The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being beveled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.

The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being beveled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.

A display panel includes a substrate, light-emitting diodes, and a cured opaque encapsulant layer. The light-emitting diodes are disposed on a first surface of the substrate. The cured opaque encapsulant layer is disposed on the first surface and a side surface of the substrate, and surrounds the light emitting diodes. A second surface of the cured opaque encapsulant layer facing away from the substrate is a rough surface.

A display panel includes a substrate, light-emitting diodes, and a cured opaque encapsulant layer. The light-emitting diodes are disposed on a first surface of the substrate. The cured opaque encapsulant layer is disposed on the first surface and a side surface of the substrate, and surrounds the light emitting diodes. A second surface of the cured opaque encapsulant layer facing away from the substrate is a rough surface.

A light emitting device including a printed circuit board having a front surface and a rear surface, at least one light emitting source disposed on the front surface to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting source, in which the light emitting source includes a light emitting structure, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers an upper surface of the substrate and a fine concavo-convex part is formed on a surface of the molding layer exposed to the outside, and the molding layer has a first thickness to transmit at least a fraction of light emitted from the light emitting source, and includes a filler to change a direction of emitted light.

A light emitting device including a printed circuit board having a front surface and a rear surface, at least one light emitting source disposed on the front surface to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting source, in which the light emitting source includes a light emitting structure, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers an upper surface of the substrate and a fine concavo-convex part is formed on a surface of the molding layer exposed to the outside, and the molding layer has a first thickness to transmit at least a fraction of light emitted from the light emitting source, and includes a filler to change a direction of emitted light.

An LED module includes: a substrate having a main surface and a back surface which face in opposite directions from each other in a thickness direction; a first LED chip including a first electrode pad bonded to a surface facing the same direction as the main surface; a first wire having one end bonded to the first electrode pad; and a wiring pattern having a main surface electrode formed in the main surface, wherein the main surface electrode includes a first die pad portion which supports the first LED chip, and when viewed from the thickness direction, the first die pad portion includes a main pad portion to which the first LED chip is bonded and an auxiliary pad portion which protrudes from the main pad portion in a direction toward a position of the first electrode pad from the center position in the first LED chip.

A light emitting device for a display including first, second, and third LED stacks each including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; first, second, and third transparent electrodes in ohmic contact with the first, second, and third LED stacks, respectively; a first electrode pad disposed on the first conductivity type semiconductor layer of the third LED stack; a lower second electrode pad disposed on the third transparent electrode; first, second, and third bump pads disposed on the first LED stack and electrically connected to the first, second, and third LED stacks, respectively; and a common bump pad commonly electrically connected to the first, second, and third LED stacks, in which a lower surface of the first electrode pad is located at a different elevation from a lower surface of the lower second electrode pad.

A light emitting device for a display including first, second, and third LED stacks each including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; first, second, and third transparent electrodes in ohmic contact with the first, second, and third LED stacks, respectively; a first electrode pad disposed on the first conductivity type semiconductor layer of the third LED stack; a lower second electrode pad disposed on the third transparent electrode; first, second, and third bump pads disposed on the first LED stack and electrically connected to the first, second, and third LED stacks, respectively; and a common bump pad commonly electrically connected to the first, second, and third LED stacks, in which a lower surface of the first electrode pad is located at a different elevation from a lower surface of the lower second electrode pad.

A light emitting device including a light emitter to emit white lights having different color temperatures, and a base including a circuitry for supplying power to the light emitter, in which the light emitter includes light emitting units each including a light emitting diode to emit light having different peak wavelengths, the white lights are defined by light emitted from each of the light emitting units or a combination of light emitted from each of the light emitting units, white lights include a first white light having a first x-coordinate value equal to or greater than an x-coordinate of the color temperature 10000K, a second white light having a second x-coordinate value equal to or greater than an x-coordinate of the color temperature 1800K, and a third white light has a third x-coordinate value between the x-coordinates of the color temperature 1800K and 10000K.