion is configured to vibrate in the first direction.

In an ultrasonic joining apparatus according to the present disclosure, an ultrasonic joining apparatus control board controls an operation of a lead set unit and a tension adjustment unit including a dancer roller to perform joining tension control processing. The joining tension control processing includes steps of: making a lead wire housing mechanism perform a rewinding driving of rewinding a lead wire in a lead cassette when the dancer roller reaches a lower limit adjustment position in a tension adjustment range; and making the lead wire housing mechanism perform a delivery driving of sending out the lead wire from the lead cassette when the dancer roller reaches an upper limit adjustment position in the tension adjustment range.

There is provided a bonding method capable of accurately positioning a bonding stage. According to an aspect of the present invention, a bonding method using a bonding apparatus including a rotation drive mechanism for rotating a bonding stage 1 about a -axis includes the steps of: (e) locking the bonding stage with respect to the -axis, and bonding a wire or bump onto a certain area of a substrate held on the bonding stage; (f) unlocking the bonding stage with respect to the -axis, and rotating the bonding stage about the -axis with the rotation drive mechanism; and (g) locking the bonding stage with respect to the -axis, and bonding a wire or bump onto a remaining region of the substrate.

The present invention relates to a wire coating apparatus capable of evenly coating an insulating thin film on the surface of a wire such as a bonding wire having a small diameter, and the wire insulating thin film coating apparatus according to the present invention comprises: a coating portion which coats the surface of the wire with the insulating thin film while being blocked from the outside; and a wire process setting portion which is installed to be movable to the inside and outside of the coating portion and on which the wire is wound while the inside and outside of the wire are exposed so that a coating process of the insulating thin film is performed in the coating portion.

An ultrasonic horn (50) includes: a vibration source part (53) to which an ultrasonic vibrator (58) is mounted; a tip end part (56) to which a capillary (18) is mounted; and an intermediate part (54) which is interposed between the tip end part (56) and the vibration source part (53) and propagates vibration generated by the ultrasonic vibrator (58) to the tip end part (56). The intermediate part (54) is formed with a single spiral hole (68) which is a hole penetrating in a radial direction of the ultrasonic horn (50) and advances in an axial direction as the spiral hole advances in a circumferential direction.

A wire bonding apparatus (100) includes a bonding stage (12), a bonding head (20), an XY driving mechanism (30), and a frame (50). The XY driving mechanism (30) includes: an X-direction guide (31) installed to the frame (50); an X-direction slider (32), supported by the X-direction guide (31) and moving in the X direction, an X-direction mover (41) being installed thereto; a Y-direction guide (33) installed to a lower side of the X-direction slider (32); and a Y-direction slider (34), supported by the Y-direction guide (33) and moving in the Y direction, the bonding head (20) being installed thereto. The XY driving mechanism (30) is installed to the frame (50), so that a portion of the Y-direction guide (33) is overlapped with a mounting surface (12a) of a bonding stage (12) above the mounting surface (12a) and behind the mounting stage (12) in the Y direction.